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7134196 |
Electronic device and manufacturing same
In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of...
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7131192 |
Method of manufacturing printed circuit boards using miniature contact block packagings
This invention is a method of manufacturing printed circuit boards using a contact block packaging to provide and support electrical contact blocks relative to a printed circuit board panel. The...
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7127796 |
Method of manufacturing a waveguide
A method of manufacturing a waveguide includes forming two waveguide units, each waveguide unit having a channel defined by a bottom wall and two side walls generally transverse to the bottom wall,...
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7127810 |
Method of manufacturing electronic device including aligning first substrate, second substrate and mask, and transferring object from first substrate to second substrate, including irradiating object on first substrate with light through mask
A method of manufacturing an electronic device includes providing a mask substrate, a first substrate on which an object to be transferred is formed, and a second substrate to which the object is...
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7129584 |
Elimination of RDL using tape base flip chip on flex for die stacking
A flexible film interposer for stacking a flip chip semiconductor die onto a second (bottom) semiconductor die, semiconductor devices and stacked die assemblies that incorporate the flexible film...
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7127809 |
Method of forming one or more base structures on an LTCC cofired module
An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a...
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7127806 |
Method for marking coaxial cable jumper assembly including plated outer assembly
A jumper coaxial cable assembly includes a jumper coaxial cable and at least one solder-type connector secured thereto. The cable may include an outer conductor, which, in turn, includes aluminum...
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7124503 |
Method for forming multilayer circuit board
A method for forming connections within a multi-layer electronic circuit board 10 which allows for the selective, efficient, and reliable interconnection between at least one conductive layer and...
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7124501 |
Method of producing an electrical plug-in-connection
Method for producing an electrical connector connecting between a first and a second mating contact partner, wherein at least one contact partner is surrounded by a plug housing. The first and the...
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7122905 |
Microelectronic devices and methods for mounting microelectronic packages to circuit boards
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can...
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7121000 |
Method for manufacturing multilayer wiring board
A method of manufacturing a multilayer wiring board according to the present invention comprises the step of heating and pressurizing a stacked product to be integrated in a state in which a...
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7117597 |
Method of manufacturing liquid discharge head
A method of manufacturing a liquid discharge head provided with a liquid flow path communicating with a liquid discharge port on a substrate has a step of forming a first electrically conductive...
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7114249 |
Substrate inspecting method and substrate inspecting apparatus using the method
Inspection a is executed between a step B of mounting a chip component by a high-speed mounter and a step C of mounting a odd-shaped component by a odd-shape mounter. The inspection a executes not...
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7107674 |
Method for manufacturing a chip carrier
A method of manufacturing an integrated circuit carrier includes providing a substrate. At least one receiving zone for an integrated circuit is demarcated on the substrate. A plurality of...
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7107673 |
Technique for accommodating electronic components on a multiplayer signal routing device
A technique for accommodating electronic components on a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for...
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7103970 |
Method for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of...
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7103969 |
Methods and systems for forming a die package
The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep...
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7100279 |
Method of mounting an electronic part
A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and...
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7096581 |
Method for providing a redistribution metal layer in an integrated circuit
An integrated circuit includes a portion having at least one active circuit area. The integrated circuit also includes a redistribution metal layer fabricated at least partially during fabrication...
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7096580 |
I/C package/thermal-solution retention mechanism with spring effect
A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a...
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7096568 |
Method of manufacturing a microcomponent assembly
A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and...
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7093356 |
Method for producing wiring substrate
A wiring substrate with bumps protruding from a surface of the substrate covers one side of a metallic base with an electrical insulating film thereon, having open holes exposing the base, etching...
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7086136 |
Method of manufacturing a sequential segment joining type stator coil
Provided is a method of manufacturing a sequential segment joining type stator coil for use in an electric rotating machine, capable of achieving satisfactory electrical and thermal contact between...
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7086147 |
Method of accommodating in volume expansion during solder reflow
Solder balls such as, low melt C4 solder balls, undergo volume expansion during reflow, such as may occur during attachment of chip modules to a PCB. Where the solder balls are encapsulated,...
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7080446 |
Wiring board sheet and its manufacturing method, multilayer board and its manufacturing method
A wiring board sheet which enables the miniaturization of a wiring board by mounting electric components ( 10 ) in an insulation layer ( 4 ) to increase the quantity of mounting electric...
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7069647 |
Method for populating a substrate with electronic components
A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer...
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7065867 |
Low temperature hermetic sealing method having passivation layer
A hermetic sealing method, which is capable of preventing oxidation of a micro-electromechanical system (MEMS) and sealing the MEMS at a low temperature. A low temperature hermetic sealing method...
