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7623034 |
High-speed RFID circuit placement method and device
A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an...
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7621042 |
Method for mounting electronic components on a substrate
A film substrate in a mounting structure of electronic components has positioning holes capable of positioning the electronic components passing therethrough. One surface of each of the electronic...
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7621041 |
Methods for forming multilayer structures
The present invention relates to methods of forming multilayer structures and the structures themselves. In one embodiment, a method of forming a multilayer structure comprises: providing a...
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7621036 |
Method of manufacturing implantable wireless sensor for in vivo pressure measurement
A method of manufacturing a sensor for in vivo applications includes the steps of providing two wafers of an electrically insulating material. A recess is formed in the first wafer, and a capacitor...
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7617600 |
Process of making an electronic circuit device having flexibility and a reduced footprint
An electronic circuit formed by removing only a baseboard from an electronic module. The electronic circuit may be formed by providing a baseboard made of a water-soluble material, applying a...
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7617596 |
Method of forming a housing for an electronic device
The described embodiments relate to electronic devices. One exemplary device includes a pair of sidewall components extending between respective top portions and bottom portions, the bottom...
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7615707 |
Printed circuit board and forming method thereof
A printed circuit board and a forming method for forming the printed circuit board are disclosed. The printed circuit board includes a substrate and a conductive layer. The substrate includes a...
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7614149 |
Methods for assembling computers
Apparatuses and methods for preventing disengagement of electrical connectors in the assembly of computers. In one embodiment, a computer system includes a chassis, an electrical component...
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7614143 |
Method of manufacturing a lighting bollard assembly
The present invention provides methods of manufacturing a bollard light assembly that provides a choice of light output by being size-adaptable depending on the choice of light output. The methods...
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7614142 |
Method for fabricating an interposer
A method for fabricating an interposer includes: forming on one primary surface of a first substrate a thin-film capacitor including a first capacitor electrode, a crystalline capacitor dielectric...
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7614128 |
Method of manufacturing piezoelectric element and method of manufacturing liquid-jet head
While a piezoelectric element is being formed by sequentially laminating a lower electrode whose uppermost layer is made of iridium, a titanium layer, a piezoelectric layer and an upper electrode...
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7610680 |
Methods for creating channels
Methods of creating an internal channel of a fluid-ejection device are provided. One method includes encapsulating a channel core in an element of the fluid-ejection device that corresponds to the...
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7610679 |
Method of producing inkjet printhead
There is disclosed a method of producing an inkjet printhead including a cavity unit having therein ink passages and formed by stacking a plurality of kinds of flat plates each of which has a...
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7607228 |
Method of manufacturing liquid ejection head
The method manufactures a liquid ejection head in which piezoelectric bodies are formed on a diaphragm which constitutes walls of a plurality of pressure chambers. The method comprises the steps...
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7607223 |
Electro-fluidic interconnect attachment
An electro-fluidic interconnection. The interconnection includes a body ( 200 ) formed of a ceramic material. The body ( 200 ) is provided with an aperture ( 206 ) having a profile suitable for...
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7607222 |
Method of manufacturing an electronic component package
An electronic component package and a manufacturing method thereof are disclosed. A method of manufacturing an electronic component package, which includes: forming a protrusion part on a first...
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7607221 |
Method of making an electronic device housing
An apparatus and methods are provided for housing an electronic device. In one implementation, a method of housing an electronic device includes positioning an electronic device on a base,...
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7606033 |
Mounting a heat sink in thermal contact with an electronic component
A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the...
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7603769 |
Method of coupling a surface mount device
Methods of coupling a surface mount device with a substrate such as a printed circuit, for example, are disclosed. A method, according to one aspect, may include coupling a holder with a substrate...
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7603193 |
Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting
A method of optimizing an order of component mounting which includes optimizing an order of component mounting for any one pattern among the plurality of patterns, calculating a quotient and a...
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7600318 |
Method of manufacturing a piezoelectric vibration element for an inkjet recording head
The present invention relates to a method of manufacturing a piezoelectric vibration element unit used for an inkjet recording head. The method includes the steps of alternately laminating...
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7600314 |
Methods for installing a plurality of circuit devices
A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is...
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7600313 |
Part cartridge for mounter device
A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are...
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7596863 |
Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein
A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each...
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7595982 |
Low airflow impedance PCBA handling device
A computer server includes a printed circuit board and a fan. The printed circuit board includes electronic components and a handling device mounted thereon. The fan is arranged to blow air across...
