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6971161 |
Method for generating component mounting data and component mounting method
There are provided a method and device for generating component mounting data in view of productivity, quality assurance, safety, or the like, when components are mounted onto a mounting target,...
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6971158 |
Electric-component mounting system including movable substrate-holding device
An electric-component mounting system including component-mounting devices arranged in an array and each having a component-holding head for holding an electric component, and a head-moving device...
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6971160 |
Hybrid electrical circuit method with mated substrate carrier method
A hybrid integrated circuit fabrication method in which an insulating substrate member and its metallic substrate carrier are made to be mating with precision through use of computer controlled...
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6961993 |
Method of transferring and mounting elements
A device mounting method capable of efficiently, accurately arraying micro-devices on a circuit board is provided. The method includes a device separating step of separating a plurality of LED...
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6961994 |
Method of high-speed and accurate alignment using a chip mounting device
A mounting device including a plurality of heads, each holding a chip, arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads...
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6952869 |
Electric-component mounting system for mounting electric component on a circuit substrate
An electric-component mounting system including a component-holding device for holding an electric component, a board-supporting device for supporting a printed-wiring board on which the electric...
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6948232 |
Component recognizing method and apparatus, and component mounting method and apparatus
Disclosed are a component recognizing method and apparatus, and a component mounting method and apparatus, by which components with various heights held by a plurality of nozzles can be recognized...
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6940168 |
Enhanced pad design for substrate
A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of...
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6938335 |
Electronic component mounting method
A component mounting method recognizes reference marks on a printed circuit board and an electronic component, and uses these reference marks to determine a shift between a position of the circuit...
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6935017 |
Component mounting apparatus having component supply tables provided on opposite sides of a component transfer path
There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a...
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6935019 |
Method of mounting electronic components and apparatus therefor
For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3 a, 3 b, 3 c, 3 d, 3 e and 3 f are kept in holes 5 ...
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6925700 |
Method for producing large-area planar wave guide structures
A method and a device for producing large-area planar wave guide structures is described. A planar substrate is provided with channel-shaped structures and the channel-shaped structures are filled...
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6920687 |
Component mounting method employing temperature maintenance of positioning apparatus
A component mounting method for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate...
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6918176 |
Mounting apparatus of electronic parts and mounting methods of the same
An apparatus and method for mounting electronic parts wherein a transfer width between a pair of transfer rails is changeable according to a size of a substrate. A mounting head picks up electronic...
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6915565 |
Method of detecting position of rotation axis of suction nozzle
A method of detecting a position of a rotation axis of a suction nozzle of an electric-component mounting apparatus, the suction nozzle holding, by suction, an electric component, and being rotated...
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6915827 |
Offset measuring mechanism and offset measuring method in a bonding apparatus
An offset measuring mechanism and method used in a bonding apparatus, in which the object plane of a position detection camera is set on a hypothetical bonding working plane, and the image of...
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6904672 |
Method for mounting an electronic component
This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method...
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6901658 |
Electric-component supplying apparatus and circuit-board assembling method for feeding a plurality of electric-component tapes
An apparatus for feeding a plurality of electric-component tapes each of which includes a carrier tape and holds a plurality of electric components in a lengthwise direction of the carrier tape,...
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6898846 |
Method and components for manufacturing multi-layer modular electrical circuits
A method for manufacturing a modular electrical circuit includes the steps of pre-manufacturing a plurality of components having fine features such as resistors, capacitors, inductances, and...
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6895661 |
Component alignment apparatuses and methods
A component transfer apparatus is provided. The component transfer apparatus comprises a pick and place machine having a component feed source and a movable pick head having access to the component...
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6877220 |
Method for feeding a component
An occurrence component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare...
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6874226 |
Circuit board pallet with improved securement pin
A circuit board pallet with an improved securement pin and component positioning arms is disclosed. The improved pin of the present invention is cylindrical pin with an enlarged head. A countersunk...
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6874227 |
Method for packaging an image sensor
A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form...
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6868603 |
Method of mounting component on circuit board
A component mounting method including carrying in a circuit board to a component mounting position and carrying out the circuit board after component-mounting operation. The component mounting...
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6869491 |
Bonding method
In a bonding method in which two display panels 7 A, 7 B are held by the two panel holding portions 31 a , 31 b provided on the panel support table 31 positioned by the XYθ table 30 so as...
