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7623034 |
High-speed RFID circuit placement method and device
A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an...
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7617597 |
Component placing method
A component placing method uses a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the...
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7600313 |
Part cartridge for mounter device
A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are...
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7596851 |
Method of manufacturing a quartz resonator
The shape of a crotch portion of a tuning fork of a quartz piece is controlled such that main surfaces of two sheets of original plates, which are made of quartz crystal and the main surfaces...
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7594316 |
Method of manufacturing composite electronic component
A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block...
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7584536 |
Process for precise alignment of packaging caps on a substrate
The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its...
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7581313 |
Component mounting method and mounter
The present invention, which aims at providing a component mounting method and a mounter capable of correcting, with high accuracy, a mounting position of a component, includes: a mounting head (...
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7571539 |
Component verification method and apparatus
A component verification method for a mounter ( 100 ) that is capable of performing component verification with less labor. The method includes a position specification step (S 12 A) of specifying...
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7559138 |
Method for replacing defective PCB from PCB panel
An apparatus for replacing a defective PCB unit formed on a PCB panel includes a location correcting table on which a nondefective PCB unit for replacing the defective PCB unit is disposed, a panel...
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7540080 |
Method for mounting component by suction nozzle
A method and apparatus for mounting a light emitting element, enabling positioning on an object with precision with reference to the optic axis of a light emitting element, and mounting the...
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7533459 |
Electronic component mounting method and electronic component mounting apparatus
The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional...
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7528682 |
Electronic apparatus having display portion and oscillator and manufacturing method of the same
In an electronic apparatus comprising a digital display portion and first and second oscillators comprising first and second oscillating circuits, each of the first and second oscillating circuits...
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7516540 |
Electrical device having component fixing device
A component fixing device includes a holding portion for holding a component with a hollow portion while restricting a movement of the component; and a fixed portion elastically connected to the...
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7513036 |
Method of controlling contact load in electronic component mounting apparatus
A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no...
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7500307 |
High-speed RFID circuit placement method
A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna...
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7480986 |
Apparatus for feeding components from packaged component band
An apparatus for feeding components from a packaged component band includes a stand defining a platform allowing the packaged component band passing therealong, a first guiding unit installable to...
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7478473 |
Method of manufacturing an IC card
The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring...
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7472472 |
Electronic part mounting apparatus
In an electronic part mounting apparatus provided with first, second and third beam members 31, 32 and 33 , all supported by a common Y-axis frame at both ends thereof, holding a chip 6 by...
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7467464 |
Method of manufacturing a memory card
A method for manufacturing a multi media card comprises the steps of: providing a substrate, mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a...
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7464466 |
Method of fabricating inkjet nozzle chambers having filter structures
A method of fabricating a plurality of inkjet nozzles on a substrate. The method comprises the steps of: (a) providing a substrate having a plurality of trenches corresponding to ink inlets; (b)...
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7444733 |
Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same
Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same is proposed. The process step of a flexible substrate is put on a substrate...
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7415759 |
Method and apparatus for mounting semiconductor chips
A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table,...
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7401405 |
Method of fabricating inkjet nozzles having associated ink priming features
A method of fabricating a plurality of inkjet nozzles on a substrate, each nozzle comprising a nozzle chamber having a roof spaced apart from said substrate and sidewalls extending from said roof...
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7367115 |
Component mounting apparatus
A component mounting apparatus having a work conveyor-positioner unit is arranged on a supporting base to convey and position a substrate in an X direction. Supporting frames extend vertically from...
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7362562 |
Electronic unit of radio system and method of producing the same
The invention relates to a method of producing an electronic unit of a radio system automatically, an electronic unit of a radio system and an electronic component. The method of producing an...
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7356919 |
Component mounting method
A component mounting apparatus has a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a...
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7353599 |
Fiducial markings for quality verification of high density circuit board connectors
Methods for qualifying the accuracy of a circuit board may include providing a printing mask pattern for first and second sides of the circuit board with a first sequence of spaced indicia parallel...
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7353594 |
Component mounting method
When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is...
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7353593 |
Method for assembling micro structures
A method for making three-dimensional structures comprises providing a plurality of components, each of which is moveably coupled to a substrate. The components may be pivotally coupled to the...
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7353589 |
Component mounting apparatus
A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units...
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7335571 |
Method of making a semiconductor device having an opening in a solder mask
A method for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one...
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7331105 |
Method for placing components by means of at least one component placement unit
Provided is a method and system for placing components by means of at least one component placement unit wherein the component placement unit is moved over a distance between a component pickup...
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7319304 |
Shunt connection to a PCB of an energy management system employed in an automotive vehicle
A method of coupling a shunt to a printed circuit board (PCB) of an energy management system is provided. The method includes coupling flexible electrical connectors to the shunt and soldering the...
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7316061 |
Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface
According to one aspect of the invention, a method of constructing an electronic assembly is provided. A layer of metal is formed on a backside of a semiconductor wafer having integrated formed...
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7315454 |
Semiconductor memory module
A semiconductor memory module includes an electronic printed circuit board with a contact strip and a plurality of semiconductor memory chips of identical type that are mounted on at least one...
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7312402 |
Method and apparatus for providing improved loop inductance of decoupling capacitors
A method and apparatus that provides improved loop inductance of decoupling capacitors. Vias are moved close to the pads and close to each other. Instead of placing power and ground vias on...
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7302755 |
Head assembly for a component mounter
Provided is a component mounter having a plurality of revolving nozzle spindles, which can simultaneously pick up and mount two or more electronic components. A head assembly for the component...
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7299545 |
Alignment method and mounting method using the alignment method
Positioning recognition marks are read by movable recognition device for positioning objects to be bonded to each other. An alignment method includes a step of reading the recognition marks during...
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7296343 |
Electronic component mounting apparatus
An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When...
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7290331 |
Component mounting apparatus and component mounting method
In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component...
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7290321 |
Alignment apparatus and method for aligning stacked devices
An apparatus for passively aligning first and second substrates having micro-components disposed thereon when the substrates do not include patterned surfaces which face each other. The apparatus...
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7287321 |
Multi-layer board manufacturing method
Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type...
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7287320 |
Method for programming a routing layout design through one via layer
A method for programming a routing layout design through one via layer includes forming a plurality of metal traces on a first routing layer and a second routing layer, and positioning a plurality...
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7281323 |
Method for mounting electronic components
A method for mounting electronic components is provided. The method comprises: rotating at least one rotation housing, and thereby correcting positions of a plurality of nozzle spindles depending...
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7275316 |
Method of embedding passive component within via
A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of...
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7275314 |
Electronic component mounting apparatus and electronic component mounting method
In an electronic component mounting apparatus for taking out a chip 6 from a component supply portion 4 to mount to a board 16 held by a board holding portion 10 , an image of a supply...
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7275312 |
Apparatus for precise alignment of packaging caps on a substrate
The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its...
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7260888 |
Fabricating method of keypad assembly
A keypad assembly including a substrate, a metal layer, a patterned light-shielding layer, a light-transparent material layer and a keypad circuit module is provided. Said substrate has a first...
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7251883 |
Electronic-component alignment method and apparatus therefor
A first electronic component having two alignment holes perforated at predetermined positions thereof at a predetermined interval is held with a receiving table, and also a second electronic...
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7246431 |
Methods of making microelectronic packages including folded substrates
A microelectronic package is fabricated by a process which includes folding a substrate. A substrate is folded by engaging a folding portion of the substrate with a die so that the folding portion...
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