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7610680 Methods for creating channels  
Methods of creating an internal channel of a fluid-ejection device are provided. One method includes encapsulating a channel core in an element of the fluid-ejection device that corresponds to the...
7610679 Method of producing inkjet printhead  
There is disclosed a method of producing an inkjet printhead including a cavity unit having therein ink passages and formed by stacking a plurality of kinds of flat plates each of which has a...
7607228 Method of manufacturing liquid ejection head  
The method manufactures a liquid ejection head in which piezoelectric bodies are formed on a diaphragm which constitutes walls of a plurality of pressure chambers. The method comprises the steps...
7607223 Electro-fluidic interconnect attachment  
An electro-fluidic interconnection. The interconnection includes a body ( 200 ) formed of a ceramic material. The body ( 200 ) is provided with an aperture ( 206 ) having a profile suitable for...
7607222 Method of manufacturing an electronic component package  
An electronic component package and a manufacturing method thereof are disclosed. A method of manufacturing an electronic component package, which includes: forming a protrusion part on a first...
7607221 Method of making an electronic device housing  
An apparatus and methods are provided for housing an electronic device. In one implementation, a method of housing an electronic device includes positioning an electronic device on a base,...
7606033 Mounting a heat sink in thermal contact with an electronic component  
A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the...
7603769 Method of coupling a surface mount device  
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
7603193 Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting  
A method of optimizing an order of component mounting which includes optimizing an order of component mounting for any one pattern among the plurality of patterns, calculating a quotient and a...
7600318 Method of manufacturing a piezoelectric vibration element for an inkjet recording head  
The present invention relates to a method of manufacturing a piezoelectric vibration element unit used for an inkjet recording head. The method includes the steps of alternately laminating...
7600314 Methods for installing a plurality of circuit devices  
A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is...
7600313 Part cartridge for mounter device  
A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are...
7596863 Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein  
A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each...
7595982 Low airflow impedance PCBA handling device  
A computer server includes a printed circuit board and a fan. The printed circuit board includes electronic components and a handling device mounted thereon. The fan is arranged to blow air across...
7594328 Method of forming a slotted substrate with partially patterned layers  
A method of forming a slotted substrate that includes patterning a thin film over a substrate so that at least a portion of the substrate within a slot region is not covered by the thin film. In...
7594321 Substrate-imprinting methods  
A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on...
7594318 Multilayer circuit board with embedded components and method of manufacture  
A multilayer substrate assembly ( 80 ) includes at least one embedded component ( 52 ) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core...
7594317 Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure  
A method of manufacturing a wiring substrate including the steps of, obtaining a temporary substrate from a prepreg, and concurrently attaching a metal foil onto at least one surface of the...
7594316 Method of manufacturing composite electronic component  
A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block...
7594309 Method of producing laminate-type piezoelectric element  
A method of producing a laminate-type piezoelectric element, wherein a ceramic laminated body therein is formed through an intermediate laminated body-forming step of forming an intermediate...
7594307 Method for manufacturing piezoelectric resonator  
A method of manufacturing a piezoelectric resonator includes forming first electrodes larger than vibrating electrodes in an area D 1 including the vibrating electrodes on obverse and reverse...
7591068 Board positioning method  
A mounter including at least two mounting stages 109 and 110 where components are mounted onto boards transported from the upstream side in transportation direction of the board 120 and then...
7591067 Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same  
A thermally enhanced coreless thin substrate with embedded chips, which mainly includes a patterned carrier metal layer, at least one chip, at least one dielectric layer and at least one wiring...
7589398 Embedded metal features structure  
A method and structure for creating embedded metal features includes embedded trace substrates wherein bias and signal traces are embedded in a first surface of the embedded trace substrate and...
7589283 Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system  
A method of making a circuitized substrate designed to substantially eliminate impedance disruptions during passage of signals through signal lines of the substrate's circuitry. The produced...
7587816 Method of improving the stability of a circuit board  
A printed circuit board includes a mounting hole for receiving a connector pin of either of a first SMC and a second SMC, and a signal line. The signal line is electrically connected to the...
7584539 Electropolishing of inkjet printer components  
A method of manufacturing an inkjet printer component and an inkjet printer component electropolishing device are provided. The method includes positioning an electrode in a fluid passageway of an...
