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7607222 |
Method of manufacturing an electronic component package
An electronic component package and a manufacturing method thereof are disclosed. A method of manufacturing an electronic component package, which includes: forming a protrusion part on a first...
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7607221 |
Method of making an electronic device housing
An apparatus and methods are provided for housing an electronic device. In one implementation, a method of housing an electronic device includes positioning an electronic device on a base,...
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7607216 |
Method for manufacturing monolithic ceramic electronic component
A multilayer composite including a core made of a magnetic ceramic sintered compact disposed therein, and shrinkage restraining layers including an inorganic powder that is not substantially...
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7603769 |
Method of coupling a surface mount device
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
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7596841 |
Micro-electromechanical devices and methods of fabricating thereof
An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity...
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7594317 |
Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure
A method of manufacturing a wiring substrate including the steps of, obtaining a temporary substrate from a prepreg, and concurrently attaching a metal foil onto at least one surface of the...
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7591293 |
Device for bonding a metal on a surface of a substrate
A device and method for bonding objects to be bonded each having a metal bonding portion on a substrate, comprising cleaning means for exposing the metal bonding portions to a plasma having an...
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7591069 |
Methods of bonding solder balls to bond pads on a substrate, and bonding frames
Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with...
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7587816 |
Method of improving the stability of a circuit board
A printed circuit board includes a mounting hole for receiving a connector pin of either of a first SMC and a second SMC, and a signal line. The signal line is electrically connected to the...
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7584533 |
Method of fabricating an inductor structure on an integrated circuit structure
A damascene process is utilized to fabricate the segmented magnetic core elements of an integrated circuit inductor structure. The magnetic core is electroplated from a seed layer that is conformal...
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7578056 |
Method of coating contacts on a surface of a flip chip
A method for encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal...
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7571540 |
Production method of suspension board with circuit
A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a...
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7571536 |
Method of making capacitive/resistive devices
A method of making capacitive/resistive devices provides both resistive and capacitive functions. The capacitive/resistive devices may be embedded within a layer of a printed wiring board....
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7562444 |
Method for manufacturing a CPU cooling assembly
A CPU cooling assembly includes a copper cold plate in which a pattern of ultra thin fins and channels are formed, and a copper manifold-cover in which a series of alternating inlet and outlet...
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7562428 |
Manufacturing an ink jet head
A manufacturing method that includes the steps of forming an actuator unit, disposing a metallic bond and a thermosetting resin; pressing the land and the terminal; and heating the metallic bond...
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7552530 |
Method of manufacturing a PCB having improved cooling
An improved cooling of an electronic component loaded to a printed circuit board, wherein the PCB comprises at its upper side at least one electronic component, and at least one heat conducting...
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7552528 |
Wafer expanding device, component feeder, and expanding method for wafer sheet
In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second...
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7547613 |
Laser processing method and laser processing apparatus
A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work,...
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7546682 |
Methods for repairing circuit board having defective pre-soldering bump
A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided,...
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7543377 |
Perimeter matrix ball grid array circuit package with a populated center
A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a...
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7536762 |
Method of manufacturing an ink-jet assembly
A method for manufacturing a board assembly comprises the steps of: tin-plating a first terminal and a copper-made second terminal that are formed on a circuit board; mounting an electronic...
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7533457 |
Packaging method for circuit board
A method includes populating a circuit board with components, and encapsulating the circuit board and the components with a material. The method further includes separating the circuit board into a...
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7530166 |
Method for making a radio frequency coupling structure
Method for making a coupling structure ( 10 ) comprises the steps of forming a body ( 12 B) of a polymeric material loaded with a conductive filler, providing a coupling area ( 12 C) of a...
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7530163 |
Electronic parts packaging structure and method of manufacturing the same
There is provided a electronic parts packaging structure that includes a mounted body on which an electronic parts is mounted, the electronic parts having a connection pad, which has an etching...
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7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
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7523546 |
Method for manufacturing a composite layer for an electronic device
A method is provided for manufacturing an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate...
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7513035 |
Method of integrated circuit packaging
Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a...
