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6671952 |
Method of lead wire connection
A method of lead wire connection includes mounting a lead wire onto an uppre surface of a land portion, supplying a cover member onto the lead wire, pressing the lead wire via the cover member...
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6668447 |
Multilayered board comprising folded flexible circuits and method of manufacture
An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a...
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6665930 |
Printed circuit board with SMD components
A printed circuit board with SMD components electrically connected to the printed circuit board by means of a reflow soldering process. In order to provide the printed circuit board with connection...
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6662430 |
Method for forming an antenna and a radio frequency transponder
A method is disclosed for forming an antenna and a radio frequency transponder. The method comprises the steps of (1) forming a paste comprising metal powder, polymeric material, and solvent; and...
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6662440 |
Z-axis electrical contact for microelectric devices
A Z-axis electrical contact may be formed using a resinous deposit containing conductive particles which may align along surface regions to form an electrical conduction path over the resinous...
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6658731 |
Method for fabricating connectors for interconnecting etched tri-metal circuit structures
In conventional ETM circuit structures a pin connector in which the pin is etched from the ETM substrate and the mating cavity is etched from the ETM substrate to be mated. The connector utilizes...
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6658730 |
Processor power delivery system
A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the...
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6655020 |
Method of packaging a high performance chip
A chip carrier package that includes a cover plate attached to the stiffener by a reflowable bonding material is disclosed. Additionally, a thermally and electrically conductive bonding material...
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6655021 |
Method and apparatus for improving mounting
The present invention relates to a method for fastening a printed board to an element. The method comprises the steps of: mounting at least one guide element to said printed board before said...
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6655017 |
Electronic controller unit and method of manufacturing same
An electronic controller unit is formed of first and second base plates parallel to one another and spaced apart having a flexible substrate circuit board thereon with an intermediate portion of...
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6651322 |
Method of reworking a multilayer printed circuit board assembly
An improved rework method and rework wiring structure for repairing and reworking multilayer printed circuit boards utilizing ball grid array (BGA) solder pads are described. The repair method...
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6651866 |
Precision bond head for mounting semiconductor chips
The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably...
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6651321 |
Microelectronic joining processes
A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the...
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6651320 |
Method for mounting semiconductor element to circuit board
The present invention provides a method for mounting a semiconductor element to a circuit board and a semiconductor device whereby connection reliability and connection strength in bonding of the...
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6651323 |
Method for making a printed wire board having a heat-sinking solder pad
A method for manufacturing a surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. The method comprises a step of providing a printed...
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6643919 |
Method of fabricating a semiconductor device package having a core-hollowed portion without causing resin flash on lead frame
A semiconductor device package fabrication method is proposed, which is used for the fabrication of a semiconductor device package of the type having a core-hollowed portion that is typically used...
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6643920 |
Electronic component such as a saw device and method for producing the same
An electronic component comprises a substrate having a surface on which an electrode is formed and an SAW circuit element having a surface on which a circuit is formed. The circuit element is held...
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6640429 |
Method of making multilayer circuit board
A multi-layer circuit board comprises: an insulating layer having upper and lower surfaces thereof, and wiring patterns arranged on the upper and lower surfaces of the insulating layer. A...
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6634082 |
Method of making a carbon commutator assembly
A method for making a carbon commutator assembly by forming an annular carbon cylinder of a conductive carbon composition and metalizing an inner surface of the carbon cylinder by bonding a first...
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6634092 |
Apparatus for replacing parts connected to circuit board
A flash circuit board in a lens-fitted photo film unit includes a board part, and a battery contact part connected to the board part by solder. A part exchanging apparatus for the circuit board...
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6631557 |
Method and apparatus for mounting electronic device
A part mounting apparatus mounts a part, such as a film electronic part, accurately and efficiently on a substrate, such as a glass substrate. A measuring device ( 21 ) moves along the edges of a...
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6629366 |
Method of producing a multilayer wiring board
A multilayer wiring board having a core substrate and wiring line patterns formed on both faces of the core substrate, the core substrate having conducting members piercing through the core...
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6629363 |
Process for mechanically attaching a temporary lid to a microelectronic package
A process for picking up and moving a microelectronic package during card assembly operations. A clipping lid having a top surface and at least two sides attaches to a substrate via friction where...
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6625857 |
Method of forming a capacitive element
A method of forming a capacitive element for a circuit board or chip carrier having improved capacitance is provided. The element is formed from a pair of conductive sheets having a dielectric...
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6625882 |
System and method for reinforcing a bond pad
A reinforcing system for a bond which includes at least one dielectric layer or stack disposed under the bond pad. A reinforcing patterned structure is disposed in the dielectric layer or stack...
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6622380 |
Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can...
