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7343675 |
Method of constructing a structural circuit
A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a...
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7340828 |
Method for producing metal/ceramic bonding circuit board
There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required...
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7341642 |
Manufacturing method for electric device
The present invention provides a method of manufacturing an electric device, wherein an adhesive applied on a flexible wiring board is heated to a first temperature to lower its viscosity to a...
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7340831 |
Method for making liquid discharge head
A method for making a liquid discharge head including liquid discharge openings, a liquid channel having pressure chambers communicating with the liquid discharge openings, and piezoelectric...
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7340826 |
Method for producing an electronic device connected to a printed circuit board
A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board...
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7339118 |
Printed wiring board and method for manufacturing the same
In a printed wiring board, an odd number (n) of conductive layers ( 11 - 13 ) and insulating layers ( 21 - 23 ) are alternately laminated upon each other. The first conductive layer ( 11 ) is a...
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7337540 |
Method of manufacturing a structure body bonding with a glass substrate and semiconductor substrate
Provided is technology capable of avoiding complex processes and high costs while securing the protection of the functional unit upon forming a device including a glass substrate. A manufacturing...
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7334335 |
Method of manufacturing a monolithic ink-jet printhead
A monolithic ink-jet printhead, and a method of manufacturing the same, includes a substrate having an ink chamber, an ink channel, and a manifold, a nozzle plate formed on the substrate, a nozzle,...
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7331103 |
Magazine, tray component feeding device, and component mounting device
A magazine is provided with two opening portions that enable insertion and extraction of a tray and are approximately orthogonal to each other, and a regulation portion for regulating insertion and...
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7331106 |
Underfill method
A process for selectively depositing a filled underfill material onto a die surface without covering solder bumps present on the die. The process entails microjetting a polymer matrix material, a...
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7331105 |
Method for placing components by means of at least one component placement unit
Provided is a method and system for placing components by means of at least one component placement unit wherein the component placement unit is moved over a distance between a component pickup...
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7328505 |
Method for manufacturing multilayer circuit board
A multilayer circuit board that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a...
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7330773 |
Multiple insertion head
The invention relates to a multiple insertion head for mounting components onto substrates, the insertion head including a carrier which is arranged in such a way that it can rotate about a...
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7328504 |
Method for manufacturing circuit board with built-in electronic components
Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S...
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7322104 |
Method for producing an ink jet head
An ink jet head includes a substrate having a flow path construction member constructing a plurality of discharge ports for discharging ink and a plurality of ink flow paths corresponding thereto,...
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7318277 |
Method of manufacturing a liquid jet head
A method of manufacturing a liquid jet head includes the steps of: forming a piezoelectric element on one plane of a passage-forming substrate with a vibration plate interposed therebetween, and...
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7316060 |
System for populating a circuit board with semiconductor chips
A system for populating a three dimensional array of semiconductor chips is disclosed. The system facilitates the surface mounting of semiconductor chips with chip carriers to achieve the three...
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7313862 |
Method of mounting components on a PCB
A printed wiring board is disclosed. The printed wiring board includes a board recognition mark formed of a conductive foil, a first component land covered with resist, and a second component land...
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7310872 |
Computer enclosure
A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite...
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7310874 |
Method for manufacturing a potassium niobate deposited body
A potassium niobate deposited body includes a substrate, an electrode layer formed above the substrate, and a potassium niobate layer formed above the electrode layer. The potassium niobate layer...
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7308754 |
Methods for trimming electrical parameters in an electrical circuit
Power supply switching regulator electrical circuit trimming methods. A trimming method includes assembling one or more components of a power supply switching regulator electrical circuit onto a...
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7305743 |
Method of producing piezoelectric ceramic device
A piezoelectric ceramic compound expressed by a basic formula of Pb(Zn 1/3 Nb 2/3 ) a Zr x Ti y O 3 (where 0.90<a+x+y<1.00) is provided. The starting materials for the piezoelectric ceramic...
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7302751 |
Method of fabricating a rat's nest RFID antenna
A method of fabricating a radio frequency identification (RFID) antenna on a substrate is disclosed. The antenna is fabricated on a substrate that includes already fabricated RFID chips. The...
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7299539 |
Apparatus for mounting components on substrate
An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an...
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7299546 |
Method for manufacturing an electronic module
An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer ( 1 ) and a conductive layer on the...
