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6568054 |
Method of producing a multilayer electronic part
A method of producing a multilayer electronic part having the shape of a substantially rectangular parallelopiped is constituted which has a multilayer body formed by superposing coil conductors...
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6564452 |
Method for creating printed circuit board substrates having solder mask-free edges
A substrate for a plurality of electronic assemblies includes a strip of printed circuit board (PCB) material including a surface and a plurality of segments. Each segment is adapted to receive at...
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6566610 |
Stacking multiple devices using direct soldering
In one embodiment of the invention, a stacking element includes a printed circuit board (PCB) and a plurality of solder bumps. The PCB has a top side and a bottom side. The top side is attached to...
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6564454 |
Method of making and stacking a semiconductor package
Semiconductor packages and methods of making packages are disclosed. An exemplary method includes providing a printed circuit board having a first surface with circuit traces thereon, first...
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6560863 |
Method of producing wiring board
A method of producing a wiring board having a plurality of wiring layers each being located on an electrical insulation layer, in which an electrical insulation layer is formed on a substrate using...
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6560851 |
Method for producing an inductor
A method for producing an inductor having an internal conductor includes coating an internal conductor with a covering material, placing the internal conductor coated with the covering material in...
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6553658 |
Assembling a stacked die package
A method for assembling a multi-chip module does not necessitate more than one pass through a die attach machine. The method involves attaching a smaller die to a larger die without using a die...
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6553659 |
Electronic component mounting apparatus
Each of a plurality of suction nozzle sections 20 provided about the outer circumference of an intermittently rotating head section 21 comprises a plurality of nozzle tip sections 10 for...
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6550134 |
Electric-component transferring apparatus, method of taking images of electric components, and electric-component mounting system
An electric-component transferring apparatus including a component holder which holds an electric component, a shaft member whose lower end portion supports the component holder, a movable member...
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6546620 |
Flip chip integrated circuit and passive chip component package fabrication method
A package includes both a flip chip mounted active chip component and a passive chip component. To form the package, a solder paste is screened onto a passive chip component contact on an upper...
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6543114 |
Manufacturing system using solder self-alignment with optical component deformation fine alignment
A process for assembling micro-optical systems, such as optoelectronic and/or fiber optic components uses solder self-alignment to achieve a coarse, passive alignment of optical components relative...
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6543131 |
Microelectronic joining processes with temporary securement
A method of making microelectronic assemblies includes temporarily securing one or more microelectronic elements in place on one or more components using one or more temporary securements extending...
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6543129 |
Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connector
The present invention provides a method of forming a solder ball on a portion, e.g., one end, of a contact. In one exemplary embodiment, the contact is a terminal pin which is intended for use in...
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6545229 |
Method for producing circuit board assemblies using surface mount components with finely spaced leads
Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections...
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6539618 |
Ball grid array tool
A tool for removing ball grid array (BGA) packaged integrated circuit or multi-chip modules from printed circuit boards is comprised of a two-tined fork with a heated wire stretched between the...
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6539624 |
Method for forming wafer level package
A method for forming a wafer level package that is equipped with solder balls on a top surface and encapsulated by a stress buffer layer of an elastomeric material is disclosed. The method can be...
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6536105 |
Method for mounting conductive balls on a substrate
A conductive ball mounting equipment for mounting conductive balls on electrodes of a plurality of electronic components formed on a substrate, including a suction tool having a suction face to...
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6530148 |
Method for making a probe apparatus for testing integrated circuits
The present invention provides a method for sanding heads of buckling beam probes while the probes are disposed within a probe assembly between a lower die and upper die. Sanding provides that all...
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6531664 |
Surface mount devices with solder
A method for controlling the shape and height of solder connections of a surface mount circuit device, such as a flip chip, by way of controlling the manner and extent to which solder is able to...
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6526655 |
Angled flying lead wire bonding process
A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool;...
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6526654 |
Method of producing double-sided circuit board
The method comprises forming a plurality of wiring pattern layers on the front surface of a substrate. In the process of forming the wiring pattern layers, an insulator protection film keeps...
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6523235 |
Method of manufacturing a ceramic capacitor
A method of manufacturing a ceramic capacitor relates to a ceramic capacitor having metal plate terminals that absorb thermal stress and mechanical stress caused by flexure of the substrate. A...
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6519844 |
Overmold integrated circuit package
An integrated circuit package manufacturing process is described which reduces or eliminates the formation of voids in a molding compound between a die and an underlying substrate. The process...
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6519846 |
Chip size package and method of fabricating the same
A chip size package is disclosed herein, as well as a method for fabricating the same. A recess is formed in a surface of semiconductor chip. Bonding pads are formed on a bottom center of the...
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6519842 |
Method for mounting semiconductor device
Semiconductor devices can be mounted by the bump technique using compound metallic ultra-fine particles. Each particle comprises a core portion which is substantially a metallic component, with a...