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7513032 |
Method of mounting an electronic part to a substrate
A method of mounting an electronic part to a substrate, comprising: a substrate feed transporting step transporting the substrate 10 supplied to a substrate transport start position to a mounting...
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7506436 |
Methods for making conforming shielded form for electronic component assemblies
The present invention provides a method for preparing a conforming shield enclosure for shielding a semiconductor device of an electronic component assembly comprising the steps of: (a) metalizing...
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7503109 |
Method of mounting an electronic component
An apparatus for storing an electronic component, the electronic component having a first surface and an opposite second surface, the apparatus includes a first film having a pocket that stores the...
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7501752 |
Color image display unit
Light emitting devices formed in an array on a first substrate are transferred to an insulating material, to form a sheet-shaped device substrate. The sheet-shaped device substrate is cut along an...
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7500308 |
Method of detaching electronic component from printed circuit board
A printed circuit board unit includes an insulated film disposed between a printed circuit board and an electronic component so as to define a through hole. The through hole may be designed to form...
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7493690 |
Method of attaching electronic components to printed circuit board and attachment structure thereof
In a method of attaching an electronic component to a printed circuit board by a plurality of screws that are inserted into corresponding through holes cut in the board from a surface of the board...
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7493680 |
Method of fabricating airtight terminals
To provide an airtight terminal and a piezoelectric vibrator having a strong rigidity of a lead despite a small-sized constitution, and provide a method of fabricating an airtight terminal...
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7490403 |
Soldering method
In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead...
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7490402 |
Technique for laminating multiple substrates
The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on...
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7487586 |
Process for producing semiconductor device
A process for semiconductor device production by which the reliability of connection with bumps can be easily heightened with higher certainty. The process for producing a semiconductor device...
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7487585 |
Method of manufacturing a metal-ceramic circuit board
A metal-ceramic circuit board is characterized by being constituted by bonding on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal...
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7484293 |
Semiconductor package and manufacturing method therefor
A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a...
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7480989 |
Method for manufacturing pressure detector
A method for manufacturing a pressure detector includes the steps of: preparing a first member including a sensing portion, a second member including a pressure receiving diaphragm, and a pressure...
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7478473 |
Method of manufacturing an IC card
The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring...
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7476110 |
High density connector and method of manufacture
Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on...
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7475474 |
Method of making tamper detection circuit for an electronic device
A tamper protected printed circuit board assembly including a printed circuit board and a partially enveloping tamper wrap covering the entirety of the top surface of the printed circuit board and...
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7472477 |
Method for manufacturing a socket that compensates for differing coefficients of thermal expansion
The illustrative embodiments provide a method for manufacturing a socket and attaching the socket to a printed circuit board. Surface mounted contacts for a bottom surface of a socket are provided....
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7467468 |
Method for manufacturing an ink-jet head
A method for manufacturing an ink-jet head includes the step of forming, in a substrate, through holes respectively corresponding to conductors on one face of the substrate and each having its...
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7458151 |
Method of forming external electrode
The object of the invention is to provide a method of forming an external electrode of an electronic component whereby the external electrode can be formed in a stable fashion. In order to achieve...
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7451540 |
Method for fabricating a printed circuit board
Fabricating ( 100, 1300 ) a printed circuit board includes fabricating patterned conductive traces ( 305, 310, 1410, 1415 ) onto a foil, laminating the patterned conductive traces to a printed...
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7451539 |
Method of making a conformal electromagnetic interference shield
An electromagnetic shield for an electronic module includes a surface finish that is applied to the surface of an electronic module so as to minimize the size of the shield. Once the shield is in...
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7446412 |
Heat sink design using clad metal
Some aspects include a heat sink base, an upper metal cladded to an upper surface of the heat sink base, the upper metal defining at least one groove, and a heat sink fin disposed in the groove and...
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7444735 |
Process for manufacturing an integrated circuit system
A system for manufacturing an integrated circuit system having a substrate with a integrated circuit device. A first pad is formed on the substrate and connected to the integrated circuit device. A...
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