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7434309 |
Method and apparatus for supporting a circuit component having solder column interconnects using an external support
A circuit board assembly having a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA package has a substrate having an array of solder columns extending from a...
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7428777 |
Method of making a heatsink device
A method and device for thermal conduction is provided. Methods of forming heatsinks are provided that include advantages such as the ability to produce intricate detailed features that other...
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7415762 |
Interposer, method of fabricating the same, and semiconductor device using the same
An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor and an interposer portion provided around...
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7409761 |
Electronic component mounting apparatus and method of mounting electronic components
In an electronic component mounting process for mounting electronic components ( 6 ) to a substrate, each of the electronic components having an adhesive layer on a surface to be bonded to the...
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7401393 |
Method for removing solder bumps from LSI
The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a...
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7390735 |
High temperature, stable SiC device interconnects and packages having low thermal resistance
A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high...
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7377031 |
Fabrication method of semiconductor integrated circuit device
A method of fabricating a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include...
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7370411 |
Wiring board manufacturing method
A method of manufacturing a wiring board includes: forming a first insulating layer on a supporting board; mounting at least one reinforcing member on the first insulating layer; mounting at least...
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7368666 |
Surface-mounting type electronic circuit unit without detachment of solder
A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of...
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7367117 |
Electronic component mounting apparatus and electronic component mounting method
The invention prevents mismounting of an electronic component caused by missetting of a component feeding unit in an apparatus. A recognition process of an electronic component is performed...
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7363704 |
RFID tag and method of manufacturing RFID tag
A method of manufacturing an RFID tag includes forming through-holes on a sheet to embed a plurality of electronic components, such as IC chips; forming a substrate by sticking a bottom plate sheet...
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7360307 |
Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors
A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure...
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7357288 |
Component connecting apparatus
When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection...
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7356924 |
Manufacturing process for a power distribution assembly of an electrical system
A modular multi-component power distribution system is provided having a plurality of modular components which includes a bus-bar-like power distribution assembly (PDA), branching connectors, flex...
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7353598 |
Assembly comprising functional devices and method of making same
Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional...
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7352585 |
Flip chip heat sink package and method
An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors...
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7350298 |
Method for fabricating circuit board with conductive structure
A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second...
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7337534 |
SMD chip handling apparatus
The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart...
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7334323 |
Method of making mutilayered circuitized substrate assembly having sintered paste connections
A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder...
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7331106 |
Underfill method
A process for selectively depositing a filled underfill material onto a die surface without covering solder bumps present on the die. The process entails microjetting a polymer matrix material, a...
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7328504 |
Method for manufacturing circuit board with built-in electronic components
Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S...
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7319304 |
Shunt connection to a PCB of an energy management system employed in an automotive vehicle
A method of coupling a shunt to a printed circuit board (PCB) of an energy management system is provided. The method includes coupling flexible electrical connectors to the shunt and soldering the...
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7316062 |
Solder extraction tool and method
Methods and apparatus are provided for removing plating from a device. The method and apparatus may be used for preparing an electrical connector for connecting at least one wire or other terminus...
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7316061 |
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
According to one aspect of the invention, a method of constructing an electronic assembly is provided. A layer of metal is formed on a backside of a semiconductor wafer having integrated formed...
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7314819 |
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that...
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7313862 |
Method of mounting components on a PCB
A printed wiring board is disclosed. The printed wiring board includes a board recognition mark formed of a conductive foil, a first component land covered with resist, and a second component land...
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7301103 |
Printed-wiring board, printed-circuit board and electronic apparatus
A printed-wiring board having a multiplayer structure including a plurality of insulating layers and a plurality of conducting layers includes a signal pattern provided in at least one of outermost...
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7299546 |
Method for manufacturing an electronic module
An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer ( 1 ) and a conductive layer on the...
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7299530 |
Ball grid array rework using a continuous belt furnace
Disclosed is an apparatus for separating interconnects between, for example, a card and a substrate. The apparatus includes one or more rotationally biased (e.g., spring-loaded, etc.)...
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7296345 |
Method for manufacturing a memory device
A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing...
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7296336 |
Method to protect a GMR head from electrostatic damage during the manufacturing process
A simple method is provided for protecting slider mounted read/write transducers from electrostatic discharge damage during the manufacture of disk drives. The method involves placing a ball of...
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7287312 |
Method of manufacturing a magnetic head device
A manufacturing method of a magnetic head device includes a preheating step of irradiating a laser beam to terminal pads of a magnetic head slider and to connection pads of a lead conductor member...
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7284318 |
Apparatus for mounting semiconductor chips
An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a...
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7281322 |
Component mounting method
In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component...
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7278199 |
Method of making a thermoelectric device
In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective...
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7272889 |
Production method of suspension board with circuit
A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction....
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7269898 |
Method for making an edge intensive antifuse
An antifuse including a bottom plate having a plurality of longitudinal members arranged substantially parallel to a first axis, a dielectric layer formed on the bottom plate, and a top plate...
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7269895 |
Clamping case
Method and systems for clamping at least one circuit card within a case are provided. The method includes compressing axially at least one resilient element between a head of a shaft and a nut...
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7266887 |
Substrate transportation apparatus, component mounting apparatus and substrate transportation method in component mounting operation
A component-mounted substrate moved to a specified substrate position by a substrate holding-and-moving device is delivered from a top of the substrate holding-and-moving device to a substrate...
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7263768 |
Method of making a semiconductor device having an opening in a solder mask
The present invention features a novel design for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of...
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7263767 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Wiring board manufacturing method
A method of manufacturing a wiring board includes: forming a first insulating layer on a supporting board; mounting at least one reinforcing member on the first insulating layer; mounting at least...
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7263759 |
Methods of manufacturing and testing bonding wires
A method of making and testing an electronic device that includes providing first and second external pins, first and second pads on the substrate connected to the first external pin by respective...
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7254888 |
Method for manufacturing graphite-base heat sinks
A method of fabricating a heat sink includes preparing a surface of a graphite-based substrate and removing particulate matter generated from the preparation of the surface of the substrate. A...
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7254876 |
Method for manufacturing a piezoelectric resonator
A piezoelectric resonator is assembled so that a gap is formed between a resonator element and a plug using a connecting layer formed with a conductive resin, with flattened leads having leading...
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7251882 |
Method for assembling micro-components to binding sites
A support and a method for assembling micro-components to binding sites on the support are provided. The support has a pattern of electrical conductors adapted to conduct electrical energy between...
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7251880 |
Method and structure for identifying lead-free solder
A method and apparatus are provided for determining whether solder used during assembly of a printed circuit board is lead-free or not. This may include providing a pad on the printed circuit board...
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7249413 |
Method for manufacturing inkjet printing head
A method of manufacturing an ink jet printing head includes: forming a first laminated structure by laminating at least two metal plates having a hole formed thereon and fixing the metal plates to...
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7249411 |
Methods for mounting surface-mounted electrical components
Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component...
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7246434 |
Method of making a surface mountable PCB module
A printed-circuit board (PCB) module has co-planar solder pads on a bottom surface. The solder pads can be surface-mounted to pads on a main board, allowing the PCB module to be surface mounted...
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7246421 |
Method for manufacturing surface acoustic wave device
A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave...
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