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RE40283 |
Mounting apparatus for electronic component
An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed...
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7284321 |
Method for testing a chip with a package and for mounting the package on a board
A method for testing a chip with a package having connecting pins and mounting the package on a board combines the advantages of a package with inline connecting pins with that of a package with...
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7254890 |
Method of making a microfluid ejection head structure
A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing...
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7251872 |
Method for forming a chip package
A chip package is formed which has an array of leads, wherein successive leads are staggered in all three dimensions (X, Y, and Z) relative to one another to permit a large number of leads...
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7093357 |
Method for manufacturing an electronic component
A method for manufacturing an electronic component including the steps of preparing a pair of substantially round conductive wires, bending one end portion of each of the pair of conductive wires...
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7059047 |
Sockets for “springed” semiconductor devices
Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the...
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7051432 |
Method for providing an electrical connection
A preferred method for electrically connecting a first and a second component includes inserting a wire pin through a through hole formed in the first component so that a first portion of the wire...
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7047623 |
Device for installing a linear motor line
A device is provided for installing at least one linear motor line in the grooves ( 14 ) of an inductor ( 15 ) which is situated underneath a cover plate ( 10 ). The device includes a vehicle ( 31...
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7043831 |
Method for fabricating a test interconnect for bumped semiconductor components by forming recesses and cantilevered leads on a substrate
A method for fabricating an interconnect for semiconductor components includes the steps of: providing a substrate; forming a metal layer on the substrate; etching projections in the metal layer;...
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7032292 |
Method of manufacturing high Q on-chip inductor
A high Q on-chip inductor includes a primary winding and an auxiliary winding that is coupled to receive a proportionally opposite representation of an input of the primary winding. Further, the...
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6966109 |
Method for attaching and for ensuring orientation of components
A method attaches a center conductor to one or both of a load end conductor and a line end conductor. The center conductor has two cylindrical projections. The load end conductor and the line end...
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6964095 |
Method for producing a crimp ear
A method of manufacturing an electrical contact with a crimp ear from a flat ribbon of conductive material including applying a force to the ribbon to form an adjacent pair of approximately...
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6935002 |
Method of manufacturing a nonreciprocal circuit device
A method of manufacturing a nonreciprocal circuit device is performed such that matching capacitors are formed of single-board-type capacitors including capacitor electrodes formed so as to be...
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6910267 |
Apparatus for telecommunications equipment
An apparatus and method for servicing a telecommunications device that utilizes pin connectors connecting electronic modules to the backplane. A catch basin module is insertable into a slot in the...
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6864572 |
Base for heat sink
A heat sink base ( 10 ) includes a rectangular body ( 11 ) made of aluminum and a circular core ( 12 ) made of copper. The body defines a circular through opening ( 111 ). A diameter of the opening...
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6797541 |
Leadless semiconductor product packaging apparatus having a window lid and method for packaging
A natural-resource-conservative, environmentally-friendly, cost-effective, leadless semiconductor packaging apparatus, having superior mechanical and electrical properties, and having an optional...
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6762117 |
Method of fabricating metal redistribution layer having solderable pads and wire bondable pads
A redistribution metallization scheme combines solder bumps and wire bond pads in addition to existing bond pads to enhance the connectivity of a semiconductor device, especially in flip-chip...
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6751849 |
Method for connecting a contact body and a flexible conductor, and a compression mold for carrying out said method
A movable contact arrangement suitable for use in a switching device has a rigid contact body and a flexible conductor piece connecting the contact body to a fixed conductor. The contact body is...
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6725537 |
Method of connecting circuit element
A contact of a circuit element is fixed to a terminal of a metallic plate by plastically deforming a portion of the terminal against the contact. The method of connecting the contact to a terminal...
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6658728 |
Method for fabricating a spring structure on a substrate
Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a...
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6581274 |
Apparatus for configuring and inserting component leads into printed-circuit boards
Apparatus having a mandrel, and a ring having an aperture therein, the ring being slidable over the mandrel. A multilead electronic component having electric leads extending therefrom is positioned...
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6477766 |
Axial-type electronic component inserting apparatus
An axial type electronic component inserting apparatus is provided for inserting into holes of a board a pair of lead wires of each of axial type electronic components connected by a tape at...
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6367149 |
Method of assembling an IC socket for interconnecting articles with different terminal pitches
An IC socket adapted to establish an electrical connection between an IC package and a printed board includes a socket body having a mount portion on which the IC package is mounted, a number of...
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6206273 |
Structures and processes to create a desired probetip contact geometry on a wafer test probe
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The...
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6161056 |
Placement method and apparatus
An area division unit divides a part placement area into a plurality of divided areas based on an area granularity. A part gravity value operation unit and a parts replacement unit extract a set of...
