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7617600 |
Process of making an electronic circuit device having flexibility and a reduced footprint
An electronic circuit formed by removing only a baseboard from an electronic module. The electronic circuit may be formed by providing a baseboard made of a water-soluble material, applying a...
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7617599 |
Sensor packaging method for a human contact interface
Methods of packaging systems pressure-sensitive devices that are subject to human contact force are disclosed. The methods include coupling and attaching the sensing devices and at least one other...
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7603771 |
Method of manufacturing a combined multilayer circuit board having embedded chips
A method of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, and forming multiple outer conductive...
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7603769 |
Method of coupling a surface mount device
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
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7588965 |
Stencil and method for depositing material onto a substrate
A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.
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7584537 |
Method for making a microcircuit card
A method for mounting a microcircuit module in a card body to make the card non-detachable without damage includes fixing the module ( 22 ) in a cavity ( 12 ) of the card body ( 11 ) with a resin...
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7581312 |
Method for manufacturing multilayer flexible printed circuit board
A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder...
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7571541 |
Method of producing an inkjet printhead for an inkjet printer with a print engine controller
A method of fabricating a plurality of inkjet nozzles on a substrate. The method comprises the steps of: (a) providing a substrate having a plurality of trenches corresponding to ink inlets; (b)...
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7570135 |
Piezoelectric vibrator and method for producing the same, an oscillator, an electronic unit and a wave timepiece
A method is provided for producing a piezoelectric vibrator having an airtight terminal comprised of an annular stem, a lead disposed to pass through the stem and formed of a conductive material,...
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7552532 |
Method for hermetically encapsulating a component
A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises...
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7543373 |
Gel package structural enhancement of compression system board connections
A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of...
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7543372 |
Method of electrically connecting conductive railroad attachment
Disclosed is a method for forming electrical interconnections between railroad track components and signal conductors/lines. In one arrangement, an electrically conductive adhesive is utilized to...
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7516543 |
Method for manufacturing semiconductor component with a media channel
A semiconductor component includes a media channel and at least the following components: a semiconductor chip on a wiring substrate, electric connecting elements disposed between the semiconductor...
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7506436 |
Methods for making conforming shielded form for electronic component assemblies
The present invention provides a method for preparing a conforming shield enclosure for shielding a semiconductor device of an electronic component assembly comprising the steps of: (a) metalizing...
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7487586 |
Process for producing semiconductor device
A process for semiconductor device production by which the reliability of connection with bumps can be easily heightened with higher certainty. The process for producing a semiconductor device...
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7487585 |
Method of manufacturing a metal-ceramic circuit board
A metal-ceramic circuit board is characterized by being constituted by bonding on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal...
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7480988 |
Method and apparatus for providing hermetic electrical feedthrough
A method and apparatus suitable for forming hermetic electrical feedthroughs in a ceramic sheet having a thickness of ≦40 mils. More particularly, the method yields an apparatus including a...
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7478474 |
Method of manufacturing shielded electronic circuit units
A metallic film and a grounding pattern are surely connected to each other so as to achieve electrical shield of an electronic circuit unit. In an electronic circuit unit, the metallic film is...
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7475460 |
Method of producing an airtight terminal
A method for producing an airtight terminal having an annular stem, a lead passing through the stem and formed of a conductive material, and a filler for fixing the lead in the stem includes (1) a...
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7467464 |
Method of manufacturing a memory card
A method for manufacturing a multi media card comprises the steps of: providing a substrate, mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a...
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7454834 |
Method of fabricating semiconductor chip assemblies
A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a...
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7454831 |
Method for mounting an electronic element on a wiring board
An electronic element (a semiconductor chip) is joining on a wiring board with the active surface thereof facing up (die-bonding step). A slope linked from the surface of the wiring board to the...
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7448119 |
Method of producing a surface acoustic wave device
A method of producing a surface acoustic wave device includes a sacrificial-layer forming step of forming a sacrificial layer on a piezoelectric substrate so as to cover comb electrodes and...
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7426780 |
Method of manufacturing a power module
A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and...
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7421781 |
Method of forming a module component having a plurality of penetration holes
According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the...
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7420128 |
Electronic component embedded substrate and method for manufacturing the same
An electronic component embedded substrate and a method for manufacturing the substrate are disclosed. The electronic component embedded substrate includes a substrate main body and an electronic...
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7413482 |
Method for forming a connector assembly for use with an implantable medical device
A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more separately-formed sections which are mechanically joined together to form...
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7392581 |
Method for manufacturing a magnetic element
A plate member includes a frame portion ( 51 ) provided in a state of coupling both one end portion and other end portion and mounting terminal portions ( 44 ) protruding from the one end portion...
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7389581 |
Method of forming compliant contact structures
A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein....
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7389570 |
Surface acoustic wave device manufacturing method, surface acoustic wave device, and communications equipment
After electrode patterning on an electrode forming surface of a piezoelectric substrate 2 (FIG. 1 ( b )), a conductor layer is formed on an electrode non-forming surface of the piezoelectric...
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7377031 |
Fabrication method of semiconductor integrated circuit device
A method of fabricating a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include...
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7370406 |
Method of manufacturing a thin film structure
A thin film magnetic head is described, the magnetic head having an insulating layer and a protrusion which has an upper portion and a base portion, and the upper portion has an extended portion....
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7370402 |
Method for producing stator packs for long-stator linear motors of magnetic levitation railways
A method for producing stator packs for long-stator linear motors of magnetic levitation vehicles is described. At first steel sheets are stacked to form a sheet stack, cross members are inserted...
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7356920 |
Micro-machined structure production using encapsulation
Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the...
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7350281 |
Method of protecting a capacitor
An electric device includes an electric element, such as a wound film capacitor, with power input and output leads. The electric element includes a coating layer of parylene that provides moisture...
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7340828 |
Method for producing metal/ceramic bonding circuit board
There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required...
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7340826 |
Method for producing an electronic device connected to a printed circuit board
A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board...
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7335571 |
Method of making a semiconductor device having an opening in a solder mask
A method for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one...
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7332376 |
Method of encapsulating packaged microelectronic devices with a barrier
Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged...
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7331106 |
Underfill method
A process for selectively depositing a filled underfill material onto a die surface without covering solder bumps present on the die. The process entails microjetting a polymer matrix material, a...
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7305752 |
Method for fabricating an inductive coil
A method of fabricating an inductive coil having inner and outer winding portions formed from one or more metal sheets. The method includes wrapping a fiber strand around an outer surface of the...
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7302744 |
Method of fabricating an acoustic transducer array
A method that involves establishing the performance level of a proposed acoustic transducer array. Deriving a geometric shape for the array based on the established performance level. Selecting...
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7296350 |
Method for fabricating a drop generator
A method for fabricating a drop generator with a uniquely formed nonconductive mandrel, which when encapsulated with electroplated metal, shapes and defines the internal ink channel entails...
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7296345 |
Method for manufacturing a memory device
A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing...
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7294530 |
Method for encapsulating multiple integrated circuits
A device, such as an integrated circuit or an electronic circuit component is affixed to a substrate. A first encapsulation structure encases a first integrated circuit and has at least one groove...
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7287321 |
Multi-layer board manufacturing method
Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type...
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7278202 |
Method for making overlay surface mount resistor
A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to...
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7266882 |
Method of manufacturing a miniaturized three- dimensional electric component
Manufacturing of miniaturized three-dimensional electric components are presented, as well as components manufactured by the methods. The manufacturing methods comprise micro-replication of at...
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7246421 |
Method for manufacturing surface acoustic wave device
A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave...
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7240430 |
Manufacturing methods for printed circuit boards
A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of...
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