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7594328 |
Method of forming a slotted substrate with partially patterned layers
A method of forming a slotted substrate that includes patterning a thin film over a substrate so that at least a portion of the substrate within a slot region is not covered by the thin film. In...
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7594321 |
Substrate-imprinting methods
A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on...
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7594318 |
Multilayer circuit board with embedded components and method of manufacture
A multilayer substrate assembly ( 80 ) includes at least one embedded component ( 52 ) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core...
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7594317 |
Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure
A method of manufacturing a wiring substrate including the steps of, obtaining a temporary substrate from a prepreg, and concurrently attaching a metal foil onto at least one surface of the...
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7594316 |
Method of manufacturing composite electronic component
A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block...
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7594309 |
Method of producing laminate-type piezoelectric element
A method of producing a laminate-type piezoelectric element, wherein a ceramic laminated body therein is formed through an intermediate laminated body-forming step of forming an intermediate...
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7594307 |
Method for manufacturing piezoelectric resonator
A method of manufacturing a piezoelectric resonator includes forming first electrodes larger than vibrating electrodes in an area D 1 including the vibrating electrodes on obverse and reverse...
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7591068 |
Board positioning method
A mounter including at least two mounting stages 109 and 110 where components are mounted onto boards transported from the upstream side in transportation direction of the board 120 and then...
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7591067 |
Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same
A thermally enhanced coreless thin substrate with embedded chips, which mainly includes a patterned carrier metal layer, at least one chip, at least one dielectric layer and at least one wiring...
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7589398 |
Embedded metal features structure
A method and structure for creating embedded metal features includes embedded trace substrates wherein bias and signal traces are embedded in a first surface of the embedded trace substrate and...
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7589283 |
Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system
A method of making a circuitized substrate designed to substantially eliminate impedance disruptions during passage of signals through signal lines of the substrate's circuitry. The produced...
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7587816 |
Method of improving the stability of a circuit board
A printed circuit board includes a mounting hole for receiving a connector pin of either of a first SMC and a second SMC, and a signal line. The signal line is electrically connected to the...
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7584539 |
Electropolishing of inkjet printer components
A method of manufacturing an inkjet printer component and an inkjet printer component electropolishing device are provided. The method includes positioning an electrode in a fluid passageway of an...
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7584537 |
Method for making a microcircuit card
A method for mounting a microcircuit module in a card body to make the card non-detachable without damage includes fixing the module ( 22 ) in a cavity ( 12 ) of the card body ( 11 ) with a resin...
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7584536 |
Process for precise alignment of packaging caps on a substrate
The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its...
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7581313 |
Component mounting method and mounter
The present invention, which aims at providing a component mounting method and a mounter capable of correcting, with high accuracy, a mounting position of a component, includes: a mounting head (...
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7581308 |
Methods of connecting an antenna to a transponder chip
Method of connecting an antenna wire to a transponder chip. A transponder chip in a recess in a substrate, and an antenna wire mounted to the surface of the substrate and having end portions...
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7581297 |
Method of fabricating piezoelectric vibrator and electronic apparatus and radio wave timepiece having piezoelectric vibrator
A piezoelectric vibrator has an airtight terminal comprised of a lead terminal and a piezoelectric member. The lead terminal has an inner lead portion and an outer lead portion. The piezoelectric...
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7578056 |
Method of coating contacts on a surface of a flip chip
A method for encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal...
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7578053 |
Interposer bonding device
An interposer bonding device 3 is intended for bonding an interposer 10 having an interposer-side terminal to a base circuit sheet 20 provided with a base-side terminal. The interposer...
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7574794 |
Method of manufacturing a touch screen
A method for manufacturing a touch screen that deposits a conductive layer or coating directly onto a surface of a sheet or ribbon or roll of thin glass material. The coated thin glass material may...
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7574793 |
Process of forming a laminate ceramic circuit board
A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions...
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7571541 |
Method of producing an inkjet printhead for an inkjet printer with a print engine controller
A method of fabricating a plurality of inkjet nozzles on a substrate. The method comprises the steps of: (a) providing a substrate having a plurality of trenches corresponding to ink inlets; (b)...
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7571540 |
Production method of suspension board with circuit
A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a...
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7571539 |
Component verification method and apparatus
A component verification method for a mounter ( 100 ) that is capable of performing component verification with less labor. The method includes a position specification step (S 12 A) of specifying...
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