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7299528 |
Method for forming a multi-frequency surface acoustic wave device
Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide...
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7299529 |
Film bulk acoustic resonator (FBAR) process using single-step resonator layer deposition
A process comprising, in a vacuum, depositing a bottom electrode layer and a piezoelectric layer over a cavity in a substrate, the cavity being filled with a sacrificial material, patterning and...
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7299545 |
Alignment method and mounting method using the alignment method
Positioning recognition marks are read by movable recognition device for positioning objects to be bonded to each other. An alignment method includes a step of reading the recognition marks during...
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7296350 |
Method for fabricating a drop generator
A method for fabricating a drop generator with a uniquely formed nonconductive mandrel, which when encapsulated with electroplated metal, shapes and defines the internal ink channel entails...
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7296345 |
Method for manufacturing a memory device
A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing...
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7293356 |
Method of fabricating printed circuit board having embedded multi-layer passive devices
The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board...
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7293359 |
Method for manufacturing a fluid ejection device
A method for manufacturing a fluid ejection device includes providing a sacrificial structure substantially overlying a semiconductor substrate. The structure has a shape configured to define an...
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7294530 |
Method for encapsulating multiple integrated circuits
A device, such as an integrated circuit or an electronic circuit component is affixed to a substrate. A first encapsulation structure encases a first integrated circuit and has at least one groove...
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7294394 |
Phase change material containing fusible particles as thermally conductive filler
According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible...
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7290330 |
Coupling invertible and pluggable module to a circuit board
A system including a circuit board and several pluggable modules coupled to the circuit board. The several pluggable modules are insertable through side-by-side slots in an enclosure in which the...
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7292448 |
Circuit substrate
A circuit substrate includes a first rigid substrate having a plurality of land portions located at a predetermined interval on one surface, a second rigid substrate having a plurality of second...
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7290331 |
Component mounting apparatus and component mounting method
In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component...
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7290327 |
Component mounting apparatus employing temperature maintenance of positioning accuracy
A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic...
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7290336 |
Method of fabricating an array of multi-electroded piezoelectric transducers for piezoelectric diaphragm structures
A circuit provides energy to a plurality of piezoelectric diaphragm structures formed in a two-dimensional array. Each piezoelectric diaphragm structure includes a piezoelectric element in...
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7290323 |
Method for manufacturing sensing devices to image textured surfaces
A fingerprint-sensing device with a sensor array that does not use active switching elements is fabricated on a base. Sensor support integrated circuits, which contain processing and addressing...
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7288437 |
Conductive pattern producing method and its applications
An improved method of forming an electrode pattern on a substrate is described. The substrate is coated with a first conductive film and subjected to baking. On the first conductive film is then...
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7284318 |
Apparatus for mounting semiconductor chips
An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a...
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7284320 |
Multilayer printed wiring board and method of manufacturing the same
A multilayer printed wiring board having a wiring lead-out port has a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit...
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7284326 |
Method for manufacturing a micro-electromechanical nozzle arrangement on a substrate with an integrated drive circutry layer
A method for manufacturing a micro-electromechanical printer nozzle arrangement on a substrate having a layer of integrated drive circuitry includes etching a nozzle region through the layer of...
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7284311 |
Multilayer wiring board, manufacturing method therefor and test apparatus thereof
A built-in component type multilayer wiring board includes at least one resin layer and at least one frame resin layer. The resin layer includes electronic components buried therein. The frame...
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7284317 |
Method of producing printed circuit board with embedded resistor
Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that...
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7284307 |
Method for manufacturing wiring board
A method for manufacturing a wiring board, comprising the steps of: forming a first electrode layer having first and second opening portions, forming a dielectric layer formed on the first...
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7284322 |
Process for producing electro-optic hybrid circuit board
The present invention provides a process for producing an electro-optic hybrid circuit board, which comprises the steps of: forming an undercladding layer on a metal foil side of a metal transfer...
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7281323 |
Method for mounting electronic components
A method for mounting electronic components is provided. The method comprises: rotating at least one rotation housing, and thereby correcting positions of a plurality of nozzle spindles depending...
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7281330 |
Method of manufacturing left-handed and right-handed printhead modules
A method of manufacturing a plurality of printhead modules, at least some of which are capable of being combined in pairs to form bilithic pagewidth printheads, the method comprising the step of...
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