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7066376 |
Methods for manufacturing a tactile sensor using an electrically conductive elastomer
The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically...
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7065858 |
Method for welding components of a disk drive head suspension
A method of affixing head suspension components to one another using an edge weld formed at the edge of one head suspension assembly component positioned in an overlapping fashion relative to...
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7059048 |
Wafer-level underfill process making use of sacrificial contact pad protective material
A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material...
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7059045 |
Method for handling integrated circuit die
In some embodiments, a method includes picking up a clip with a chuck, and, while holding the clip with the chuck, picking up an integrated circuit (IC) die with the IC die in contact with the clip.
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7055241 |
Method of fabricating an integrated circuit package
A method of forming a semiconductor package is provided. The method includes forming a leadframe wherein the conductors or leads of the leadframe extend from a first end to a second end such that a...
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7051424 |
Method and apparatus for electrically and physically coupling a micro-actuator and slider to a hard drive arm suspension for component replacement after detachment from the suspension
A system and method are disclosed for coupling a replacement micro-actuator to a drive arm suspension after a micro-actuator, such as a defective micro-actuator, has been detached from the suspension.
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7051431 |
Component mounting control method
In a mounting system where a chip component is mounted by a small component mounting apparatus on paste solder applied onto a board and the mounting state is inspected by a mounting inspection...
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7047633 |
Method of using pre-applied underfill encapsulant
The invention relates to a method for utilizing one or more B-stageable or pre-formed underfill encapsulant compositions in the application of electronic components, most commonly chip scale...
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7047635 |
Connecting material and connecting method
A connecting material can form a detachable connecting structure. According to the connecting material, a connecting portion between a certain object and another object can be more readily formed,...
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7047634 |
Method of making a multilayer wiring board
A built-in component type multilayer wiring board includes at least one resin layer and at least one frame resin layer. The resin layer includes electronic components buried therein. The frame...
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7043830 |
Method of forming conductive bumps
A sealing layer is provided on the surface of a substrate such as a semiconductor wafer. The sealing layer includes apertures which expose external contact locations for semiconductor dice formed...
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7043822 |
Method of manufacturing commutator of rotary electric machine
A method of manufacturing a commutator of a rotary electric machine includes a step of forming a first unitary material having nail portions, a step of forming a second unitary material for the...
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7043832 |
Manufacturing method for fixing tin balls in connectors or IC devices
A method for fixing tin balls in one of a connector or an IC device to the welding portion of the terminals of an electric connector, IC or other electronic element so that the terminal can be...
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7040012 |
Method of electrically and mechanically connecting electronic devices to one another
A method is provided for electrically and mechanically connecting a first electronic device to a second electronic device. At least one electric contact of the first device is located against an...
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7036217 |
Methods of manufacturing via intersect pad for electronic components
According to a method of mounting electronic components on a printed circuit board (PCB), the electrical contacts of the components are coupled to PCB bonding pads that are intersected by via pads....
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7038144 |
Electronic component and method and structure for mounting semiconductor device
An electronic component having an electrode structure to increase an allowance positional deviation in a mounting process as well as a method and a structure for mounting a semiconductor device are...
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7036216 |
Method and apparatus for connecting at least one chip to an external wiring configuration
An electrically conductive connection is produced between a chip and an external wiring configuration that is kept at a distance from the chip by spacers. Electrically conductive contact material...
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7036218 |
Method for producing a wafer interposer for use in a wafer interposer assembly
A method for producing a wafer interposer ( 210 ) for use in a wafer interposer assembly is disclosed. The wafer interposer ( 210 ) is produced by attaching solder bumps ( 140 ) to a lower surface...
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7032306 |
Method for producing module
The invention concerns a method for producing electronic modules with ball connector ( 7 ) or integrated preforms capable of being soldered on a printed circuit ( 3 ) and a device for implementing...
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7028397 |
Method of attaching a semiconductor chip to a chip mounting substrate
A semiconductor chip, substrate employing plural bonding steps to ensure complete bonding particularly of peripheral edges. Embodiments include placing an adhesive layer on a chip mounting...
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7028396 |
Semiconductor chip pick and place process and equipment
A process and tooling for removing a semiconductor chip ( 31 ) from a handling tape ( 321 ) without damage to either the chip or tape by one or more horizontal beam type ejector tools ( 333 )...
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7028400 |
Integrated circuit substrate having laser-exposed terminals
An integrated circuit substrate having laser-exposed terminals provides a high-density and low cost mounting and interconnect structure for integrated circuits. The laser-exposed terminals can...
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7026708 |
Low profile chip scale stacking system and method
The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile contacts are created by any of a...
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