|
Match
|
Document |
Document Title |
|
|
5533665 |
Method of making a printed circuit board with adaptor pins
An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with...
|
|
|
5534127 |
Method of forming solder bumps on electrodes of electronic component
A solder bump 3a is formed on an electrode 2 provided on a printed circuit board 1. First, a core 3 is formed on the electrode 2. Then, solder paste 3' is coated on the core 3 so as to cover an...
|
|
|
5531021 |
Method of making solder shape array package
A surface mount package for an electronic device has an array of solder shapes or structures projecting from the bottom surface of the package. The solder structures are cast in place on the...
|
|
|
5527992 |
Cavity down mounting seam-welding ceramic package for semiconductor device
A metal cap involved in a cavity down mounting package to be subjected to a seam welding with at least a roller electrode, wherein the metal cap has a square like external shape with four corners...
|
|
|
5525204 |
Method for fabricating a printed circuit for DCA semiconductor chips
Fabricating a printed circuit by forming layers of metallization in a predetermined sequence, where each layer is formed in a predetermined pattern, with a layer of plating formed at selected...
|
|
|
5517755 |
Method for making a litz wire connection
A litz wire connector assembly and method is set forth. A length of litz wire includes a plurality of individually isolated wire strands. An end portion of the litz wire includes non-insulated end...
|
|
|
5517059 |
Electron and laser beam welding apparatus
A method and apparatus for electron or laser beam welding of semiconductor subassemblies to larger terminal members, without exposing semiconductor chips in such subassemblies to detrimental...
|
|
|
5502889 |
Method for electrically and mechanically connecting at least two conductive layers
A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed....
|
|
|
5497546 |
Method for mounting lead terminals to circuit board
Load terminals are mounted to a circuit board by providing a solder layer on each lead terminal and on each conductive inner wall surface of respective holes formed in the circuit board. The lead...
|
|
|
5497545 |
Method of making electrical connections in the manufacture of wiring sheet assemblies
A multi-layer wiring assembly including a stack of insulating layers, e.g. of polyimide, alternating with wiring patterns, typically of copper. To establish the circuit pattern, successive wiring...
|
|
|
5495667 |
Method for forming contact pins for semiconductor dice and interconnects
A method for forming contact pins adapted to form an electrical connection with a mating contact location is provided. In a first embodiment, the contact pins are formed on an interconnect used for...
|
|
|
5496775 |
Semiconductor device having ball-bonded pads
An integrated circuit (IC) device comprises towers of bonded gold balls located on each bond pad. The towers allow for early encapsulation of the IC die. The IC can then be tested and attached to...
|
|
|
5479703 |
Method of making a printed circuit board or card
A multi-layer printed circuit board or card including a plurality of circuitized power cores, the circuitized power cores include a layer of an electrically conductive material having a layer of...
|
|
|
5476211 |
Method of manufacturing electrical contacts, using a sacrificial member
A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the...
|
|
|
5450286 |
Printed circuit having a dielectric covercoat
A printed circuit assembly includes a rigidizer having first and second opposing surfaces, a silicone bonding agent disposed over a first surface of the rigidizer, a flex circuit having first and...
|
|
|
5448016 |
Selectively coated member having a shank with a portion masked
A member having a shank is selectively coated with a material such as a metal by loosely sliding a washer made of a material such as a thermoplastic or thermosetting polymer onto the shank,...
|
|
|
5442852 |
Method of fabricating solder ball array
A method for manufacturing an electronic module comprising a substrate carrying circuitry and one or more integrated circuits and having an array of closely spaced solder balls electrically...
|
|
|
5441429 |
Solder-bearing land
A solder-bearing lead adapted to be soldered to a conductive surface comprises an elongated body portion having a solder-bearing portion, a terminal portion, and a middle portion disposed between...
|
|
|
5426849 |
Method of producing a polyimide multilayer wiring board
A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base...
|
|
|
5421081 |
Method for producing electronic part mounting structure
A method for producing an electronic part mounting structure in which electronic parts such as IC packages are electrically connected to the surface of a printed circuit board utilizes a...
|
|
|
5410807 |
High density electronic connector and method of assembly
There is disclosed a high density electronic connector assembly (system) having a first insulating portion and a second insulating portion adapted to be mated together and held in precise...
|
|
|
5406701 |
Fabrication of dense parallel solder bump connections
A method and product are disclosed in which multiple solder bumps on a first planar surface are guided into engagement with terminals on a second planar surface by means of holes formed (by a...
|
|
|
5405272 |
Laser weldable hermetic connector
Electrical connectors are provided for enabling electrical access through a side wall of a microelectronic, sensor, or fiber optic package housing while maintaining hermeticity. These connectors...
|
|
|
5404637 |
Method of manufacturing multilayer printed wiring board
A method of manufacturing a printed wiring board. A printed wiring board having a substrate and a circuit pattern formed thereon is provided. At least one through-hole is formed in the substrate. A...
|
|
|
5403776 |
Process of using a jig to align and mount terminal conductors to a semiconductor plastic package
A process of manufacturing semiconductor device accommodated in a package including a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal...
|
|
|
5386626 |
Method for manufacturing a circuit board with a plurality of conductive terminal pins
A method for manufacturing a circuit board with a plurality of conductive terminal pins includes the steps of: providing a bed with an array of receiving holes formed therein; providing the bed on...
