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6344234 |
Method for forming reflowed solder ball with low melting point metal cap
A method and structure for a solder interconnection, using solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate is disclosed. After...
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6339875 |
Method for removing heat from an integrated circuit
A heatsink interface material for securing a heatsink to an integrated circuit includes a core material having an adhesive forced into opposing surfaces of the core material. It is preferred that...
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6341071 |
Stress relieved ball grid array package
A method and structure for reducing thermally induced strains on the solder joints that couple a ball grid array (BGA) module to a circuit card, so as to improve the fatigue life of the BGA module....
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6338194 |
Method of making a circuitized substrate assembly with carrier having substrates therein
A method of making an assembly comprised of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier through the use of appropriate, paired...
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6338195 |
Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet
A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer...
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6336262 |
Process of forming a capacitor with multi-level interconnection technology
A capacitor having a multilevel interconnection technology and process thereof. Also disclosed is a process of electrically connecting a capacitor to an object, comprising the steps of first...
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6336269 |
Method of fabricating an interconnection element
Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then...
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6332988 |
Rework process
A semiconductor wafer rework process sideways etches an underlying layer of metal to remove a difficult to etch upper layer of metal without substantially etching that upper layer and without...
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6332268 |
Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor
An IC chip (2) can be provided to a pre-mount process while being held on a tape-shaped supporting member (5), without being taken out of the tape-shaped supporting member (5).
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6330745 |
Method for making a modular integrated apparatus for heat dissipation
A modular integrated apparatus and method that integrates mechanical, electrical, and thermal management, and that includes a computer processor (CPU), or VLSI module, connected to a circuit board...
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6330166 |
Electronic-component mounting structure
In an electronic-component mounting structure, an electronic component (2) has a surface. First electrodes (1) provided on the surface of the electronic component (2) are arranged in a first array....
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6329228 |
Semiconductor device and method of fabricating the same
A semiconductor device having a PBGA structure comprising a wiring board, a semiconductor integrated circuit chip, substrate electrodes of the semiconductor integrated circuit chip for electrically...
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6324755 |
Solid interface module
A microwave solid interface module having transmit and receive functionality includes a substrate supporting microwave, logic, and DC bias circuits. In one embodiment, the substrate can be formed...
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6324754 |
Method for fabricating microelectronic assemblies
Solder pads for microelectronic connections are formed with a set of solder-wettable strips extending radially outwardly from a central point. A solid core solder ball is positioned on each pad and...
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6326237 |
Reworkable thermoplastic hyper-branched encapsulant
The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint, wherein the solder joint spans between the chip and the substrate forming an electrically...
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6320753 |
Integrated circuit board combining external contact zones and an antenna, and process for manufacturing such a board
Integrated circuit board combining external contact zones and an antenna to receive data transmitted by a terminal, and process for manufacturing such a board. The integrated circuit board in...
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6317973 |
Method for discriminating the kind or type of printed circuit board to selectively set the mounting process therefore
In a mounting system including a loading station having a transport conveyor for conveying printed circuit boards, a mounting machine for fabricating circuit devices by attaching electronic...
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6313999 |
Self alignment device for ball grid array devices
An apparatus which aligns a ball grid array (BGA) device over a substrate. The apparatus preferably includes a cup-shaped member for cupping and holding the solder balls of the BGA device, and an...
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6308403 |
Head assembly for part mounting apparatus and part mounting apparatus adopting the same
A head assembly for a part mounting apparatus includes a housing, a plurality of rod housings installed to be capable of elevating with respect to the housing, a plurality of voice coil motors...
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6295728 |
Printed circuit board assembly manufacturing system
A system for manufacturing a print board assembly, which is implemented in a system having a computer for storing parts insertion instruction diagrams and displaying parts insertion instructions,...
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6295727 |
Method of manufacturing an integrated circuit
A device and method for manufacturing an integrated real time clock integrated circuit (RTC IC) package is disclosed, in which the RTC IC and its related components are integrated into a single...
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6295709 |
Printed circuit board assembly and method for making a printed circuit board assembly
A PCB assembly which allows economical and reliable rework. The PCB assembly contains a soldermask and a trace with a portion of the trace exposed by a soldermask relief When one needs to rework...
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6293007 |
Mounting system
In a mounting system including a loading station having a transport conveyer for conveying printed circuit boards, a mounting machine for fabricating circuit devices by attaching electronic...
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6288347 |
Wiring board for flip-chip-mounting
A wiring board for flip-chip-mounting in which a conductor layer is provided in a portion under the semiconductor element-mounting surface of the ceramic insulating board, the electrically...
