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6817085 |
Method of manufacturing a multi-layer ferrite chip inductor array
A method of manufacturing a multi-layer ferrite chip inductor array including an element main body composed by laminating a ferrite layer and a conductor layer in such a manner that the laminated...
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6813829 |
Method for removing punched fragments and a method for producing an article by punching
In a method for removing punched fragments in a workpiece formed using a punch and a die, the workpiece, which is tightly attached to a stripper, is lifted without extracting the punch from the...
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6810579 |
Method for manufacturing membranes
A method for manufacturing membranes after having defined the button key position circuit and matrix layout under the conditions of without jumping and without generating ghost keys includes the...
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6807716 |
Method of manufacturing a composite vibrator
The present invention provides a composite vibrator that can maintain high sensitivity even when miniaturized. The composite vibrator includes tuning bar vibrators having the same length and...
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6808642 |
Method for producing multilayer substrate and electronic part, and multilayer electronic part
This invention has an object of providing a method for producing a multilayer substrate or an electronic part wherein decrease in the thickness has been enabled without causing the problem of...
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6807732 |
Methods for modifying inner-layer circuit features of printed circuit boards
Disclosed herein are methods for modifying an inner-layer circuit feature of a printed circuit board. A trimming point on the inner-layer circuit feature is identified using an x-ray inspection...
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6804881 |
Multilayer circuit board manufacturing process
A method for manufacture of a multilayer board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and...
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6804882 |
Method for manufacturing a coil device
A coil device includes terminal electrodes each including a bottom-surface electrode provided on a bottom surface of a flange, side-surface electrodes provided on side surfaces of the flange, and...
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6803528 |
Multi-layer double-sided wiring board and method of fabricating the same
Disclosed herein are multi-layer double-sided wiring boards having an insulating layer with an opening, conductive layers on both surfaces of the insulating layer and on the inside of the opening,...
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6802120 |
Method of manufacturing a printed wiring board having a non-through mounting hole
A method of manufacturing a printed wiring board, enabling insertion components to be mounted on both sides thereof, including: a) providing first and second copper-clad laminates, including plated...
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6799369 |
Printed circuit board and method for producing the same
A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base...
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6796028 |
Method of Interconnecting substrates for electrical coupling of microelectronic components
Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of...
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6796027 |
Method of manufacturing printed wiring board
A method of efficiently manufacturing a printed wiring board is provided. In this method, a metal thin film is formed on a substrate having a projection. Then, an initial circuit pattern is formed...
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6792667 |
Fully automatic process for magnetic circuit assembly
In accordance with the invention, a high quality magnetic device is produced without manual intervention by the step of providing a substrate including an aperture and conductive coil extending...
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6792679 |
Method of producing electrical connecting elements
A method of making electrical connecting elements includes a metallic thin film 15 is formed on a mold 11 having protrusions 12 complementary in shape to a conductor pattern to be formed; a...
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6789298 |
Finishing method for producing thin-laminate panels
Provided are thin-laminate panels (i.e., thin-laminate panels having dielectric layers of about 0.006 inches or less and conductive layers on either side of the dielectric layer), wherein the edges...
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6791036 |
Circuit elements using z-axis interconnect
Methods for producing circuit elements the resultant circuit elements, and methods for making circuits therefrom are disclosed. A precursor circuit element includes a first insulating layer with...
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6789308 |
Method of manufacturing flat antenna
A method of manufacturing a flat antenna is composed of the steps of entirely applying Ni plating to the front and back surfaces of a long metal sheet, bonding masking tapes to the front surface of...
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6787013 |
Biosensor
A spacer forming method for a biosensor that has a biosensor possessing a capillary sampling channel and electrical connecting tracks for the use of a specific portable meter. A pair of electrodes...
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6782610 |
Method for fabricating a wiring substrate by electroplating a wiring film on a metal base
The present invention relates to a method for fabricating a wiring substrate by forming an insulating film on a metal base having openings on the metal base at positions corresponding to metal...
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6782601 |
Method of making interactive information closure
A method of making an interactive information package, including an interactive information closure including a radio frequency identification device, contemplates that a microelectronics assembly...
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6782615 |
Method of surface-mounting electronic components
A plurality of electronic components having conductive connecting members are surface-mounted to a target surface of a circuit board by specifying terminal-forming areas that are each no greater...
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6779238 |
Method of manufacturing piezoelectric actuator
In a method of manufacturing a piezoelectric actuator there are provided a piece of piezoelectric material having piezoelectric bodies, a first piece of material having vibrational bodies, a second...
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6779262 |
Method for manufacturing a multilayer printed circuit board
A method for manufacturing a multilayer printed circuit board includes providing a core board, a composite foil including a carrier foil, a functional copper foil and a non-reinforced thermosetting...
