|
Match
|
Document |
Document Title |
|
|
6898849 |
Method for controlling wire balls in electronic bonding
A method for forming a substantially spherical free air ball on a fine non-oxidizable wire in a computerized bonder, which has a computerized flame-off (EFO) apparatus operable to generate pulses...
|
|
|
6892451 |
Method of making an interposer sub-assembly in a printed wiring board
The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a...
|
|
|
6892450 |
Method of mounting light emitting device and method of fabricating image display unit
Light emitting devices formed in an array on a first substrate are transferred to an insulating material, to form a sheet-shaped device substrate. The sheet-shaped device substrate is cut along an...
|
|
|
6889429 |
Method of making a lead-free integrated circuit package
An integrated circuit package ( 60 ) has a substrate ( 12 ) with a first surface ( 51 ) for mounting a semiconductor die ( 20 ) and a second surface ( 52 ) defining a via ( 70 ). A lead ( 26 ) is...
|
|
|
6889428 |
Method of manufacturing sheet material and method of manufacturing circuit device using the same
The invention is to form plated films on a conductive foil a thigh precision, and simplify a procedure of forming the plated film. A resin film composed of a thermosetting resin is formed on the...
|
|
|
6889430 |
Method of selectively adjusting surface tension of soldermask material
A method of selectively adjusting surface tension of a soldermask material. Specifically, a method of selectively adjusting the surface tension of a soldermask material to promote adhesion of a...
|
|
|
6889424 |
Head stack assembly installation system for a disc drive
A head stack assembly installation system with a frame supporting a head stack installation tool including a robotic assembly supporting a measurement assembly communicating with a computer hosting...
|
|
|
6889425 |
Method for producing a resistive heating element
Method for producing a resistive heating element by coating a substrate with an electrically insulating material from the gaseous phase, depositing an electrically conducting material from the...
|
|
|
6886246 |
Method for making an article having an embedded electronic device
A method for making an article having an electronic device embedded therein comprises providing a substrate having first and second opposing broad planar surfaces; mounting an electronic device on...
|
|
|
6884708 |
Method of partially plating substrate for electronic devices
The object of the present invention is to provide a free and precise control of the plating amount while easily determining a selected portion to be plated. Small balls 24 are arranged at, and...
|
|
|
6883231 |
Method for fabricating a circuit device
A method for fabricating a circuit device includes preparing an insulation resin sheet for which a first conductive layer and a second conductive layer are adhered to each other by insulation...
|
|
|
6880243 |
Stiffener for stiffening a circuit board
A printed circuit board stiffener is provided comprising a generally U-shaped elongated horizontal assembly having a substantially horizontal surface, an elongated vertical member extending...
|
|
|
6880242 |
Method for circuit protection during radiation sterilization
A circuit protection device for protection of sensitive components during high energy radiation sterilization that includes a support substrate and a protective housing. The substrate supports the...
|
|
|
6877217 |
Apparatus for handling electrical components
An apparatus for handling electrical components is provided with a head. The head may include at least one gripper and a storage element which can be filled with the electrical components. The head...
|
|
|
6874226 |
Circuit board pallet with improved securement pin
A circuit board pallet with an improved securement pin and component positioning arms is disclosed. The improved pin of the present invention is cylindrical pin with an enlarged head. A countersunk...
|
|
|
6874227 |
Method for packaging an image sensor
A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form...
|
|
|
6868603 |
Method of mounting component on circuit board
A component mounting method including carrying in a circuit board to a component mounting position and carrying out the circuit board after component-mounting operation. The component mounting...
|
|
|
6866368 |
Flexible circuit board
A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and...
|
|
|
6865805 |
Device and method of forming a unitary electrically shielded panel
A device and method of unitarily forming an electrically shielded panel for use in electromagnetically sealing an opening defined in an electronic enclosure. The unitary electrically shielded panel...
|
|
|
6865790 |
Method of removing optical device
A method of removing an optical device contained within a device package from a circuit board, wherein the device package is secured to the circuit board using an adhesive pad. The method includes...
|
|
|
6862800 |
Method for connection of coated lead wire to terminal of coil bobbin
A coated lead wire can be solidly connected to a terminal of a coil bobbin by placing the terminal entwined with the coated lead wire into between electrodes having heating portions, and supplying...
|
|
|
6862804 |
Method of mounting camera module on wiring board
A wiring board provided with a first terminal, a connector provided with a second terminal, and a camera module provided with a third terminal are provided. The first terminal and the second...
|
|
|
6860005 |
Method of fabricating printed circuit board
A method of fabricating a printed circuit board efficiently within a short time is disclosed. Two areas R 1 and R 2 to fabricate two printed circuit boards are assigned to a single original board...
|
|
|
6860003 |
I-channel surface-mount connector
In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by...
|
|
|
6848173 |
Microelectric packages having deformed bonded leads and methods therefor
A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip,...
