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7617597 |
Component placing method
A component placing method uses a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the...
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7614144 |
Component mounting apparatus
The present invention is intended to realize a hold posture inspection of a plurality of components sucked by a plurality of nozzle rows provided on a head with a single scanning operation, thereby...
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7603767 |
Workpiece picking and placing method
A workpiece holding method and holding system able to shorten the workpiece attachment/detachment time, wherein pressurized air is circulated through a nozzle of an ejector unit of a chuck at all...
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7600314 |
Methods for installing a plurality of circuit devices
A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is...
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7600313 |
Part cartridge for mounter device
A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are...
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7594319 |
Electronic-component alignment method
A first electronic component having two alignment holes perforated at predetermined positions thereof so as to be spaced away from each other by a predetermined interval is held with a receiving...
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7594316 |
Method of manufacturing composite electronic component
A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block...
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7587803 |
Method for assembling a camera module
A process for assembling a camera module comprises the following steps:—placing the substrate ( 10 ) on a positioning die ( 70 );—irradiating the lens assembly ( 30 ) with parallel rays of...
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7581313 |
Component mounting method and mounter
The present invention, which aims at providing a component mounting method and a mounter capable of correcting, with high accuracy, a mounting position of a component, includes: a mounting head (...
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7581310 |
Electronic component mounting apparatus
The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from...
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7581305 |
Method of manufacturing an optical component
A method of manufacturing an optical component comprising a substrate and a mounting frame with plural contact portions disposed at predetermined distances from each other is provided. The method...
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7568284 |
Components insertion method
In a component insertion head, by grasping of a device portion of a component by a device chuck, a lead wire is stretched on a fulcrum given by a grasping position of the lead wire by a transfer...
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7555831 |
Method of validating component feeder exchanges
A method and apparatus for facilitating validation of component feeder exchanges in pick and place machines are provided. A pre-exchange image of a component from a feeder is acquired and compared...
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7552529 |
Method for assembling electronic circuits
A device for assembling electronic circuits comprises a placing station ( 7 ) for placing circuit components on a circuit carrier ( 1 ) held at a placing location ( 17 ), a fixing station ( 19 )...
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7540080 |
Method for mounting component by suction nozzle
A method and apparatus for mounting a light emitting element, enabling positioning on an object with precision with reference to the optic axis of a light emitting element, and mounting the...
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7533459 |
Electronic component mounting method and electronic component mounting apparatus
The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional...
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7533457 |
Packaging method for circuit board
A method includes populating a circuit board with components, and encapsulating the circuit board and the components with a material. The method further includes separating the circuit board into a...
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7526863 |
Method for manufacturing a microstructure
A method for manufacturing a microstructure comprises the steps of forming positive type resist layer (PMMA) on a base plate having heater formed thereon; forming positive type resist layer (PMIPK)...
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7525816 |
Wiring board and wiring board connecting apparatus
The present invention provides a wiring board including a first board provided with a first wiring pattern and a second board provided with a second wiring pattern while the first wiring pattern...
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7513035 |
Method of integrated circuit packaging
Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a...
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7503109 |
Method of mounting an electronic component
An apparatus for storing an electronic component, the electronic component having a first surface and an opposite second surface, the apparatus includes a first film having a pocket that stores the...
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7501752 |
Color image display unit
Light emitting devices formed in an array on a first substrate are transferred to an insulating material, to form a sheet-shaped device substrate. The sheet-shaped device substrate is cut along an...
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7484278 |
Method of manufacturing a multi-layered piezoelectric
A multi-layered piezoelectric device includes a plurality of piezoelectric portions and a plurality of electrodes electrically connected to the piezoelectric portions that are formed in layers on a...
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7467448 |
Method of manufacturing a piezoelectric ceramic
Disclosed are a piezoelectric ceramic structurally crystal-oriented through the crystallizing control of an amorphous material under an electric field and a method of manufacturing the same. The...
