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5724722 |
Part state detecting device for mounter
A component handling device that is adapted to provide determination of a component picked up by a pickup device by different recognition methods depending upon the size of the component picked up....
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5713125 |
Electronic parts mounting method employing memory equipped parts supply devices
Electronic parts are mounted onto a substrate. A parts supply device holds a plurality of electronic parts and moves to be positioned at a predetermined parts take-out position. The parts supply...
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5710063 |
Method for improving the alignment of holes with other elements on a printed circuit board
A method of locating a socket on a printed circuit board which includes the steps of fabricating a plurality of pads and one or more fiducials on the upper surface of the printed circuit board,...
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5701661 |
Optical system for mutually positioning a pad carrying member and a multileaded component
The invention relates to a simple and economic optical system for mutually positioning SMD components having connecting leads and the corresponding pads on pad carrying members with the object of...
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5699193 |
Apparatus and method for the accurate positioning of components for flip-chip mounting
For flip-chip mounting of a component with its contact surface on the contact surface of substrate, the component or the substrate is held at the free end of a lever arm which pivots around an...
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5687475 |
Process for determining the position and/or checking the separation and/or checking the coplanarity of the leads of components
In order to determine the position and/or to check the separation of the leads (A) of components (B), a direct shadow of the region of the leads at one side of the component is generated on the...
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5680699 |
Method and apparatus for placing a component on a strip-shaped support
A method and device for placing a component on an elongate, strip-shaped support which is provided with indexing holes and with a repetitive pattern, the positions of the patterns relative to...
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5680698 |
Method for precise alignment and placement of optoelectric components
A method for superimposing an image of an optoelectric component on a substrate with the use of a single camera. Specifically, the camera looks through a transparent alignment tool that is holding...
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5666722 |
Method of manufacturing printed circuit boards
A printed circuit board is made by producing recesses and/or holes in an electric insulating substrate by laser ablation. The recesses correspond to a desired pattern of conductor structures and/or...
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5560100 |
Systems and method for automatic disassembly
An apparatus for automatically removing electronic components mounted on printed circuit boards has a lighting device for illuminating the printed circuit boards, an optical sensor, an image...
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5553376 |
Method of and apparatus for changing a production setup
An assembly machine (10) has a plurality of slots (22) each of which hold a feeder (24) containing a component reel (30). The assembly machine (10) automatically assembles a printed circuit board...
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5539977 |
Apparatus and method for automatically mounting electronic parts
An apparatus for automatically mounting electronic parts in which chip-like electronic parts supplied from a parts feeding device are mounted at predetermined positions on a printed substrate. For...
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5525846 |
Manually actuatable integrated control module and method of making same
A manually actuatable integrated contact module connecting to an output access module by means of a common communications link. The integrated contact module has an electrical contact, a logic...
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5502890 |
Process for determining the position and coplanarity of the leads of components
In order to determine the position and/or to check the separation of the leads (A) of components (B), a direct shadow of the region of the leads at one side of the component is generated on the...
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5501005 |
Mounting device of electronic components and a mounting method
In an apparatus for mounting electronic components, punched out from film carriers to a substrate, there is disclosed an upper die for punching the electronic components through a hole formed in a...
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5491888 |
Method for mounting component chips and an apparatus therefor
A number of embodiments of component pick up and mounting devices that include a plurality of pick up heads. The speed of the device is improved by providing sensing of the orientation of the...
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5489750 |
Method of mounting an electronic part with bumps on a circuit board
A method of mounting an electronic part with bumps on a circuit board is disclosed which enables bumps to be bonded to electrodes of the circuit board with certainty and which enables the judgement...
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5457880 |
Embedded features for monitoring electronics assembly manufacturing processes
Cooperative patterns are formed in stencils and/or substrates that facilitate the monitoring and control of the circuit assembly process. A pattern of successively-larger etch blocks receives a...
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5456003 |
Method for packaging a semiconductor device having projected electrodes
A method for packaging a semiconductor device having projected electrodes is provided. The method includes the steps of: (a) placing the semiconductor device on a substrate having a plurality of...
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5454159 |
Method of manufacturing I/O terminals on I/O pads
To manufacture I/O terminals on I/O pads of an electronic component, the electronic component, together with a transparent alignment component which has a reference feature, is placed in a fixture...
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5400497 |
Electronic parts mounting apparatus having memory equipped parts supply device
An apparatus is for mounting electronic parts onto a substrate. The apparatus includes a parts supply device for holding a plurality of electronic parts and for moving to be positioned at a...
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5384956 |
Method for mounting components
A component mounting device including a measuring station where the length of the component is measured in two different angular positions so as to permit calculation of the corrective factors...
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5379514 |
Electronic component installing apparatus and method
An electronic component installing apparatus includes a transporting unit for transporting an electronic circuit board to the apparatus at a predetermined position thereof and transporting the...
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5377405 |
Method for mounting components and an apparatus therefor
A number of embodiments of component pick up and mounting devices that include a plurality of pick up heads. The speed of the device is improved by providing sensing of the orientation of the...
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5372294 |
Method of preparing a component for automated placement
A method of preparing a component for automated placement is provided. The method includes disposing tacking medium on a substantially transparent member (210); engaging the tacking medium with the...
