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6782611 |
Method of assembling a multi-chip device
A method of assembling a multi-chip device may include coupling solder balls only to selected ones of the conductive pads on an interposer with cache memory devices. The cache memory devices are...
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6779260 |
Overmolded electronic package including circuit-carrying substrate
An overmolded electronic package includes a circuit-carrying substrate and a connector housing or shroud interconnected via a suitable interconnection arrangement. Some embodiments may include a...
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6778247 |
Method for cutting tape carrier packages of a LCD and LCD structure
A cutting method of a tap carrier package of a liquid crystal display. The cutting method cuts a film comprising a first straight layout along a predetermined direction on a wiring layer comprising...
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6772510 |
Mapable tape apply for LOC and BOC packages
A method and apparatus for attaching an integrated circuit die to a leadframe or substrate. Specifically, a wafer, which is populated with integrated circuit dies, is electrically tested and a...
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6772513 |
Method for making electro-fluidic connections in microfluidic devices
A method for forming electro-fluidic interconnections in microfluidic devices comprises forming an electrical connection between matching bond pads on a die containing an active electrical element...
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6772511 |
Method for producing a semiconductor device
A semiconductor device includes a circuit board, a semiconductor element that is mounted on an upper surface of the circuit board and has an electrode terminal, and a sealing resin for sealing a...
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6772512 |
Method of fabricating a flip-chip ball-grid-array package without causing mold flash
A method of fabricating a FCBGA (Flip-Chip Ball-Grid-Array) package without causing mold flash is proposed, which is characterized by the forming of a dummy pad over the back surface of the...
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6769160 |
Process for manufacturing electronic part
A process for manufacturing an electronic part having a ceramic body and an outer electrode form on the surface of the body, the outer electrode including a plurality of layers and having a Sn...
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6769174 |
Leadframeless package structure and method
A method for providing a leadframeless package structure is provided. The method includes providing a temporary carrier. The temporary carrier is coupled to a metal foil layer with a temporary...
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6763580 |
Method and apparatus for securing an electrically conductive interconnect through a metallic substrate
A method and module for securing a conductive interconnect ( 30 ) through a metallic substrate ( 36 ). The method includes the steps of: forming a hole ( 34 ) in the metallic substrate ( 36 ), the...
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6763575 |
Printed circuit boards having integrated inductor cores
A process for forming printed circuit boards having integral inductor cores. According to the invention, a thin nickel layer is formed on a copper foil. The copper foil structure is then laminated...
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6757968 |
Chip scale packaging on CTE matched printed wiring boards
A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink...
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6757966 |
Component mounting system and mounting method
A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder...
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6757967 |
Method of forming a chip assembly
A chip mounting assembly is provided which includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact...
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6754950 |
Electronic component and method of production thereof
An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a...
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6751861 |
Printed circuit board manufacturing method
A method for manufacturing two kinds of printed circuit boards from one master board, comprises the steps of preparing the master board, forming slits on the master board to define a first circuit...
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6745462 |
Method and apparatus for reducing deformation of encapsulant in semiconductor device encapsulation by stencil printing
The invention is a method and apparatus for encapsulating semiconductor dies via stencil printing in which, after the dies have been stencil printed with encapsulant and prior to removal of the...
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6742250 |
Method of manufacturing wiring substrate
A method for manufacturing a wiring substrate 1 includes a conductor layer forming step for forming a second conductor layer 29 , through electroless copper plating and copper electroplating, on...
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6742247 |
Process for manufacturing laminated high layer count printed circuit boards
The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder...
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6742248 |
Method of forming a soldered electrical connection
A reliable, long-lived soldered electrical connection is made to a ceramic substrate having a thick-film metallization thereon, over which is deposited a joint-structure-stabilizing thin-film...
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6735849 |
Method of making dual band microstrip antenna
A dual band microstrip antenna ( 1 ) made by a method of the present invention includes a dielectric substrate ( 11 ), a ground plane layer ( 10 ) attached to a bottom surface ( 111 ) of the...
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6737300 |
Chip scale package and manufacturing method
A chip scale package mainly comprises a substrate attached to the active surface of a semiconductor chip through an anisotropic conductive adhesive film (ACF). The substrate is provided with a...
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6735857 |
Method of mounting a BGA
Solder paste is applied beforehand onto through-hole upper lands (or solder) of a printed circuit board and attachment is effected by inserting solder joined to the BGA-side pads into the holes of...
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6729023 |
Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material
A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having...
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6729532 |
Component mounting method
A component mounting method for mounting several micro component chips aligned in parallel onto a board by soldering. An allowable offset is set for each electrode, taking into account a...
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6725536 |
Methods for the fabrication of electrical connectors
Methods for the fabrication of an array of electrical connectors are provided. A conductive layer is formed into an array of generally-shaped electrical contacts which are interconnected with...