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6619786 |
Tab circuit for ink jet printer cartridges
An improved TAB circuit is provided for use with ink jet printer cartridges, which carries electrical signals to an array of nozzles on a heater chip. The TAB circuit eliminates bent or broken...
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6618938 |
Interposer for semiconductor package assembly
The present invention describes an interposer which improves the thermal performance of a semiconductor device. The interposer may be situated between a substrate and a board. The interposer is...
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6615484 |
Method of manufacturing an electrical connection using solder flux compatible with flip chip underfill material
A method is provided in which an epoxy-based soldering flux is used to solder a flip-chip IC device to a metallic bond site on a substrate material. The soldering flux is composed of a...
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6612023 |
Method for registering a component lead with a U-shaped metalized pad
A method and apparatus for printed circuit board pads with registering feature for component leads. A U-shaped metalized pad is disposed on a printed circuit board for soldering to a component...
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6612022 |
Printed circuit board including removable auxiliary area with test points
A method for manufacturing a Personal Computer Memory Common Interface Architecture (“PCMCIA”) printed circuit board (“PCB”) includes providing a PCB having a PCMCIA area and an auxiliary...
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6612024 |
Method of mounting a device to a mounting substrate
A semiconductor device with bump electrodes having acutely shaped tips and method of mounting same. The bump electrodes are brought into contact with respective portions of a conductive pattern of...
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6612025 |
Method for creating a connection within a multilayer circuit board assembly
A method for forming connections within a multi-layer electronic circuit board 10 . The method includes forming an aperture within the circuit board and selectively coating the interior surface of...
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6609296 |
Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means
A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and...
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6606772 |
Method for manufacturing piezoelectric oscillator
A method is provided for fabricating a piezoelectric vibrator without degrading vibration characteristics. The piezoelectric vibrator has a vibration plate formed with a piezoelectric vibration...
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6604281 |
Circuit board packaging process for preventing electromagnetic interference
A packaging process of a circuit board involves a first step in which the circuit board is provided with a predetermined number of pins and is then arranged in the lower mold of a first molding...
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6602778 |
Apparatus and methods for coupling conductive leads of semiconductor assemblies
A method and apparatus for electrically coupling bond pads on the surface of a microelectronic device. The apparatus can include a microelectronic device having at least two bond pads with a...
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6601294 |
Method for making a packaged semiconductor device
A semiconductor package with thermally enhanced properties is described. The semiconductor package includes a substrate upon which a die is affixed. The die and the substrate each have contacts...
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6601295 |
Method of producing chip-type electronic devices
Chip-type electronic devices are produced by providing a base board which is later to be cut into rectangular substrates, forming longitudinally and transversely aligned throughholes through the...
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6598293 |
Connecting method of covered wire
A connecting method of connecting covered wires with each other and recessed resinous tips used in the method are provided. In the method, it is executed at the first step to put a connecting part...
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6594891 |
Process for forming multi-layer electronic structures
A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material...
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6592783 |
Anisotropic conductive adhesive film
An anisotropic conductive adhesive film contains a first insulating adhesive layer, a second insulating adhesive layer whose modulus of elasticity after curing is less than the modulus of...
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6584681 |
Method for producing a microelectronic component of sandwich construction
A method for producing a microelectronic component of sandwich construction, which includes the steps of providing a first substrate which has a first conductor track plane, providing a plurality...
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6584684 |
Method for assembling a carrier and a semiconductor device
A module or assembly is formed by interposing a polymer between a carrier and a semiconductor device to be secured to the carrier. The polymer has ionized metallic particles suspended in it. Before...
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6581279 |
Method of collectively packaging electronic components
Method of collectively packaging a plurality of electronic components formed in a first substrate, wherein the electronic components are separated from one other by separation strips associated...
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6581282 |
Apparatus for mounting electronic components
A slide-type solvent transfer unit is used, and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer flux to electronic components. In...
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6578260 |
Method for assembling a multi-deck power supply device
A method for assembling a multi-deck power supply device including control and power components. The method comprises providing a first circuit board having a first and a second side. Two...
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6578261 |
Part-mounting system comprising a plurality of part mounting devices and method of part mounting
In a part-mounting system formed by linking plural part-mounting devices which carry out respective process steps of part-mounting, when a production tact-time of one of the devices varies beyond a...
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6574861 |
System and method for solder ball rework
A system and method have been provided for removing high lead content solder balls from the surface of a circuit package for the purpose of rework. The invention is applicable to ball grid array...
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6571443 |
Method for fabricating a piezoelectric transducer
A method of manufacture and a piezoelectric transducer are provided having a housing whose interior contains a piezoelectric element having radially spaced surfaces which undergo relative shear and...
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