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6779257 |
Method of making a flexible elongate member
A method of making a flexible elongate member includes the steps of providing a core wire having a proximal region and a distal region, attaching an electrical device to the distal region of the...
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6779246 |
Method and system for forming RF reflective pathways
The present invention provides for a system and two methods for forming RF reflective pathways. These pathways can form a radio frequency identification tag. A first method uses a thermal transfer...
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6779261 |
Integrated balun and transformer structures
A method for producing an on-chip signal transforming device. The method includes providing a substrate, and laying a first conductive layer above the substrate, wherein the first conductive layer...
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6775907 |
Process for manufacturing a printed wiring board
The present invention teaches a simplified process for fabricating high density printed wiring boards using a semi-additive process. Steps required to achieve this objective include adhering an...
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6775906 |
Method of manufacturing an integrated circuit carrier
A method of manufacturing an integrated circuit carrier includes providing a substrate. At least one receiving zone for an integrated circuit is demarcated on the substrate. A plurality of...
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6772514 |
Method of machining glass substrate and method fabricating high-frequency circuit
A method of machining a glass substrate by using a laser, in which a low-permittivity, low-dielectric-loss glass substrate capable of coping with mass production processes is made applicable as the...
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6772515 |
Method of producing multilayer printed wiring board
To provide a method of producing a multilayer printed wiring board that can be intended to have low-profile, light-weight and high-density wiring of a printed wiring board, and a multilayer printed...
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6772491 |
Manufacturing method for ceramic oscillator
A manufacturing method for a ceramic oscillator capable of controlling the oscillation frequency with a high accuracy is disclosed. In this method, a mother substrate is polarized, electrodes in...
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6769177 |
Method of producing ink-jet recording head
A method of producing an ink-jet recording head using ion milling is provided. The method includes the steps of forming a piezoelectric layer subsequent to an electrode layer on a substrate by...
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6769158 |
Method for making a piezo electric actuator
A piezo-electric printhead is formed from a first piezo-electric actuator disposed parallel to a second piezo-electric actuator. The first and second piezo-electric actuators have a shared inner...
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6766576 |
Method for producing a double-sided wiring board
The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via...
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6763581 |
Method for manufacturing spiral contactor
A spiral contactor for establishing an electric connection with a semiconductor device or an electronic part including a solder ball includes a spiral probe having a spiral shape, as viewed from...
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6763575 |
Printed circuit boards having integrated inductor cores
A process for forming printed circuit boards having integral inductor cores. According to the invention, a thin nickel layer is formed on a copper foil. The copper foil structure is then laminated...
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6757947 |
Method for manufacturing piezoelectric actuators and a piezoelectric actuator
A method for a parallel manufacturing of a plurality of piezoelectric actuators and a corresponding piezoelectric actuator utilize a plurality of thin foils composed of an unfired piezoelectric...
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6757970 |
Method of making multi-contact electrode array
A multicontact electrode array suitable for implantation in living tissue includes a distal end having multiple spaced-apart ring contacts or a pattern of spaced-apart electrode contacts carried on...
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6754952 |
Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated
A process facilitates manufacturing a multiple layer wiring board having therein a thin-film capacitor The process includes: forming a metallic film layer having a barrier metal layer and a metal...
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6751861 |
Printed circuit board manufacturing method
A method for manufacturing two kinds of printed circuit boards from one master board, comprises the steps of preparing the master board, forming slits on the master board to define a first circuit...
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6748635 |
Method of manufacturing piezoelectric thin film component
A method of manufacturing a piezoelectric thin film component utilizing seed crystals, such as crystals of titanium, as a crystal source on a bottom electrode. Crystals of piezoelectric material...
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6748652 |
Circuit board and method of manufacturing the same
Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined...
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6748650 |
Method for making a circuit assembly having an integral frame
A circuit assembly comprises a substrate comprising one or more conductors. An integral frame of frame elements supports the substrate. The frame elements spaced apart to expose intervening regions...
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6745464 |
Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board
Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and...
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6745463 |
Manufacturing method of rigid flexible printed circuit board
The present invention relates to a manufacturing method of rigid flexible printed circuit board. Inner layer circuit are etched on two side of a flexible basefilm and a flat cable for connecting...
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6742250 |
Method of manufacturing wiring substrate
A method for manufacturing a wiring substrate 1 includes a conductor layer forming step for forming a second conductor layer 29 , through electroless copper plating and copper electroplating, on...
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6742247 |
Process for manufacturing laminated high layer count printed circuit boards
The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder...
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6739046 |
Method for producing dendrite interconnect for planarization
A method is provided for connecting two conductive surfaces in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive surface, applying a...
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6739048 |
Process of fabricating a circuitized structure
A process of fabricating a circuitized structure is provided. The process includes the steps of providing an organic substrate having circuitry thereon; applying a dielectric film on the organic...
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