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5975742 |
Electronic part inserting apparatus with checking function for clinched state, and checking method thereof
In an electronic part inserting apparatus with a checking function for a clinched state, a database for clinch-checking is generated by extracting information for clinch-checking having coordinates...
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5901442 |
Method of manufacturing loosening prevention kinks on leads of an electric member for insertion into a mounting board
A method of manufacturing an electric member having a number of leads such as in a remote-controlled light receiving module, loosening prevention kinks created on at least one of the leads are...
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5867893 |
Clinch assembly lift mechanism
A clinching assembly for use with an insertion machine of the type used to form and insert the lead-wires of an electronic component into openings of a printed circuit board insertion machine. The...
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5777886 |
Programmable lead conditioner
A lead conditioning system (10) conditions leads (74) of electronic component package (30) and includes a rotary table (16) for holding electronic component package (30) and making accessible the...
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5773989 |
Measurement of the mobile ion concentration in the oxide layer of a semiconductor wafer
A method and apparatus for measuring the concentration of mobile ions in the oxide layer of a semiconductor wafer from the contact potential shift caused by ion drift across the oxide that includes...
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5737829 |
Terminal insertion machine having position sensing and automatic actuation device
A terminal insertion machine (10) is disclosed that automatically actuates the insertion head (14) when the lower tooling (24) senses that the circuit board (26) is in proper alignment for...
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5689193 |
Probe head, method for manufacturing the same, and inspecting method using the same
Probes include proximal ends electrically connected to the respective conductive patterns of said insulating substrate, and free ends for being contact with the respective electrode pads of the...
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5515021 |
Switching battery charger for reducing electromagnetic emussions having separately-mounted circuit boards
A method and apparatus for reducing electromagnetic emissions from switching-type battery chargers safely and at low cost. The method and apparatus generally comprises enclosing the battery charger...
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5410452 |
Printed circuit board electrical adaptor pin
An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with...
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5369871 |
Device for fixing bus bars to insulating board
A device for automatically fixing bus bars and after-fixing bus bars on an insulating board includes a workpiece setting table, on which a bus bar plate and an insulating board are set, is moved...
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5351393 |
Method of mounting a surface-mountable IC to a converter board
A surface-mount integrated circuit converter board assembly having a pin grid array arranged enables a conventional surface-mount lead device to be mounted for subsequent attachment to a printed...
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5313401 |
Mounting system including a plurality of hand mechanisms for picking up, moving and mounting works on an object board
A mounting system having a function of picking up one of several different type works from a pickup position where the works having the different types are selectively fed, and of moving a picked...
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5313016 |
Auto-insertable electromagnetic interference ground clip
An electromagnetic shielding clip for providing an electrical connection between two mating surfaces. The clip of the present invention comprises an electrically conductive sheet. The sheet is...
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5288244 |
Connector assembly having fixed unitary fasteners for mounting to a panel
An electrical connector assembly and method includes a connector body and at least one unitary fastening member that is deformed at a central region of the fastening member after insertion through...
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5198009 |
Method of manufacturing glass beads for use in thermionic gas chromatographic detectors
Alkali metal-containing glass beads for use as sources in thermionic detectors for gas chromatography are manufactured by a method which produces reproducible beads of preselected sizes. A glass...
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5195237 |
Flying leads for integrated circuits
A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in...
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5172472 |
Multi-layer rigid prototype printed circuit board fabrication method
A multi-layer rigid prototype printed circuit board is fabricated by applying a heat activated, rapid setting or tacking melt-remelt adhesive utilizing a moderate temperature heat laminating device...
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5165165 |
Part inserting apparatus and method for use
A parts inserting apparatus of this invention includes clinch elements arranged to be engaged with lead wires of an electronic part inserted into a printed circuit board, a detecting unit for...
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5122480 |
Method for assembling a heat sink to a circuit element using a retentive spring force
A heat sink/electromagnetic shield assembly for a circuit element disposed upon a circuit board. A spring clip containing at least one hooked projection forming the spring is positioned in a...
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5113117 |
Miniature electrical and mechanical structures useful for constructing miniature robots
An electrical device comprises a three-dimensional body formed from an organic polymer and a plurality of electrical elements attached to the body. The body has a regular pattern of sockets in its...
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5057458 |
Combination of a support and a semiconductor body and method of manufacturing such a combination
The invention relates to the combination of a support and a semiconductor body and to a method of manufacturing same, in which a deformable metal layer is disposed between the semiconductor body...
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5054192 |
Lead bonding of chips to circuit boards and circuit boards to circuit boards
A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in...
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5053358 |
Method of manufacturing hermetically sealed compression bonded circuit assemblies
A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circuit assembly having circuit...
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5045975 |
Three dimensionally interconnected module assembly
A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in...
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4995156 |
Method for assembling components upon printed circuit boards
Subject-matter of this invention is a method for assembling components, such as M.O.S, devices and the like, upon printed circuit boards by clinching, such method including the steps of providing a...
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