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6519843 |
Method of forming a chip carrier by joining a laminate layer and stiffener
A cavity-type chip module. The module is formed with an adhesive joining layer of photoimageable material interposed between a metal stiffener and a laminate top layer with a central aperture...
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6516514 |
Method for mounting components onto a substrate
A method for mounting or equipping components onto substrates that utilizes a number of component mounting process areas. Each of the process areas includes a component mounting head member or...
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6516516 |
Semiconductor chip package having clip-type outlead and fabrication method of same
A semiconductor chip package having a clip type lead frame and fabrication thereof. The package includes a semiconductor chip having a plurality of bond pads thereon, a first package body having a...
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6516515 |
Semiconductor integrated circuit
A method for stabilizing the form of a letter S of an inner lead after bonding in a method of manufacturing μBGA·IC in which a chip is fixed via an insulating film on a tape carrier on one main...
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6517893 |
Method of manufacture of printed wiring boards having multi-purpose finish
A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish...
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6513236 |
Method of manufacturing bump-component mounted body and device for manufacturing the same
Bump components mounted on a circuit board on a supporting substrate is covered with a flexible separation wall. A pressure difference is provided between the inner and outer sides of the...
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6510606 |
Multichip module
Low temperature co-fired ceramic (LTCC) multichip modules are used to provide high density interconnects between electronic elements. A ceramic carrier includes a number of cavities which are sized...
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6505400 |
Method of making chip scale package with heat spreader
A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member which is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Dice...
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6502740 |
Soldering method
In order to solder a lead wire of an electronic device to a wiring pattern formed on a printed circuit board, the electronic device is first placed on a first face of the printed circuit board such...
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6499215 |
Processing of circuit boards with protective, adhesive-less covers on area array bonding sites
A method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a...
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6501664 |
Decoupling structure and method for printed circuit board component
A wiring lay-out is provided, for electrically connecting a decoupling cap on a front surface of a multilayer printed circuit board (e.g., a motherboard), with a surface-mounted electrical...
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6493932 |
Lidless socket and method of making same
A method of using a socket to electrically interconnect a microelectronic assembly having electrically conductive joining units and a substrate having electrically conductive contacts includes...
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6496384 |
Circuit board assembly and method of fabricating same
A circuit board assembly and method of fabricating an assembly are provided. The assembly preferably comprises a first circuit board defining an aperture and a second circuit board having an edge....
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6484394 |
Encapsulation method for ball grid array semiconductor package
An encapsulation method for a ball grid array (BGA) semiconductor package, includes: adhering one sided adhesive tape to an upper portion of the semiconductor package after performing a wire...
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6484393 |
Method for wire bonding to flexible substrates
A method of electrically connecting an electronic component to the flexible printed wiring board may comprise the steps of: Providing an air permeable platen having a substantially flat front...
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6481098 |
Method of manufacturing circuit boards
A method for manufacturing circuit boards at reduced cost includes the steps of producing a plurality of identical circuit board units on a big base plate at one time, so that each circuit board...
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6479755 |
Printed circuit board and pad apparatus having a solder deposit
A printed circuit board and a pad apparatus having a solder deposit formed on the pad apparatus by using a mask having a slit are provided. The slit has the same shape as the solder deposit. The...
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6473963 |
Method of making electrical circuit board
A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes is disclosed. The method includes forming channels in a first and second pre-circuit...
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6467162 |
Method for mounting devices on a printed circuit board despite misalignment of resist
A printed circuit board includes a first mark 2 formed by a thin conductor, a second mark 3 formed by a resist 8, a land 6 which is partially coated by the resist 8 and a land 7 which...
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6467139 |
Mounting structure and mounting method for surface acoustic wave element
A functional surface of a surface acoustic wave element is disposed to face a mount surface of a circuit board on which the surface acoustic wave element is to be mounted. A gap between the...
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6463653 |
Component alignment apparatuses
An electronic component pick and place machine is provided. The pick and place machine comprises a pick station, first and second pick heads, a component alignment detector and a controller. The...
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6457233 |
Solder bonding method, and process of making electronic device
A solder bonding method comprises the step of solder bonding a first electrode 30 to a second electrode 16 having a solder bump 18 of mainly Sn formed on the upper surface thereof. The first...
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6453549 |
Method of filling plated through holes
A method for conductively filling a hole or via disposed in an electronic package to provide a structure having a lower coefficient of thermal expansion. After fabricating a through hole or a...
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6449837 |
Method for attaching electronic devices to metallized glass printed circuit
There is disclosed a novel method for attaching electronic components to an electric circuit printed on a glass substrate. The method comprises depositing a desired quantity of an uncured,...
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6449840 |
Column grid array for flip-chip devices
A method for providing C4-type bumps which are higher than conventional C4 bumps. A dielectric substrate is copper cladded on both sides. At each prospective bump location, a via is laser ablated...
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