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7458147 |
Method for determining whether a component holder is defective
The present invention provides a device and a method for determining whether or not a component holder is good, which enable detecting component holders that are to affect correct component...
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7441329 |
Fabrication process circuit board with embedded passive component
A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided....
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7437038 |
Z-axis alignment of an optoelectronic component using a spacer tool
A method of forming an optoelectronic package that employs a spacer tool system to properly align an optical component within the device is disclosed. The package includes a mounting surface, and...
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7433038 |
Alignment of substrates for bonding
An alignment apparatus for a substrate bonding system is provided with a first optical arm arranged to direct onto a detector radiation from a first alignment mark on a first substrate, and a...
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7409761 |
Electronic component mounting apparatus and method of mounting electronic components
In an electronic component mounting process for mounting electronic components ( 6 ) to a substrate, each of the electronic components having an adhesive layer on a surface to be bonded to the...
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7383621 |
Method of producing a piezoelectric ceramic
A piezoelectric contains comprises a plurality of piezoelectric particles made from a piezoelectric material such as lead titanate zirconate and a dielectric made from a dielectric material, such...
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7367117 |
Electronic component mounting apparatus and electronic component mounting method
The invention prevents mismounting of an electronic component caused by missetting of a component feeding unit in an apparatus. A recognition process of an electronic component is performed...
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7356919 |
Component mounting method
A component mounting apparatus has a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a...
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7356918 |
Component mounting method
An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no...
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7353594 |
Component mounting method
When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is...
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7313862 |
Method of mounting components on a PCB
A printed wiring board is disclosed. The printed wiring board includes a board recognition mark formed of a conductive foil, a first component land covered with resist, and a second component land...
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7299546 |
Method for manufacturing an electronic module
An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer ( 1 ) and a conductive layer on the...
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7299545 |
Alignment method and mounting method using the alignment method
Positioning recognition marks are read by movable recognition device for positioning objects to be bonded to each other. An alignment method includes a step of reading the recognition marks during...
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7299539 |
Apparatus for mounting components on substrate
An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an...
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7296343 |
Electronic component mounting apparatus
An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When...
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7290331 |
Component mounting apparatus and component mounting method
In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component...
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7290327 |
Component mounting apparatus employing temperature maintenance of positioning accuracy
A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic...
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7287315 |
Apparatus for measuring slider mounting position in magnetic head, and magnetic head manufacturing system using the measurement apparatus
The present invention provides a measurement apparatus for obtaining a suitable position on a suspension where a more miniature magnetic head slider is to be mounted to the suspension, the...
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7281323 |
Method for mounting electronic components
A method for mounting electronic components is provided. The method comprises: rotating at least one rotation housing, and thereby correcting positions of a plurality of nozzle spindles depending...
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7275316 |
Method of embedding passive component within via
A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of...
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7275314 |
Electronic component mounting apparatus and electronic component mounting method
In an electronic component mounting apparatus for taking out a chip 6 from a component supply portion 4 to mount to a board 16 held by a board holding portion 10 , an image of a supply...
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7274812 |
Image processing device and method
In an image processing device capable of collectively estimating an object based upon results of plural times of inspection, regions ( 1 ( 1 )) and ( 1 ( 2 )) to be photographed are defined on...
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7269897 |
Manufacturing process of a stacked semiconductor device
A manufacturing process of a stacked semiconductor device, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor...
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7257887 |
Die holding apparatus for bonding systems
A die holding apparatus to form electrical contacts on individual dies is described. In one embodiment, a semiconductor device holder is used to hold individual dies for processing and...
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7251883 |
Electronic-component alignment method and apparatus therefor
A first electronic component having two alignment holes perforated at predetermined positions thereof at a predetermined interval is held with a receiving table, and also a second electronic...
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7243421 |
Electrical connection of components
A contact of a component is electrically connected to an associated contact of an electrical circuit, typically formed on a substrate, by depositing material between the contacts, the material...
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