7584537 Method for making a microcircuit card  
A method for mounting a microcircuit module in a card body to make the card non-detachable without damage includes fixing the module ( 22 ) in a cavity ( 12 ) of the card body ( 11 ) with a resin...
7584536 Process for precise alignment of packaging caps on a substrate  
The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its...
7581313 Component mounting method and mounter  
The present invention, which aims at providing a component mounting method and a mounter capable of correcting, with high accuracy, a mounting position of a component, includes: a mounting head (...
7581308 Methods of connecting an antenna to a transponder chip  
Method of connecting an antenna wire to a transponder chip. A transponder chip in a recess in a substrate, and an antenna wire mounted to the surface of the substrate and having end portions...
7581297 Method of fabricating piezoelectric vibrator and electronic apparatus and radio wave timepiece having piezoelectric vibrator  
A piezoelectric vibrator has an airtight terminal comprised of a lead terminal and a piezoelectric member. The lead terminal has an inner lead portion and an outer lead portion. The piezoelectric...
7578056 Method of coating contacts on a surface of a flip chip  
A method for encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal...
7578053 Interposer bonding device  
An interposer bonding device 3 is intended for bonding an interposer 10 having an interposer-side terminal to a base circuit sheet 20 provided with a base-side terminal. The interposer...
7574794 Method of manufacturing a touch screen  
A method for manufacturing a touch screen that deposits a conductive layer or coating directly onto a surface of a sheet or ribbon or roll of thin glass material. The coated thin glass material may...
7574793 Process of forming a laminate ceramic circuit board  
A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions...
7571541 Method of producing an inkjet printhead for an inkjet printer with a print engine controller  
A method of fabricating a plurality of inkjet nozzles on a substrate. The method comprises the steps of: (a) providing a substrate having a plurality of trenches corresponding to ink inlets; (b)...
7571540 Production method of suspension board with circuit  
A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a...
7571539 Component verification method and apparatus  
A component verification method for a mounter ( 100 ) that is capable of performing component verification with less labor. The method includes a position specification step (S 12 A) of specifying...
7571536 Method of making capacitive/resistive devices  
A method of making capacitive/resistive devices provides both resistive and capacitive functions. The capacitive/resistive devices may be embedded within a layer of a printed wiring board....
7571529 Method for forming an electronic device in multi-layer structure  
A method for forming an organic or partly organic switching device, comprising: depositing layers of conducting, semiconducting and/or insulating layers by solution processing and direct printing;...
7569081 Method for converting a fuel cell membrane web to precisely positioned membrane sheets  
A method is provided for automated converting of a web of a thin patterned catalyst-coated membrane to separate membrane sheets for fuel cell assembly. The membrane typically has a thickness of...
7565737 Manufacturing method of package substrate  
A package substrate for carrying a chip with a plurality of bumps thereon is provided. The package substrate includes a first substrate, and an interposer. The first substrate has a first circuit...
7565725 Method for forming a variable capacitor  
A method for forming a variable capacitor including a conductive strip covering the inside of a cavity, and a flexible conductive membrane placed above the cavity, the cavity being formed according...
7565723 Piezoelectric actuator and method of fabricating piezoelectric actuator  
A piezoelectric material layer is easily formed on a partial region of the substrate surface. By forming a different hardness material layer that has a different hardness from that of the substrate...
7564326 Electronic apparatus and manufacturing method of the same  
An electronic apparatus comprises at least one quartz crystal oscillator comprised of a quartz crystal oscillating circuit having a quartz crystal resonator, an amplifier, at least one resistor,...
7564116 Printed circuit board with embedded capacitors therein and manufacturing process thereof  
A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including...
7562451 Method of manufacturing actuator device for ink jet head  
A method of manufacturing an actuator device configured to prevent separation of a vibration plate and to enhance durability and reliability, and a liquid-jet apparatus are provided. The method...
7562445 Method of manufacture of an identification wristband construction  
A method of manufacture of a wristband includes the steps of providing a bottom substrate. First circuit elements are deposited on the bottom substrate. A dielectric material is deposited at...
7562444 Method for manufacturing a CPU cooling assembly  
A CPU cooling assembly includes a copper cold plate in which a pattern of ultra thin fins and channels are formed, and a copper manifold-cover in which a series of alternating inlet and outlet...