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7631423 |
Method and process for embedding electrically conductive elements in a dielectric layer
A method is provided for fabricating a multilayer printed circuit board, including embedded electrically conductive elements formed as part of the fabrication of the layers of the printed circuit...
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7621044 |
Method of manufacturing a resilient contact
Resilient spring contact structures are manufactured by plating the contact structures on a reusable mandrel, as opposed to forming the contact structures on sacrificial layers that are later...
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7610675 |
Method to produce a transponder
A method to produce a transponder comprises the steps of positioning a coil comprising at least one coil end in a predetermined coil position and holding all of said coil ends in a respective...
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7596864 |
Stacked module connector
A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire...
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7591069 |
Methods of bonding solder balls to bond pads on a substrate, and bonding frames
Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with...
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7581308 |
Methods of connecting an antenna to a transponder chip
Method of connecting an antenna wire to a transponder chip. A transponder chip in a recess in a substrate, and an antenna wire mounted to the surface of the substrate and having end portions...
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7581961 |
Method for preventing solder rise to electric contact and electric contact produced by the same
Method for preventing solder from rising to a portion of an electric contact when the electric contact is being soldered to a copper foil so as to extend therefrom. The portion is plated with a...
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7578056 |
Method of coating contacts on a surface of a flip chip
A method for encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal...
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7578057 |
Method of fabricating segmented contactor
A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted...
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7562428 |
Manufacturing an ink jet head
A manufacturing method that includes the steps of forming an actuator unit, disposing a metallic bond and a thermosetting resin; pressing the land and the terminal; and heating the metallic bond...
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7546682 |
Methods for repairing circuit board having defective pre-soldering bump
A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided,...
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7543372 |
Method of electrically connecting conductive railroad attachment
Disclosed is a method for forming electrical interconnections between railroad track components and signal conductors/lines. In one arrangement, an electrically conductive adhesive is utilized to...
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7536762 |
Method of manufacturing an ink-jet assembly
A method for manufacturing a board assembly comprises the steps of: tin-plating a first terminal and a copper-made second terminal that are formed on a circuit board; mounting an electronic...
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7493680 |
Method of fabricating airtight terminals
To provide an airtight terminal and a piezoelectric vibrator having a strong rigidity of a lead despite a small-sized constitution, and provide a method of fabricating an airtight terminal...
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7484293 |
Semiconductor package and manufacturing method therefor
A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a...
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7472477 |
Method for manufacturing a socket that compensates for differing coefficients of thermal expansion
The illustrative embodiments provide a method for manufacturing a socket and attaching the socket to a printed circuit board. Surface mounted contacts for a bottom surface of a socket are provided....
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7464459 |
Method of forming a MEMS actuator and relay with vertical actuation
A method of forming an actuator and a relay using a micro-electromechanical (MEMS)-based process is disclosed. The method first forms the lower sections of a square copper coil, and then forms a...
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7462939 |
Interposer for compliant interfacial coupling
In one aspect, the present invention provides interposers that can mechanically, electrically, and thermally interconnect first and second microelectronic components. An interposer in accordance...
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7434310 |
Process to reform a plastic packaged integrated circuit die
A process for reforming a plastic packaged integrated circuit die ( 100 ) includes grinding away ( 305 ) a bottom side ( 210 ) of a plastic package ( 205 ) and portions of a set of leads ( 110 )...
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7421778 |
Method of making an electronic assembly
According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate....
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7421780 |
Methods for fabricating thermal management systems for micro-components
Methods for fabricating thermal management systems for micro-component devices are described herein. The methods may include initially overlaying a target substrate with a blank that is in sheet...
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7412767 |
Microprobe tips and methods for making
Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building...
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7409762 |
Method for fabricating an interconnect for semiconductor components
A method for fabricating an interconnect for testing a semiconductor component includes the steps of providing a substrate, and forming interconnect contacts on the substrate configured to...
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7401393 |
Method for removing solder bumps from LSI
The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a...
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7386936 |
Method for manufacturing in electrically conductive pattern
The present invention relates to a method for manufacturing an electrically conductive pattern by printing a layer comprising metal oxide on a carrier substrate ( 2 ) and reducing the metal oxide...
