|
Match
|
Document |
Document Title |
|
|
6457233 |
Solder bonding method, and process of making electronic device
A solder bonding method comprises the step of solder bonding a first electrode 30 to a second electrode 16 having a solder bump 18 of mainly Sn formed on the upper surface thereof. The first...
|
|
|
6449836 |
Method for interconnecting printed circuit boards and interconnection structure
In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive...
|
|
|
6446335 |
Direct thermal compression bonding through a multiconductor base layer
A method of thermal compression bonding conductors of a multiconductor flat cable or electrical component by melting through a base layer from the reverse side of a base layer supporting the...
|
|
|
6442831 |
Method for shaping spring elements
Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by using a shaping tool ( 512 ) to...
|
|
|
6421912 |
Method of making an electrical connector
A method of making an electrical connector having a housing ( 2 ) and a plurality of contact elements with connection sections ( 4 ) projecting from the housing, which comprises filling a regular...
|
|
|
6414248 |
Compliant attachment interface
Parallel surfaces are interfacially mechanically bonded and optionally electrically, and/or thermally connected using an interposer fabricated from a flexible laminates, such as flex PWB. The...
|
|
|
6408511 |
Method of creating an enhanced BGA attachment in a low-temperature co-fired ceramic (LTCC) substrate
A method for providing an enhanced ball grid array attachment in low-temperature co-fired ceramic (LTCC) substrate is provided. A termination cup is formed in a substrate. The termination cup has a...
|
|
|
6397460 |
Electrical connector
In a socket used to house semiconductor die during testing, a recessed socket contact is provided that avoids pinching the die's contacts. Also provided are socket contacts that allow for smaller...
|
|
|
6397465 |
Connection of electrical contacts utilizing a combination laser and fiber optic push connect system
A method is provided for the solderless electrical connection of two contact elements by using a laser light beam attached to a fiber optic system which directs the light to the spot to be bonded....
|
|
|
6389691 |
Methods for forming integrated redistribution routing conductors and solder bumps
A method for forming routing conductors and solder bumps on a microelectronic substrate includes the steps of forming an under bump metallurgy layer on the substrate and forming a solder structure...
|
|
|
6392301 |
Chip package and method
A semiconductor device package includes multiple build-up layers of metal sandwiching non-conductive layers. The metal layers include apertures, or degassing holes. A manual method and a...
|
|
|
6385845 |
Wiring structure and method for wiring electrical wire on base member
A wiring method for an electrical wire 3 is provided. In the resultant wiring structure, an insulating base member 11 is provided with a plurality of projections 12 formed along a designated...
|
|
|
6357112 |
Method of making connection component
A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to...
|
|
|
6351884 |
Process for manufacturing printed circuit boards and process for connecting wires thereto
A printed circuit board with at least one component part as a measuring resistor, heat resistor or measuring electrode arrangement has at least two contact pads connected with conductor paths for...
|
|
|
6352915 |
Method for manufacturing semiconductor package containing cylindrical type bump grid array
A method for manufacturing a semiconductor package comprising the steps of (a) forming a plurality of bumps on a metal frame and a bridge for connecting and supporting the bumps, (b) coating liquid...
|
|
|
6336269 |
Method of fabricating an interconnection element
Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then...
|
|
|
6328577 |
High density electric connector set
An electric connector is provided which can be highly accurately positioned to a location to be aligned. An electric connector set comprises a pair of insulating housings 10, 10a so formed as to...
|
|
|
6321976 |
Method of wire bonding for small clearance
A method of wire bonding for small clearance employs a conductive bump over the pad of a chip to prevent a capillary from colliding with the chip during three-dimensional package wiring process....
|
|
|
6317974 |
Methods for creating wear resistant contact edges
A method of making a contact having a wear resistant edge by forming a photoresist layer on a copper clad polyimide composite structure, patterning the photoresist layer to expose a portion of the...
|
|
|
6314641 |
Interconnect for testing semiconductor components and method of fabrication
An interconnect for testing semiconductor components contained on a substrate, such as dice on a wafer, or chip scale packages on a panel is provided. Also provided is a test system employing the...
|
|
|
6313999 |
Self alignment device for ball grid array devices
An apparatus which aligns a ball grid array (BGA) device over a substrate. The apparatus preferably includes a cup-shaped member for cupping and holding the solder balls of the BGA device, and an...
|
|
|
6296534 |
Encapsulated electrical adapter assembly and method of producing the same
An electrical adapter assembly (1) comprises an adapter plate (16), and first and second electrical connectors (12, 14) mounted onto opposite first and second surfaces (165, 166) of the adapter...
|
|
|
6282094 |
Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same
A BGA (Ball-Grid Array) IC package with an unembedded type of heat-dissipation structure is proposed. The unembedded type of heat-dissipation structure is characterized in that a plurality of...
|
|
|
6279227 |
Method of forming a resilient contact structure
An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The...
|
|
|
6272741 |
Hybrid solder ball and pin grid array circuit board interconnect system and method
A circuit board interconnect system includes a carrier board with a hybrid solder ball and pin grid array. A plurality of electrically conductive pins extend through the carrier board and are...
|
|
|
6256879 |
Compression connector
A connector utilized to electrically connect together conductive pads disposed on different substrates includes a flexible substrate having a plurality of conductive through-holes therein. A...
|
|
|
6255581 |
Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace
A surface mount technology compatible electromagnetic interference (EMI) gasket assembly includes an electrically conductive gasket material, a solderable electrically conductive support layer, and...