|
|
|
6848171 |
Method of fabricating temperature control device
A temperature control device with heat conduction properties such as heat homogeneity, responsiveness or the like is fabricated by improving flatness. In a method of fabricating a temperature...
|
|
|
6845556 |
Techniques for reworking circuit boards with ni/au finish
Circuit board reworking techniques involve removing original solder from the metallic pad, removing an outer portion of the metallic pad to expose an inner portion of the metallic pad, and applying...
|
|
|
6842974 |
Component mounting method and component mounting apparatus
An electronic component mounting method for placing electronic components successively to component placing positions on a board by component holding devices equipped with a plurality of removable...
|
|
|
6834427 |
Method for depopulating of a ball grid array to allow via placement
The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid...
|
|
|
6826829 |
Method for attaching a die with a low melting metal
A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding...
|
|
|
6823586 |
Method of mounting a butterfly package on a PCB
A method of mounting a package such as a Butterfly package to a printed circuit board in order to make efficient use of the board's real estate is described. According to a preferred embodiment of...
|
|
|
6820329 |
Method of manufacturing multi-chip stacking package
The present invention discloses a method of manufacturing a multi-chip stacking package. The characteristic of the invention is that after the alignment of the bumps of at least two chips, welded...
|
|
|
6820798 |
Method for producing circuit arrangments
The aim of the invention is to simplify and improve the production method for circuit arrangements that are mounted on a support element ( 5 ), said element having thermal through-platings ( 7 )...
|
|
|
6820328 |
Method of removing heat from an electronic assemblage
A method removes heat from a densely packed electronic assemblage. Densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for...
|
|
|
6817091 |
Electronic assembly having solder thermal interface between a die substrate and a heat spreader
An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die...
|
|
|
6817093 |
Electronic component and manufacturing method therefor
A plurality of surface-mounting components are mounted on a mother printed-circuit board provided with component-connecting electrodes, engagement holes, and case-fixing electrodes provided inside...
|
|
|
6817092 |
Method for assembling a circuit board apparatus with pin connectors
A method allowing for the inexpensive automated construction of interconnections between circuit boards is provided. According to the present invention, printed circuit pins are inserted in a...
|
|
|
6817071 |
Method of manufacturing surface acoustic wave device having bump electrodes
An electronic element includes a substrate with electrode pads provided thereon. Intermediate electrodes include base electrodes on the bottom surface of the intermediate electrodes, and the bottom...
|
|
|
6813828 |
Method for deconstructing an integrated circuit package using lapping
A method is provided for deconstructing an integrated circuit package comprising: taking an integrated circuit package comprising a lead frame having a plurality of wire bond pads for placing a die...
|
|
|
6807730 |
Pad structure of semiconductor package
A pad structure for a semiconductor package is provided by forming solder lands at predetermined locations on a printed circuit board. First circular pad portions are formed protruding laterally...
|
|
|
6807731 |
Method for forming an electronic assembly
An overmolded electronic assembly having an electromagnetic interference shield, in the form of a thin metal film or foil, coupled to the top of or within an overmolded body. The shield effectively...
|
|
|
6804882 |
Method for manufacturing a coil device
A coil device includes terminal electrodes each including a bottom-surface electrode provided on a bottom surface of a flange, side-surface electrodes provided on side surfaces of the flange, and...
|
|
|
6802119 |
Conductive pedestal on pad for leadless chip carrier (LCC) standoff
A device and method for insuring the separation between a leadless chip carrier and printed wiring board, comprising aligning and attaching conductive pedestals to contact pads of either member and...
|
|
|
6796024 |
Method for making semiconductor device
According to the method of producing a semiconductor device, the substrate is provided with an opening formed at a substantially central position, interconnections and joining parts. The heat...
|
|
|
6796025 |
Method for mounting electronic part and paste material
In a method for mounting an electronic part on a mounting substrate in that projection electrodes provided on the electronic part are welded by fusion to join connection terminals provided on the...
|
|
|
6792674 |
Apparatus for mounting electronic components
A recognition camera images an electronic component, and a recognition processing unit performs recognition processing of the electronic component based on the result of the imaging. The...
|
|
|
6792677 |
Method of manufacturing an electronic component unit
A method of manufacturing an electronic component unit comprises the steps of forming a conductive pattern on a surface of a substrate, roughening a surface of a connecting area of said conductive...
|
|
|
6785960 |
Wave solder application for ball grid array modules
A method for fabricating a printed circuit board assembly comprising a via, wherein the method inhibits the flow of molten solder into the via during a wave soldering step, thereby preventing heat...
|
|
|
6782612 |
Manufacturing process of IC module
The present invention is to provide a manufacturing process of an integrated circuit module comprising the following steps: (a) providing a circuit board, which has at least one module circuit...
|
|
|
6782616 |
Connection arrangements for electrical devices
The present disclosure relates to connection arrangements for electrical devices. In the connection arrangements, an electrical device having at least one ledge that includes a plurality of contact...
|