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6457233 |
Solder bonding method, and process of making electronic device
A solder bonding method comprises the step of solder bonding a first electrode 30 to a second electrode 16 having a solder bump 18 of mainly Sn formed on the upper surface thereof. The first...
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6453549 |
Method of filling plated through holes
A method for conductively filling a hole or via disposed in an electronic package to provide a structure having a lower coefficient of thermal expansion. After fabricating a through hole or a...
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6449837 |
Method for attaching electronic devices to metallized glass printed circuit
There is disclosed a novel method for attaching electronic components to an electric circuit printed on a glass substrate. The method comprises depositing a desired quantity of an uncured,...
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6449840 |
Column grid array for flip-chip devices
A method for providing C4-type bumps which are higher than conventional C4 bumps. A dielectric substrate is copper cladded on both sides. At each prospective bump location, a via is laser ablated...
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6449838 |
Method of mounting a semiconductor device to a substrate
This invention mounts a semiconductor device having a plurality of electrodes to a substrate. A bump electrode having a pointed tail is formed on the electrode. The concave mounting pad is formed...
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6449836 |
Method for interconnecting printed circuit boards and interconnection structure
In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive...
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6446332 |
Process and device for connecting a probe to a printed circuit board by means of a plug connector with two half-shells
A method for connecting a probe whose electrical connections end on a circuit board that can be introduced into a receptacle of a connector plug that comprises two half-shells which carry on sides...
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6443739 |
LGA compression contact repair system
An improved rework method and rework wiring structure for repairing and reworking multilayer printed circuit boards utilizing land grid array (LGA) compression contact pads are described. The...
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6442832 |
Method for coupling a circuit board to a transmission line that includes a heat sensitive dielectric
A preferred method for coupling a transmission line to a circuit board includes the steps of: providing a circuit board with a first side and an opposing second side; dispensing solder upon the...
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6438827 |
Ceramic electronic part and method for producing the same
A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent...
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6434817 |
Method for joining an integrated circuit
A method for attaching an integrated circuit to a flexible circuit which includes the acts of providing an integrated circuit having a plurality of contact pads formed upon a surface thereof;...
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6425179 |
Method for assembling tape ball grid arrays
According to the present invention, a method for creating a package for a semiconductor die, the package comprising a flexible tape, comprises the following steps. A support with an opening has a...
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6426880 |
Surface mounted device with grooves on a termination lead
Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an, electronic device is made up of a device package and one or more electrically conductive...
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6424029 |
Chip card
A chip card is described, preferably a contactless chip card, comprising a data-processing circuit for receiving, processing and/or transmitting data signals, and at least a capacitive switching...
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6421253 |
Durable laminated electronics assembly using epoxy preform
A delamination resistant electronics module assembly includes a printed circuit board layer coupled to a pallet via a cured epoxy preform. The preform may include conductive epoxy, or...
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6420207 |
Semiconductor package and enhanced FBG manufacturing
A high density, non-bussed semiconductor package and a full body gold (FBG) method for manufacturing semiconductor packages are provided to improve electrical and mechanical connections with...
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6417997 |
Mechanically formed standoffs in a circuit interconnect
Mechanically formed standoffs in a disk drive integrated circuit interconnect reduces the cost of manufacturing and improves the reliability of the electrical interconnections thereof. Connection...
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6415505 |
Micromachine package fabrication method
Micromachine chips are tested for validity while the micromachine chips are still in wafer form. Any defective micromachine chips are marked or otherwise identified. Coupons are attached to the...
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6408510 |
Method for making chip scale packages
The present invention is a chip scale package handling part and process manufacturing method that uses existing automated equipment to economically mass produce chip scale packages. The present...
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6408506 |
Electrical enclosure having improved sealing and shielding component and method of manufacture thereof
An electrical enclosure having an improved sealing and shielding component and a method of manufacturing such an enclosure is provided. In accordance with an embodiment of the invention, a wire...
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6408507 |
Heat sink to semiconductor module assembly equipment and method
Automated equipment mounts heat sinks on printed circuit boards. First heat sinks, semiconductor modules and second heat sinks are consecutively seated on a plurality of built-up pads as the...
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6408508 |
Method for making flexible trace surface circuit board
A circuit board has traces attached to a flexible trace surface such that the traces can be displaced in a direction of thermal expansion of a component attached to the traces without causing the...
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6410861 |
Low profile interconnect structure
Low profile interconnect structure includes an electronic circuit module with a plurality of mounting areas and a plurality of electrical contact areas defined by the mounting surface. The...
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6408511 |
Method of creating an enhanced BGA attachment in a low-temperature co-fired ceramic (LTCC) substrate
A method for providing an enhanced ball grid array attachment in low-temperature co-fired ceramic (LTCC) substrate is provided. A termination cup is formed in a substrate. The termination cup has a...