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5359768 |
Method for mounting very small integrated circuit package on PCB
A very small integrated circuit package. The package of the present invention includes a substrate or die coupled to a heatsink. The substrate or die has solder bumps for being directly mounted to...
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5342460 |
Outer lead bonding apparatus
An outer lead bonding apparatus which includes a device supply section on which devices are arranged at predetermined positions, a transfer head assembly for picking up the devices from the device...
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5311304 |
Apparatus for the positioning of components on a printed circuit board or the like
The apparatus for positioning electronic components on a printed circuit board or the like includes an optical system which allows to line-up the underside of the electronic component with the...
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5262355 |
Method for packaging a semiconductor device
This invention is directed to a method for packaging a semiconductor flip chip on a substrate by face-down bonding in which coherent light is used to irradiate a bonding head and the substrate, and...
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5249356 |
Method and apparatus for mounting electronic component
An electronic component mounting apparatus includes a table for feeding in and out a printed circuit board and holding the board thereon, a supply section for supplying an electronic component, a...
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5249349 |
Parts mounting device
A parts mounting device for precisely positioning parts and discriminating whether such position is proper wherein a recognition member recognizes parts and mounting lands on a printed circuit...
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5233745 |
Electronic-component mounting apparatus with monitoring device
An apparatus for mounting electronic components on a circuit board, the apparatus being equipped with an X-Y table assembly moveable in a horizontal plane and monitoring device attached to the X-Y...
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5224262 |
Parts mounting machine
An electronic parts mounting apparatus, has a part mounting head on which nozzles for holding different sized electronic parts can be exchangeably mounted; the suction nozzles each having a...
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5225026 |
Bonding method and apparatus therefor
Two parts to be bonded together, such as a circuit board and a chip, are brought into one-above-the-other relationship, and before bonding is performed, a detecting device with an upper opening and...
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5222293 |
System for placing an object on a carrier and method
A system, including a method and cognate apparatus, places an object on a carrier with great accuracy. Three prepositioned pins on a holder engage a corner portion of the carrier formed between...
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5212880 |
Apparatus for packaging a semiconductor device
This invention is directed to an apparatus for packaging a semiconductor flip chip on a substrate by face-down bonding in which coherent light is used to irradiate a bonding head and the substrate,...
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5194948 |
Article alignment method and apparatus
Alignment of each of a plurality of depending first conductive members (16), in an array of orthogonal rows and columns on an article (12), with a corresponding second conductive member (18)...
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5177864 |
Electronic component mounting apparatus and method of mounting electronic component
A method of mounting an electronic component having a plurality of leads on a printed circuit board. The method includes the steps of roughly observing the position of an electronic component, held...
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5172468 |
Mounting apparatus for electronic parts
An electronic part mounting apparatus enables reduction of the time required for attracting and mounting of a part and is reduced in cost and occupies comparatively little space as composed to...
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5144747 |
Apparatus and method for positioning an integrated circuit chip within a multichip module
A multichip integrated circuit package comprises a substrate having a flat upper surface to which is affixed one or more integrated circuit chips having interconnection pads. A polymer encapsulant...
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5113565 |
Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames
A method is described for aligning a contact pattern on an electronic device held by a first movable support, with a bond site pattern on a lead frame held by a second movable support. The method...
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5097592 |
Method of making molded electrical interconnection system
A circuit panel subassembly suitable for use in an eletromechanical apparatus includes a plurality of wires formed within an electrically conductive grid imbedded within a reaction injection molded...
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5086559 |
Electrical component placing apparatus and method of placing electrical component
An electrical component placing apparatus has an XY-axis table, including motors for moving the table in the X and Y axis directions between an electrical delivery unit and a printed circuit board....
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5086557 |
Method of assembling electronic component systems
A method for installing and assembling electronic circuit board component systems utilizes templates having installation instructions and conductor terminal markings printed thereon, which are...
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5084962 |
Apparatus for and method of automatically mounting electronic component on printed circuit board
An automatic electronic component mounting apparatus for automatically mounting electronic components on the printed circuit board includes an electronic component supply mechanism for supplying an...
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5084959 |
Chip mounting apparatus
A chip mounting apparatus includes an X-Y robot having a chip mounting head and a substrate position recognizing camera both positioned in an upper arm of the robot apparatus. The chip mounting...
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5079834 |
Apparatus for and method of mounting electronic components
The present invention consists in that printed patterns on a printed circuit board and component information near the printed patterns are photographed, that the type of an electronic component to...
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5067233 |
Method of forming an integrated circuit module
A method of forming an integrated circuit module ae disclosed. The module includes a plurality of integrated circuit layers having beveled vertical edges along a portion thereof. The layers are...
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5058263 |
Manipulation device
At least two manipulators have parallel axes of rotation. Each manipulator is provided with an arm connected to a common coupling member. Movement of the coupling member rotates the manipulators...
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5054991 |
Wafer positioning apparatus
The wafer positioning apparatus has an XY axis drive mechanism for moving a mounting stock in the X-axis direction and the Y-axis direction in the XY coordinates on the horizontal plane; a...
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