Matches 51 - 100 out of 366 < 1 2 3 4 5 6 7 8 >
Match Document Document Title
7251883 Electronic-component alignment method and apparatus therefor  
A first electronic component having two alignment holes perforated at predetermined positions thereof at a predetermined interval is held with a receiving table, and also a second electronic...
7243420 Electronic component mounting method  
In an electronic component mounting method, a camera transporting mechanism transports a camera to a component supplying unit to take an image of a component. Thereafter the camera is evacuated...
7243421 Electrical connection of components  
A contact of a component is electrically connected to an associated contact of an electrical circuit, typically formed on a substrate, by depositing material between the contacts, the material...
7225051 Closed-loop feedback for maximizing Cpk in progressive forming operations  
A method and system for maximizing process capability in a progressive forming operation. The method compensates for deviations introduced by unformed components, and uses closed loop feedback to...
7222414 Component transfer systems  
A system for transferring electrical components. The system may comprise a plurality of electrical components. Each of the components may include leads and a physically asymmetric fiducial marker...
7216422 Method of forming a capacitor assembly in a circuit board  
A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling...
7213330 Method of fabricating an electronic device  
A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact...
7213332 Method component on a circuit board  
A method of mounting a component on electrodes on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solders for the...
7200926 Parts mounting method  
A suction head is inserted between first and second cameras relatively disposed facing one another with aligned optical axes, so that the first camera takes images of a head reference mark on the...
7191511 Electronic component placement machine having camera units with vertically overlaid apertures  
An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a...
7188409 Method for rejecting component during a placement cycle  
The present invention features a method wherein a component in a multi-head component placement machine is rejected during the placement cycle. A component is imaged and the image processed using...
7185424 Electronic component mounting method and apparatus  
All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an...
7178229 Method of making interlayer panels  
Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the...
7171745 Apparatus and method for force mounting semiconductor packages to printed circuit boards  
An apparatus and method for force mounting semiconductor packages onto printed circuit boards without the use of solder. The apparatus includes a substrate, a first integrated circuit die mounted...
7165321 Method for manufacturing printed wiring board with embedded electric device  
A manufacturing method of a printed wiring board having an embedded electric device is as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality...
7155817 Apparatus and method for mounting components on substrate  
An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an...
7158663 Method for measuring confidence of ball grid array model in surface mounted devices  
A method for obtaining confidence measure of a ball grid array (BGA) model having a plurality of balls in semiconductor surface mounted devices is provided. The method comprises the steps of...
7137195 Method for mounting electronic parts onto a board  
Provided is an electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction...
7137194 Apparatus and method for maintaining a dry atmosphere in a surface mount device placement machine  
The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the...
7127810 Method of manufacturing electronic device including aligning first substrate, second substrate and mask, and transferring object from first substrate to second substrate, including irradiating object on first substrate with light through mask  
A method of manufacturing an electronic device includes providing a mask substrate, a first substrate on which an object to be transferred is formed, and a second substrate to which the object is...
7120995 Apparatus for mounting semiconductors  
An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and...
7118939 Manufacturing method and manufacturing apparatus for semiconductor device  
A formation surface of electrodes and a formation surface of leads are imaged along an axis which intersects an XY plane at right angles. A projected image of the formation surface of the...
7114244 Disc centering device  
A disc centering device includes a base plate, a chuck which is installed on the base plate, a hub unit which is detachably engaged to the chuck and receives discs and spacers to be stacked, disc...
7114249 Substrate inspecting method and substrate inspecting apparatus using the method  
Inspection a is executed between a step B of mounting a chip component by a high-speed mounter and a step C of mounting a odd-shaped component by a odd-shape mounter. The inspection a executes not...
7114245 Component holding head, component mounting apparatus using same, and component mounting method  
An electronic component holding head, an electronic component mounting apparatus using same, and a method for mounting an electronic component, are provided for use in mounting an electronic...
7102148 Calibration method and device in electronic component mounting apparatus  
In an electronic component mounting apparatus capable of replacing a component placing device with any of plural other component placing devices different in performance, the distance between the...