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6286205 |
Method for making connections to a microelectronic device having bump leads
A method for making connections to a microelectronic device having bump leads thereon. A substrate is provided having a front surface and a plurality of electrically conductive posts extending...
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6282780 |
Bump forming method and its forming apparatus.
In a bump forming method and its forming apparatus, a torch is made to approach a bottom end of a wire extended from a capillary tool to form a ball, thereafter the wire is held by first clampers...
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6285562 |
Method of contacting a chip
In a chip bonding method, first bonding bumps are applied to bonding electrodes of the chip, a first flexible circuit carrier is arranged on the chip, the flexible circuit carrier having cavities...
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6284984 |
Printed circuit board, for mounting BGA elements and a manufacturing method of a printed circuit board for mounting BGA elements
A printed circuit board and a manufacturing method of a printed circuit board which ensure high mechanical bonding strength and reliable electrical connection and permit ready mounting are...
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6279226 |
Lead bonding machine for bonding leads of a chip disposed over a carrier tape to an electrode pad formed on the chip
A method and apparatus for stabilizing the form of a letter S of an inner lead after bonding in a method of manufacturing μBGAoIC in which a chip is fixed via an insulating film on a tape carrier...
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6279227 |
Method of forming a resilient contact structure
An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The...
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6278613 |
Copper pads for heat spreader attach
A new method is provided for the connection of heat conducting copper pads, eliminating the need for these heat conducting pads to be connected directly to the ground ring, further eliminating the...
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6272742 |
Method of electrically connecting substrates using solder balls
A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of placing one or more blind vias in a first substrate positioned on top of a first...
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6272744 |
Semiconductor connection components and methods with releasable lead support
A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these...
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6272743 |
Component mounting apparatus
In a board transfer method, a board (1) prior to component placement thereon is transferred from a loader unit (15) into a component-placement position and, after the component placement is carried...
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6269537 |
Method of assembling a peripheral device printed circuit board package
A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and...
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6266872 |
Method for making a connection component for a semiconductor chip package
A method of making a microelectronic assembly includes providing a connection component including a dielectric element with electrically conductive parts, providing a fugitive material in contact...
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6263564 |
Method of producing a printed board assembly and a shielding element for shielding components on a printed board assembly
In a method of producing a printed board assembly from a printed board, components are furnace soldered to the printed board. A string of heat curing, electrically conductive material, elastic...
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6256877 |
Method for transforming a substrate with edge contacts into a ball grid array
The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable...
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6256879 |
Compression connector
A connector utilized to electrically connect together conductive pads disposed on different substrates includes a flexible substrate having a plurality of conductive through-holes therein. A...
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6259036 |
Method for fabricating electronic assemblies using semi-cured conductive elastomeric bumps
A method for fabricating bumped semiconductor components and electronic assemblies, such as multi chip modules, is provided. The method includes forming semi cured, electrically conductive,...
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6259608 |
Conductor pattern for surface mount devices and method therefor
A method for controlling the height, shape and placement of solder connections of a surface mount circuit device, such as a flip chip, by way of controlling the extent to which solder is able to...
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6254923 |
Solder particle deposition
Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211...
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6253985 |
Unit for supplying solder balls
A unit for supplying solder balls or the like is configured to have a primary hopper for storing a number of solder balls or the like, a ball tray for storing solder balls or the like, and a ball...
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6255581 |
Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace
A surface mount technology compatible electromagnetic interference (EMI) gasket assembly includes an electrically conductive gasket material, a solderable electrically conductive support layer, and...
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6252779 |
Ball grid array via structure
A method for joining electronic devices such as integrated circuits to vias in a substrate. A solder ball attached to an electronic device is joined to a contact pad of a via by a low melting...
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6247639 |
Fixed-gap solder reflow method
A method is provided for forming a plurality of solder joints for electrically and mechanically coupling a printed circuit board (100) and a flexible circuit (101). Solder is applied to the...
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6243944 |
Residue-free method of assembling and disassembling a pressed joint with low thermal resistance
A method of assembling a pressed joint between an integrated circuit module and a temperature regulating unit includes the steps of: 1) providing the integrated circuit module with a contact...
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6240635 |
Printed circuit board scrap removal and printed circuit board fabrication process
Circuit boards are formed within the boundaries of an insulative sheet or panel such that the panel may be automatably processed. The periphery of each printed circuit board is defined by at least...
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6242933 |
Device probe socket forming part of a test head, interfacing between test head and a probe handler, used for device strip testing
A new probe socket is provided that allows for high speed and dependable contacting of points of contact on the Device Under Test. The new probe socket is aimed at a testing environment where...
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6240634 |
Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached...
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