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7234231 |
Method of manufacturing a lead frame
A manufacturing method of an optical coupling device includes, preparing an elongated lead frame on which a plurality of tie bars are placed between a pair of side rails that are mutually in...
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7234230 |
Composite circuit board and method for manufacturing the same
A composite circuit board comprises multiple soft panels evenly mounted on a rigid panel. The soft panels are positioned on the rigid panel in proper alignment via locating pins on the rigid panel...
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7234217 |
Device for coupling PCB sheet having position deciding jig part
A method and a device for coupling a PCB sheet are disclosed. If a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is...
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7234214 |
Methods for making thick film elements
A method of producing at least one thick film element, including depositing a material on a surface of at least one first substrate to form at least one thick film element structure having a...
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7231701 |
Modular PCB and method of replacing a malfunctioned module of the PCB
Modular PCB and method of replacing one of a plurality of modules of a first PCB are provided. One embodiment of the method includes checking each module of the first PCB and each of a plurality of...
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7231707 |
Method of manufacturing planar inductors
Method of forming a ferromagnetic layer on at least one surface of a dielectric material that may be serve as an inductive core on a printed circuit board or a multichip module. Conductive leads...
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7228622 |
Electronic device carrier and manufacture tape
A method and machine-readable medium are described for a flexible tape constructed of a material suitable to convey electronic devices through an entire manufacturing process without removing the...
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7230829 |
Overmolded electronic assembly with insert molded heat sinks
An overmolded electronic assembly includes a substrate, a plurality of surface mount technology (SMT) integrated circuit (IC) chips, a plurality of heat sinks, a backplate and an overmold material....
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7228620 |
Tape guide and magazine at a component machine
A tape guide for guiding a carrier tape in a component mounting machine, a tape magazine for receiving the tape guide, and a system including the tape guide and the tape magazine. The carrier tape...
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7222414 |
Component transfer systems
A system for transferring electrical components. The system may comprise a plurality of electrical components. Each of the components may include leads and a physically asymmetric fiducial marker...
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7222413 |
Board transferring apparatus including identifying devices, and component mounting apparatus including the board transferring apparatus
The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in...
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7222419 |
Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package
A method of fabricating a thermal conductive plug of a ceramic substrate of a multi-chip package. A plurality of conductive openings and thermal conductive openings are formed on green tapes. A...
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7219421 |
Method of a coating heat spreader
A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally...
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7219428 |
Method of producing an ink-jet printing head
A method of producing an ink-jet printing head, the method including: forming a pre-unit in which nozzles and a common ink chamber are formed; forming pressure chambers in a cavity plate through...
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7220921 |
Sheet-like board member and method of manufacturing a semiconductor device
In the present invention there is formed a sheet-like board member 50 having conductive coating films, such as first pads 55 and die pads 59 , formed thereon or a sheet-like board member 50 ...
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7219429 |
Method for forming a microelectromechanical fluid ejection device
A microelectromechanical fluid ejection device is formed upon a wafer upon which an interconnect layer is disposed. The fluid ejection device includes a number of fluid passageways that are...
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7219419 |
Component mounting apparatus including a polishing device
Component ( 3 ) is pressed onto a circuit board ( 4 ) so that their respective metal interconnects ( 5 ), ( 6 ) are in close contact with each other, and ultrasonic vibration is applied to the...
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7219418 |
Method to prevent damage to probe card
Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical...
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7216419 |
Method of manufacturing a high-frequency coil device
In a high-frequency coil device having small dispersion in coil inductance and suitable for use in GHz band and a method of manufacturing the high-frequency coil device, a spirally-shaped...
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7216422 |
Method of forming a capacitor assembly in a circuit board
A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling...
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7216406 |
Method forming split thin film capacitors with multiple voltages
A method for forming a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful in space...
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7213330 |
Method of fabricating an electronic device
A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact...
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7213332 |
Method component on a circuit board
A method of mounting a component on electrodes on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solders for the...
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7213336 |
Hyperbga buildup laminate
A method and structure for forming an electronic structure that comprises a redistribution structure on a circuitized substrate. The redistribution structure includes N dielectric layers (N≧2)...
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7213327 |
Method for fabricating embedded thin film resistors of printed circuit board
A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit...