7089660 Method of fabricating a circuit board  
A circuit board with an asymmetrical structure and a method for fabricating the same are proposed. A core circuit board is provided, with a build-up structure being formed on a side of the core...
7087457 Die bonding method and apparatus  
A die bonding method and apparatus that performs bonding position detection and bonding inspection without lowering the productivity, in which after a bonding head has bonded a semiconductor chip...
7076867 Pressurizing method  
A pressurizing method for pressurizing a second component arranged on a first component, against the first component by using a pressurizing apparatus having a stage on which the first component is...
7076094 Method and apparatus for detecting position of lead of electric component, and electric-component mounting method  
A method of detecting a position of a lead of an electric component which additionally includes a body from which the lead extends, the method including the steps of illuminating a lengthwise...
7069647 Method for populating a substrate with electronic components  
A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer...
7059043 Method for mounting an electronic part by solder position detection  
An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3 by a transfer head 9 and transporting and mounting the electronic parts to and on a board 2 ...
7058216 Apparatus for detecting lead coplanarity, apparatus for detecting condition of electronic component, and system for mounting electronic component  
An apparatus for detecting a coplanarity of a plurality of leads of an electronic component that laterally extend from a main body thereof, including a holding device which holds the main body of...
7051431 Component mounting control method  
In a mounting system where a chip component is mounted by a small component mounting apparatus on paste solder applied onto a board and the mounting state is inspected by a mounting inspection...
7047632 Method of mounting electronic components  
An electronic component mounting apparatus removes an electronic component supplied to a part feeder in face-up status and mounts it to a board. A flip-chip supplied from a first holding table is...
7040137 Method for improving pick reliability in a component placement machine  
The present invention features a method whereby the vacuum nozzle of each extendable vacuum spindle in a multi-head component placement machine may be calibrated during component pick/place cycles....
7036215 Method and program for obtaining positioning errors of printed-wiring board, and electronic-circuit-component mounting system  
An electronic-circuit-component mounting system including at least two component mounting units concurrently operated to mount electronic circuit components on a printed-wiring board, wherein a...
7032303 Method for mounting electric components on a printed-wiring board  
A method of sequentially mounting, on a printed-wiring board supported by a board supporting device, a plurality of electric components which are sucked and held by respective ends of a plurality...
7032304 Method for conveying printed circuit boards  
A method for conveying printed circuit boards (PCBs) in a system that includes at least two assembly modules, where each assembly module has multiple conveyors for delivering the PCBs so that while...
7020953 Apparatus and method for mounting component  
A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and...
7017263 Electronic component mounting method  
The invention provides an electronic component mounting method which improves a work efficiency and enables pickup of electronic components without fail. A component feeding unit mounted with a...
7017260 Method of making an elastomeric conductive sheet  
Devices and methods of stressing anisotropic conductive elastomer (ACE) sheet material that defines a plurality of electrical pathways through its thickness. The perimeter of the sheet is...
7017262 Component alignment methods  
A method of placing a component having leads and an alignment indicating fiducial marker is provided. The method includes detecting the alignment of the fiducial marker on the component, comparing...
7010855 Optical module  
An optical module for use in an optical device is provided. The module includes an optical component and relative reference mount. The optical component is fixed spacially relative to a...
7007377 Electronic component placement method  
An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a...
6986200 Method for mounting parts  
A method for mounting parts may include recognizing a particular part feeder where a part to be mounted is contained among a plurality of part feeders, moving a head unit to a position for picking...
6983536 Method and apparatus for manufacturing known good semiconductor die  
A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer;...
6983538 Method of mounting component on a circuit board  
A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the...
6978540 Method for pre-applied thermoplastic reinforcement of electronic components  
A method for utilizing one or more pre-formed underfill compositions in the application of surface mount components, most commonly chip scale packages (CSP's), to substrates for use in electronic...
6978041 Review work supporting system  
An object of the present invention is to increase efficiency in review work by appropriately narrowing down review work that verifies shapes of visual defects relating to an enormous amount of...
Matches 51 - 100 out of 366 < 1 2 3 4 5 6 7 8 >