|
|
|
5381598 |
Method of preparing a large-current printed circuit board
A method of preparing a large-current printed circuit board comprises inserting a fastener with a bottom flange in a through-hole formed in a printed circuit board so that the bottom flange is...
|
|
|
5379512 |
Method for bonding a flexible cable to an electrical component
A method for bonding the ends of the conductors 52 to circuit pads 54 is disclosed whereby the cable 20 is placed over the circuit pads 54; a bonding tool 44 is pressed against an upper surface 58...
|
|
|
5376026 |
Method of mounting a tab type male terminal and an assembly of tab type male terminals
A tab type male terminal intended for circuit board mounting comprising a body of terminal tab and mounting legs provided integrally with the terminal tab body to extend through respective terminal...
|
|
|
5357674 |
Method of manufacturing a printed circuit board
A method of manufacturing a printed circuit board (PCB) for interconnecting integrated circuit devices includes a lead frame sandwiched between two multilayer substrates. Integrated circuit devices...
|
|
|
5347711 |
Termination of multi-conductor electrical cables
A carrier, or transfer frame, includes a pair of support portions located on opposite sides of an opening defined by the frame to receive portions of individual conductors of a cable, with the...
|
|
|
5339519 |
Method of cooling an electrical device using a heat sink attached to a circuit board containing heat conductive layers and channels
A method of attaching a heat sink to a circuit board for cooling an electrical device mounting system employing a plurality of heat conductive layers embedded in a printed circuit board where heat...
|
|
|
5320541 |
Electrical connector having terminals which cooperate with the edge of a circuit board
An electrical connector has first terminals which are surface mounted to respective sides of a substrate and second terminals which extend through an edge surface of the substrate to make...
|
|
|
5307929 |
Lead arrangement for integrated circuits and method of assembly
A lead arrangement is provided having a number of leads to be mechanically and electrically connected to a substrate. Retaining means are also provided integral with the lead arrangement to hold...
|
|
|
5306664 |
Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device
A bump electrode of an inexpensive and reliable semiconductor device is provided in which a remaining metal wire portion produced during bump electrode formation is eliminated. The remaining metal...
|
|
|
5303466 |
Method of mounting surface connector
A surface mounting method for mounting an electronic part having a great number of contacts onto a circuit board. A jig provided with dummy contacts is prepared whose size, number and arrangement...
|
|
|
5290423 |
Electrochemical interconnection
Processes for fabricating electrochemical interconnections between semiconductor chip pads and substrate pads. First, pads on a substrate are electrically shorted by depositing a film of conductive...
|
|
|
5283948 |
Method of manufacturing interconnect bumps
A method of manufacturing interconnect bumps on electrical connectors is disclosed. The interconnect bumps are formed with mechanically interlocking structure which allows the bumps to reach a...
|
|
|
5277596 |
Method of producing a card edge mounted connector and the resulting assembly thereof
This invention is directed to a method of aligning an electrical receptacle assembly having plural electrical terminals projecting therefrom along only one side of the assembly to the edge of a...
|
|
|
5263246 |
Bump forming method
In order to minimize the size of an aluminum pad in a method of forming a bump, a metal wire is wedge-bonded on the aluminum pad, a necessary amount of the wire is left on the aluminum pad, and the...
|
|
|
5245509 |
Printed circuit board arrangement with surface-mounted connector strip and a method for manufacturing the arrangement
The invention relates to a printed circuit board disposed on a film serving as the carrier material. A connector strip having a large number of connection pins is disposed on the printed circuit...
|
|
|
5239748 |
Method of making high density connector for burn-in boards
A method for the construction of a high density electrical connector for connecting a printed circuit board with a burn-in board in a burn-in system. The method comprises the steps of attaching a...
|
|
|
5241134 |
Terminals of surface mount components
The prior art terminal for making a solder bond between a lead and a bond site is modified so as to enhance the reliability of the solder bond. In one embodiment, this modification entails solder...
|
|
|
5234149 |
Debondable metallic bonding method
One or more metallized chip terminals of an electronic device, such as an integrated circuit chip or a laser chip, in one embodiment are temporarily bonded to one or more metallized substrate pads...
|
|
|
5218759 |
Method of making a transfer molded semiconductor device
A method of making a pad array chip carrier package is disclosed. A semiconductor device (10) is bonded to a ceramic substrate (12). The semiconductor device may be attached to the substrate by...
|
|
|
5217922 |
Method for forming a silicide layer and barrier layer on a semiconductor device rear surface
A method of manufacturing a semiconductor device wherein the back surface of a semiconductor chip is adhered closely to a substrate or a seal member through a soldering material or the like, and a...
|
|
|
5210937 |
Method of forming a telephone line overvoltage protection device
A telephone line overvoltage protection device and a method of forming an overvoltage protection device are provided. A first terminal guard housing defines a plurality of terminal receiving...
|
|
|
5203078 |
Printed wiring board for IC cards
This invention relates to a printed wiring board (10) for IC cards to be built in or fitted to a contact type IC card, that is, an IC card having external contact terminals. The present invention...
|
|
|
5199889 |
Leadless grid array socket
An interconnection system for connecting leadless grid arrays of integrated circuits with leadless grid arrays of printed circuit boards. The system includes an insulative socket, flexible...
|
|
|
5196652 |
Wireless electrical connections of abutting tiled arrays
A method for electrically connecting planar element substrates (12) to form an array (10) by forming conductive bridges (16) between metal pads (14) located on the surface of array elements (12)....
|