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6401332 |
Processing printed circuits and printed circuits thus obtained
There is described a process for producing printed circuits comprising a laminar support, an electrically conductive track on the laminar support, and an auxiliary conductive element soldered to...
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6401330 |
Apparatus for mounting an integrated circuit onto a printed circuit board and then testing the integrated circuit
A system includes a printed circuit board (PCB) having multiple bonding sites and a packaged integrated circuit (IC) having multiple conductive portions for electrically contacting respective...
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6397460 |
Electrical connector
In a socket used to house semiconductor die during testing, a recessed socket contact is provided that avoids pinching the die's contacts. Also provided are socket contacts that allow for smaller...
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6397456 |
Method and a machine for automatic mounting of components and a pick-up head for such a machine
On a carriage ( 43 ) which is movable in a horizontal direction (X-direction) in an automatic component mounting machine a slide ( 41 ) is arranged which is movable vertically (in the Z-direction)....
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6397459 |
Printed wiring board with mounted circuit elements using a terminal density conversion board
A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first...
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6389690 |
Method of coating printed circuit board
A conformal coating and method for applying same to a printed electrical circuit board, components and leads for providing corrosion resistance. In a preferred embodiment, the conformal coating...
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6389683 |
Apparatus and method for mounting electronic component
A solvent transfer unit is made a slide type and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer the flux to electronic components. In...
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6389687 |
Method of fabricating image sensor packages in an array
Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding...
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6389691 |
Methods for forming integrated redistribution routing conductors and solder bumps
A method for forming routing conductors and solder bumps on a microelectronic substrate includes the steps of forming an under bump metallurgy layer on the substrate and forming a solder structure...
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6389689 |
Method of fabricating semiconductor package
A method of fabricating a semiconductor package is provided, which realizes a small-size semiconductor package without performance deterioration, to meet a tendency to miniaturization of electronic...
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6389686 |
Process for fabricating a thin multi-layer circuit board
A process for fabricating thin multi-layer circuit boards. A substrate is disposed over a heat-accumulating block adjacent thereto so that it is uniformly heated from the back side thereof during...
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6392301 |
Chip package and method
A semiconductor device package includes multiple build-up layers of metal sandwiching non-conductive layers. The metal layers include apertures, or degassing holes. A manual method and a...
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6381838 |
BGA package and method of manufacturing the same
A BGA package includes a semiconductor chip, and a PCB having a board body, a plurality of circuit patterns, a plurality of signal via holes, a solder resist, and a plurality of thermal emissive...
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6381837 |
Method for making an electronic circuit assembly
A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from...
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6378757 |
Method for edge mounting flex media to a rigid PC board
Edge mounting flexible media to a rigid PC board construction can be achieved by various methods. In any method used, there is a desire to create solderable pads on the edge of the rigid PC board....
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6379997 |
Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor...
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6374486 |
Smart card and process for manufacturing the same
A method for manufacturing a smart card in which a through-passage is produced in a central sheet. At least one face of the central sheet is provided with at least one metal coil having connection...
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6377468 |
Electric circuit apparatus
Circuit elements of surface-mounting type such as MOSFETs etc. are mounted on a circuit board by soldering. The circuit board is retained slantingly by a base so that any one of the MOSFET falls...
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6370766 |
Manufacture of printed circuit cards
The specification describes methods for the manufacture of printed circuit cards which allow for final testing, including burn-in if required, of multiples of printed circuit cards as an integrated...
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6370767 |
Method for fabricating an electrical apparatus
A method and apparatus for dissipating heat from an electrical component. The method includes providing a planar element including a first electrically and thermally conductive region and a second...
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6367150 |
Solder flux compatible with flip-chip underfill material
An epoxy-based soldering flux is used to solder a flip-chip IC device to a metallic bond site on a substrate material. The soldering flux is composed of a thermosetting epoxy resin and a...
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6370030 |
Device and method in electronics systems
The present invention relates to a device and a method at a printed board for obtaining good transmission qualities in transmission conductors on a predetermined area ( 10 ) of the printed board (...
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6367678 |
Process for stacking layers that form a multilayer printed circuit
A process for correctly positioning layers of a multilayer printed circuit. A flat closed circuit is attached peripherally on each layer. Each layer is arranged parallel to multiple circuits that...
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6365499 |
Chip carrier and method of manufacturing and mounting the same
In BGA (Ball Grid Array), LGA (Land Grid Array) and the like, a resin layer is formed between an external connecting electrode of a chip carrier and a circuit wiring board. Consequently, the...
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6360433 |
Universal package and method of forming the same
A chip module comprising a chip array which includes an interconnect substrate having opposed, generally planar surfaces and a first interconnect pad array disposed on at least one of the surfaces...
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6357106 |
Method for mounting parts and making an IC card
A method for mounting parts, and an IC card and its manufacturing method. The method reduces the number of steps, increases productivity, lowers costs, and miniaturizes the chip. A first electrode...
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