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6722028 |
Method of making electronic device
A method of manufacturing an electronic device including a first electronic component mounted on one main surface of a wiring board by being thermo-compression bonded by means of a...
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6722029 |
Method of mounting an electrical component to a support
A method of mounting an electronic component having at least one contact extending across a part of its undersurface may include providing a support smaller in area than the undersurface of the...
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6718604 |
Mounting method for electronic device elements
A mounting method for an electronic device element, includes the steps of providing an electronic device element having metal bumps formed on a surface thereof, providing a bonding tool having a...
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6717066 |
Electronic packages having multiple-zone interconnects and methods of manufacture
To accommodate thermal stresses arising from different coefficients of thermal expansion (CTE) of a packaged or unpackaged die and a substrate, the package incorporates two or more different...
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6710369 |
Liquid metal socket system and method
A liquid metal socket test fixture system and a method for the same are provided. The system has a circuit board top surface and a plurality of wells. A liquid metal compound forms balls in the...
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6708401 |
Method of manufacturing article having electronic circuit
A package is formed by covering a circuit board with a thermoplastice film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board...
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6709968 |
Microelectronic device with package with conductive elements and associated method of manufacture
A microelectronic device package and method for manufacture. In one embodiment, the device package can include a microelectronic substrate having first and second device features, a conductive link...
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6705004 |
Method and apparatus for mounting electronic part
During the process of transporting an electronic component ( 18 ) to a substrate ( 10 ) after a suction nozzle ( 7 ) has picked up the component ( 18 ), the component ( 18 ) being supplied from a...
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6698084 |
Method for manufacturing radio frequency module components with surface acoustic wave element
A method for manufacturing radio frequency module components with a surface acoustic wave element includes a gold plating step of plating gold at a component bonded portion on a conductive surface...
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6698648 |
Method for producing solderable and functional surfaces on circuit carriers
Process for the production of at least one solderable surface in selected solder regions and of at least one functional surface in function regions differing from the solder regions on circuit...
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6698092 |
Methods and systems for forming a die package
The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep...
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6694610 |
Method of producing electronic component
A method of producing an electronic component including the steps of applying solder paste to both a connection land electrode, to which a surface-mount part is to be electrically and mechanically...
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6691407 |
Methods for retaining assembled components
A method to retain an assembled component on one side of a double-sided printed circuit board. In one embodiment, an adhesive body, in a solid state, is coupled with a component by disposing a...
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6691406 |
Methods of die attachment for BOC and F/C surface mount
Methods for attaching an integrated circuit die to a substrate. Specifically, substrates which are used for BOC/COB or F/C surface mounting comprise protrusions on the surface of the substrate. The...
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6691409 |
Method of producing a circuit board
A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member...
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6684494 |
Parts replacing method and parts replacing apparatus
An electronic parts replacing apparatus comprises: a holder for holding a piece of electronic parts to be replaced; a head detachably provided to the holder; and a guide bar for guiding the head to...
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6684495 |
Method of making a circuit board not having solder failures
A method of making a circuit board ( 10 ) on which surface electronic components ( 15 ) are mounted during the method using a solder reflow process. The board comprises a circuit portion ( 12 ), a...
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6681482 |
Heatspreader for a flip chip device, and method for connecting the heatspreader
A method of connecting a heatspreader to an integrated circuit device that is connected to a substrate in a flip-chip configuration includes forming a heatspreader from a single flat sheet of...
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6681483 |
Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices
A printed circuit architecture includes a relatively thick, stiffening base of thermally and electrically conductive material, and a laminate of conductive layers including a printed circuit...
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6678947 |
Method and device for computer assisted selection of suction nozzles
Components are allocated to pipettes of different pipette types in accordance with an inverse greedy method or in accordance with a sequence of flow methods or a linear program as a result of...
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6678949 |
Process for forming a multi-level thin-film electronic packaging structure
A structure for mounting electronic devices. The structure uses a non-conductive, compliant spacer interposed between an underlying carrier and an overlying thin film. The spacer includes a pattern...
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6678948 |
Method for connecting electronic components to a substrate, and a method for checking such a connection
A method for connecting an electronic components to a carrier substrate is described. At least one pad of the component is connected electrically conductively to at least one pad on an upper...
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6680517 |
Anisotropic conductive film, production method thereof, and display apparatus using anisotropic film
An anisotropic conductive film which can be appropriately applied for the display apparatus by which the user can directly write characters•figures on the display, or erase characters and figures...
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6678946 |
Method of manufacturing a circuit unit
An upper surface of a bottom surface ( 31 ) of a lower casing ( 30 ), covering a lower surface of an FPC ( 23 ), is made flat so as not to hinder a coating operation in which solder paste is coated...
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