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7213323 |
Method of forming an electronic pressure sensitive transducer on a printed circuit board
The cost and complexity of an electronic pressure sensitive transducer are decreased by constructing such a transducer directly on a printed circuit board containing support electronics. Conductive...
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7213331 |
Method for forming stencil
A method of forming a stencil for the manufacture of semiconductor devices includes defining a plurality of slightly spaced segmental annular openings in a stencil plate. The spacing between the...
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7210224 |
Method for forming an antifuse
An antifuse including a bottom plate having a plurality of longitudinal members arranged substantially parallel to a first axis, a dielectric layer formed on the bottom plate, and a top plate...
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7210222 |
Power supply control method
The present invention provides a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately...
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7204017 |
Manufacturing method of a modularized leadframe
A manufacturing method of a modularized leadframe, using a first mold set to contact and hold the upper surface of rows of multiple block leads, using a second mold set to contact and hold at least...
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7204008 |
Method of making an electronics module
An electronics module is assembled by demountably attaching integrated circuits to a module substrate. The module is then tested at a particular operating speed. If the module fails to operate...
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7202420 |
Methods to prevent mechanical flexure related BGA failure
Methods and associated apparatus of reducing stress in a package are described in which a package is provided comprising an array of interconnects that are connected to a substrate, and then...
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7200926 |
Parts mounting method
A suction head is inserted between first and second cameras relatively disposed facing one another with aligned optical axes, so that the first camera takes images of a head reference mark on the...
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7200924 |
Method of packaging electronic parts
A method of fabricating electronic parts includes the steps of: mounting electronic elements in regular cavities that are two-dimensionally arranged on a baseboard on which dummy cavities are...
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7197819 |
Method of assembling an electric power
A method of assembling and providing an electric power apparatus. The method uses a heat resistant housing having a structure adapted to accommodate and retain a power circuit card and also...
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7198693 |
Microelectronic device having a plurality of stacked dies and methods for manufacturing such microelectronic assemblies
Systems and methods for assembling microelectronic devices that have a base die and a conventional wire-bond die stacked on the base die. In one embodiment of a method in accordance with the...
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7193157 |
Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip
A flexible circuit board is provided to prevent unsuccessful interconnection between the wirings of the flexible circuit board and the output terminals of a semiconductor chip, the flexible circuit...
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7191507 |
Method of producing a wireless communication device
A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless...
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7191511 |
Electronic component placement machine having camera units with vertically overlaid apertures
An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a...
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7191516 |
Method for shielding integrated circuit devices
A high reliability radiation shielding integrated circuit device comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the...
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7191520 |
Method of optmizing inkjet printheads using a plasma-etching process
A method for creating an inkjet chamber. The method comprises the steps of firstly providing a substrate having a nozzle opening and secondly etching the substrate through the nozzle opening by...
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7191019 |
Dynamic line configuration
A dynamically-reconfigurable production line includes an item-interaction unit and an item-identification unit configured to read item data from an item approaching the item-interaction unit. On...
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7188413 |
Method of making a microelectronic package
A microelectronic element is formed from a structure including metal layers on top and bottom sides of a dielectric. Apertures are formed in the top metal layer, and vias are formed in the...
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7188410 |
Insertion of electrical component within a via of a printed circuit board
A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed...
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7188409 |
Method for rejecting component during a placement cycle
The present invention features a method wherein a component in a multi-head component placement machine is rejected during the placement cycle. A component is imaged and the image processed using...
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7185421 |
Method and apparatus for manufacturing multilayer printed wiring board
The present invention has an object to provide a producing method and producing apparatus of multilayered printed-circuit board that has eliminated the resin flow and resolved the problems of board...
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7185422 |
Part mounting apparatus and part mounting method
A component mounting apparatus and a component mounting method which improve accuracy and a rate of placement of components onto a circuit-formed member. A component sucked by a suction nozzle is...
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7185425 |
Method for connecting printed circuit boards
By forming a terminal at a tip of a lead part of a lead frame, and by fixing this terminal and a connecting pad which was formed on an upper surface of a first printed circuit board, the lead frame...
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7185426 |
Method of manufacturing a semiconductor package
A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of...
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7185427 |
Method for making electrical connections to an element on printed circuit board
The present invention is directed to a method for an electrically conductive structure on a printed circuit board for connecting an element on the printed circuit board with other elements. The...
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