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7380338 |
Circuit board and manufacturing method thereof
A circuit board includes a substrate, an insulating layer, at least one protrusion, and a first circuit layer. The insulating layer is disposed on the substrate and has at least one...
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7367116 |
Multi-layer printed circuit board, and method for fabricating the same
To provide an interlayer-connected, multi-layer flexible printed circuit board having high bonding reliability and most suitable for micropatterning the circuit layers in the device; and to provide...
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7362562 |
Electronic unit of radio system and method of producing the same
The invention relates to a method of producing an electronic unit of a radio system automatically, an electronic unit of a radio system and an electronic component. The method of producing an...
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7350293 |
Low profile ball-grid array package for high power
A low-profile, high power ball grid array, or land grid array, device including a plastic tape having first and second surfaces, a portion of the first surface covered with an adhesive layer. First...
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7340826 |
Method for producing an electronic device connected to a printed circuit board
A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board...
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7335571 |
Method of making a semiconductor device having an opening in a solder mask
A method for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one...
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7325301 |
Method of manufacturing a wiring board
A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a...
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7325302 |
Method of forming an interconnection element
A method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure...
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7316062 |
Solder extraction tool and method
Methods and apparatus are provided for removing plating from a device. The method and apparatus may be used for preparing an electrical connector for connecting at least one wire or other terminus...
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7310874 |
Method for manufacturing a potassium niobate deposited body
A potassium niobate deposited body includes a substrate, an electrode layer formed above the substrate, and a potassium niobate layer formed above the electrode layer. The potassium niobate layer...
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7287322 |
Lithographic contact elements
A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a...
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7287312 |
Method of manufacturing a magnetic head device
A manufacturing method of a magnetic head device includes a preheating step of irradiating a laser beam to terminal pads of a magnetic head slider and to connection pads of a lead conductor member...
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7287323 |
Materials and structure for a high reliability BGA connection between LTCC and PB boards
A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers...
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7278206 |
Method of preparing terminal board
A terminal board having a plurality of terminals on which ball electrodes are formed can be prepared efficiently and economically without having any short-circuiting between terminals when its...
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7275315 |
Method for repair soldering of multi-pole miniature plug connectors
A method for repair soldering of multi-pole miniature plug connectors on printed circuit boards, having signal contact pins in the SMT design and shroud pins in the THR design. The plug connectors...
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7269896 |
Method for connecting multiple coaxial cables to a PCB
A method and apparatus for connecting a plurality of coaxial cables to a printed circuit board in a compact connector. The apparatus is generally comprised of a flexible carrier, means for...
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7260890 |
Methods for fabricating three-dimensional all organic interconnect structures
The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided liquid crystalline polymer LCP...
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7262076 |
Method for production of semiconductor package
A method for production of a semiconductor package which enables uniform conduction processing for all through holes covered by the conduction processing without being limited to any specific...
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7257891 |
Method for forming bonding pads
A method for forming bonding pads on a printed circuit board (PCB) with circuit patterns is provided. A plurality of copper patterns are formed on the PCB which are electrically connected to the...
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7254876 |
Method for manufacturing a piezoelectric resonator
A piezoelectric resonator is assembled so that a gap is formed between a resonator element and a plug using a connecting layer formed with a conductive resin, with flattened leads having leading...
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7249413 |
Method for manufacturing inkjet printing head
A method of manufacturing an ink jet printing head includes: forming a first laminated structure by laminating at least two metal plates having a hole formed thereon and fixing the metal plates to...
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7249411 |
Methods for mounting surface-mounted electrical components
Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component...
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7240426 |
Equipment for bonding printed circuit boards
Equipment for bonding a flexible printed circuit board made of thermoplastic resin on a printed circuit board includes a heater and a jig. The heater head presses and heats the flexible printed...
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7237331 |
Electronic part manufacturing method and electronic part
Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical...
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7237333 |
Surface mount captive screw ferrule for PCB
A method and apparatus for holding a screw captive to a printed circuit board (PCB), with a channel formed through the apparatus and a mounting hole formed through the PCB being in alignment to...
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