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6865803 |
Component mounting method
A component mounter which picks up components from two or more tape feeders aligned in a component feeder carriage, and mounts them a board. Suction nozzles for vacuum-holding components are...
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6862804 |
Method of mounting camera module on wiring board
A wiring board provided with a first terminal, a connector provided with a second terminal, and a camera module provided with a third terminal are provided. The first terminal and the second...
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6862803 |
Method for mounting electronic component
A parts mounting method employing a suction section having a plurality of suction nozzles is provided. The suction section is moved to a parts supply section in which a plurality of parts are...
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6857182 |
Mounting system for mounting an electronic component on a substrate
A mounting system for mounting an electronic component on a substrate includes a component identifying apparatus that identifies an electronic component to be mounted on the substrate. The...
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6854179 |
Modification of circuit features that are interior to a packaged integrated circuit
A circuit feature that is interior to a packaged integrated circuit is modified by first identifying a trimming point on the interior circuit feature using an x-ray inspection system. Coordinates...
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6842974 |
Component mounting method and component mounting apparatus
An electronic component mounting method for placing electronic components successively to component placing positions on a board by component holding devices equipped with a plurality of removable...
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6839960 |
Method for mounting electronic parts on a board
Method for taking out electronic parts from a parts supply section by a transfer head and transporting and mounting the electronic parts to and on a board positioned on a transfer passage. In an...
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6839959 |
Component mounting apparatus
There are disclosed an apparatus for mounting electronic components, with which the electronic components can be reversed, up and down, and mounted onto a circuit board in a short mounting process...
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6826822 |
Method for preparing rubber plate used in an ion implanter
One embodiment is directed to a method for trimming a rubber plate which is configured to be placed on a platform of an ion implanter, wherein the platform of the ion implanter includes a plurality...
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6814121 |
Bonding apparatus
In measuring the position of a bonding tool accurately in offset correction in a bonding apparatus, the tool is moved to approach a reference member, the tool is illuminated with a reference...
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6807726 |
Electric-component mounting system
Electric-component mounting system includes a member fixedly disposed on one of a main body and a movable portion, an image-taking device fixedly disposed on the other of the main body and movable...
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6802119 |
Conductive pedestal on pad for leadless chip carrier (LCC) standoff
A device and method for insuring the separation between a leadless chip carrier and printed wiring board, comprising aligning and attaching conductive pedestals to contact pads of either member and...
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6802118 |
Method for surface mounting electronic components on a printed circuit board
A method of mounting electrical components on a printed circuit board includes moving the printed circuit board to a first mounting location, picking up a plurality of electrical components with a...
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6792674 |
Apparatus for mounting electronic components
A recognition camera images an electronic component, and a recognition processing unit performs recognition processing of the electronic component based on the result of the imaging. The...
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6792676 |
Apparatus and method for mounting electronic parts
An electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and...
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6790703 |
Apparatus for aligning die to interconnect metal on flex substrate
A method and process sequence for accurately aligning (die to interconnect metal on flex substrate such as polyimide flex is described. A mask for via formation is first patterned in a metal layer...
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6789310 |
Component mounting apparatus
There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a...
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6779259 |
Electronic component mounting method
Two or more parts feeding sections are provided, and in each of the parts feeding sections, identical combinations of parts cassettes aligned in the same arrangement are prepared. If one or more...
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6779252 |
Apparatus for assembling components
The present invention provides an assembly apparatus employing at least a robotic or automated assembly apparatus to manipulate the components to be assembled and at least a first vision alignment...
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6762848 |
Offset measurement method, tool position detection method and bonding apparatus
In measuring the position of a bonding tool accurately in offset correction in a bonding apparatus, the tool is moved to approach a reference member, the tool is illuminated with a reference...
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6757966 |
Component mounting system and mounting method
A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder...
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6754949 |
Method and apparatus for manufacturing electronic parts
The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 ...
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6752962 |
Miniaturized integrated sensor platform
A miniaturized integrated sensor ( 50 ) useful for indicating the presence of a sample analyte is disclosed. The sensor ( 50 ) has a platform ( 52 ) with an upper surface ( 53 ) and a detector ( 62...
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6748649 |
Method of operating a component holding head
A holding head includes an axially driveable shaft having a nozzle at one end of the shaft for holding a component, a motor for driving the shaft in an axial direction in response to power supplied...
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6739036 |
Electric-component mounting system
A mounting system for an electric component operates by transferring the electric component from a component supply device to a suction nozzle of a component-holding head on a circuit substrate. A...
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