|
|
|
6253451 |
Method for mounting a panel-like device on a printed circuit board
An electrical connector which includes an insulative body which has a leg portion and a top portion which extends generally perpendicularly from the leg second portion. A conductive contact which...
|
|
|
6249963 |
System and method for coupling conductive pellets to a component of an integrated circuit
A system (10) for coupling conductive pellets (40) to a component (12) of an integrated circuit has a substantially planar ribbon (14) that includes a conductive material. A punching apparatus (16)...
|
|
|
6243944 |
Residue-free method of assembling and disassembling a pressed joint with low thermal resistance
A method of assembling a pressed joint between an integrated circuit module and a temperature regulating unit includes the steps of: 1) providing the integrated circuit module with a contact...
|
|
|
6237219 |
Method of mounting conductive ball
In a mounting apparatus for mounting conductive ball where a conductive ball 2 is picked up by vacuum to a suction hole 31a formed in the bottom of a suction head 31 for mounting on a workpiece, a...
|
|
|
6233818 |
Method and device for bonding a wire conductor
Process and device for the contacting of a wire conductor (113) in the course of the manufacture of a transponder unit arranged on a substrate (111) and comprising a wire coil (112) and a chip unit...
|
|
|
6230397 |
Method of constructing an electrical connector
A new electrical cryogenic connector system employs two printed circuit board type mating connectors (1 & 3), each containing a plurality of plated-on metal lines (5 & 6) running along the...
|
|
|
6226864 |
Process for producing printed circuit boards with at least one metal layer, printed circuit board and use thereof
A printed circuit board has a conductor path applied to a substrate having an electrically insulating surface, the conductor path preferably being constructed in the shape of a meander and...
|
|
|
6226862 |
Method for manufacturing printed circuit board assembly
Disclosed is a new process for electrically and mechanically joining arrays of conductors on flexible printed circuits and other flexible conductors including collated flat, flexible cables (FFCs)....
|
|
|
6227867 |
Method for performing double-sided SMT
A connector assembly comprises a straddle connector including a dielectric housing having a front face forming an island section and a rear face opposite the island section. Upper and lower rows of...
|
|
|
6223430 |
Breadmaker circuit board mounting method
An automatic breadmaker with improved thermal sensing, wiring, and a simplified assembly procedure. The breadmaker preferably includes a high voltage circuit board coupled to an interior wall of...
|
|
|
6223431 |
Method for providing an electrical ground connection between a printed circuit board and a metallic substrate
A method (100) for providing an electrical ground connection between a printed circuit board (700) and a metallic substrate (200) comprises the steps of: (i) providing an aperture (204) in the...
|
|
|
6225573 |
Method for mounting terminal on circuit board and circuit board
There are provided a coating step for coating solder paste (3) onto the circuit board (1), a superimposing step for superimposing a connecting end (4a) of a terminal (4) also having a...
|
|
|
6206272 |
Alignment weight for floating field pin design
An alignment weight is provided. The alignment weight includes a body of material having first and second opposing surfaces. A number of depressions are formed in the first surface. The depressions...
|
|
|
6205646 |
Method for air-wound coil vacuum pick-up, surface mounting, and adjusting
An air-wound, coil-type, passive inductor includes a surface which allows the coil to be picked-up using a vacuum probe of a head of a pick-an-place machine and the surface does not interfere with...
|
|
|
6207905 |
Glass-ceramic composition, circuit substrate using the same and manufacture method thereof
In the glass-ceramic composition, a weight ratio of a glass and a ceramic is 40 to 60:60 to 40. The glass is composed of 40 to 60 wt % of SiO 2 , 5 to 9 wt % of Al 2 O 3 , 1 to 10 wt % of B 2 O 3...
|
|
|
6202299 |
Semiconductor chip connection components with adhesives and methods of making same
A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than...
|
|
|
6199273 |
Method of forming connector structure for a ball-grid array
A ball-grid array connector structure for an electronic package in which the ball pitch can be reduced to increase the packaging density has a plastic substrate having at least one hollow...
|
|
|
6185812 |
Electrically heated window
A method of making an electrically heated window from at least two plies of transparent glazing material, at least one ply of interlayer material and an electrically resistant heating area device...
|
|
|
6178629 |
Method of utilizing a replaceable chip module
A replaceable chip module for electrically connecting one or more first circuit members to a second circuit member. The replaceable chip module includes a module housing has a plurality of device...
|
|
|
6176008 |
Jig for mounting fine metal balls
A jig for mounting fine metal balls to a semiconductor chip substrate or a circuit board is disclosed. A tray storing the metal balls is accommodated in a frame and constantly biased upward by...
|
|
|
6169664 |
Selective performance enhancements for interconnect conducting paths
In an integrated circuit, the conducting paths electrically coupling the electronic components can be fabricated to conform to conflicting physical property requirements. After formation of the...
|
|
|
6165595 |
Component mounting board, process for producing the board, and process for producing the module
A parts-packaging substrate comprising a metal wiring plate having a mask coated on its surface with several openings. This structure eliminates the need for a thick base formed of an insulating...
|
|
|
6166334 |
Plating process for fine pitch die in wafer form
Apertures in a tape formed on a substrate allow straight plating of solder bumps to heights above 4 mils. The solder bumps are combined with a lower density material to form an hourglass-shaped...
|