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7426781 |
Placement unit for mounting electric components onto substrates
A placement unit for mounting electric components onto substrates has means for moving perpendicularly to the substrate, a housing, a built-in, rotatable holder for the components, and a rotary...
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7421780 |
Methods for fabricating thermal management systems for micro-components
Methods for fabricating thermal management systems for micro-component devices are described herein. The methods may include initially overlaying a target substrate with a blank that is in sheet...
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7421777 |
Method of manufacturing multilayer wiring substrate using temporary metal support layer
The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on...
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7418772 |
Method for manufacturing a surface acoustic wave
In a manufacturing method for a SAW apparatus a first insulating layer is formed on the entire surface of a piezoelectric LiTaO 3 substrate. By using a resist pattern used for forming an IDT...
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7415761 |
Method of manufacturing multilayered circuit board
An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22 , the thickness of which is reduced (to 3 μm) by performing etching to lower the...
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7415759 |
Method and apparatus for mounting semiconductor chips
A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table,...
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7409761 |
Electronic component mounting apparatus and method of mounting electronic components
In an electronic component mounting process for mounting electronic components ( 6 ) to a substrate, each of the electronic components having an adhesive layer on a surface to be bonded to the...
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7406756 |
Method for manufacturing a piezoelectric resonator
A method for manufacturing a piezoelectric resonator is provided including: forming a resonator element having a plate-like base and a plurality of arms extending laterally from the base on a...
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7405364 |
Decoupled signal-power substrate architecture
A device comprises a substrate core having power paths through it and an input/output signal routing layer upon the core substrate. An integrated circuit may be arranged on the routing layer such...
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7401402 |
Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor
The invention relates to a method for high-frequency tuning a high-frequency plug connector, comprising a printed circuit board that has both contact points for high-frequency contacts as well as...
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7401405 |
Method of fabricating inkjet nozzles having associated ink priming features
A method of fabricating a plurality of inkjet nozzles on a substrate, each nozzle comprising a nozzle chamber having a roof spaced apart from said substrate and sidewalls extending from said roof...
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7398588 |
SOI component comprising margins for separation
A method for producing a component is provided, in particular a deformation sensor, having a sensor element which includes at least one region that is sensitive with respect to expansion or...
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7395129 |
Method for optimization of an order of component mounting, apparatus using the same, and mounter
An optimizing apparatus for optimizing a mounter equipped with a line gang pickup head which picks up a plurality of components and mounts them on a board. The apparatus includes a nozzle set...
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7389569 |
Method for manfacturing an acoustic matching member
A method for manufacturing an acoustic matching member, the acoustic matching member being incorporated into an ultrasonic transducer for transmitting and receiving ultrasonic waves, and including:...
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7389570 |
Surface acoustic wave device manufacturing method, surface acoustic wave device, and communications equipment
After electrode patterning on an electrode forming surface of a piezoelectric substrate 2 (FIG. 1 ( b )), a conductor layer is formed on an electrode non-forming surface of the piezoelectric...
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7388158 |
Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
In one embodiment, a substrate assembly includes a flat substrate having oppositely disposed planar surfaces and a conductor. The conductor is formed on at least one of the planar surfaces and...
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7383621 |
Method of producing a piezoelectric ceramic
A piezoelectric contains comprises a plurality of piezoelectric particles made from a piezoelectric material such as lead titanate zirconate and a dielectric made from a dielectric material, such...
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7380337 |
Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module
A first cavity in a holder is provided with a plurality of spiral contactors and a thermosetting adhesive member. In a state where a first bare chip is mounted in the first cavity and spherical...
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7380333 |
Chip resistor fabrication method
A method of making a chip resistor is provided. The method includes the following steps. First, a resistive element is provided on a substrate. Then, a resin layer is formed on the substrate to...
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7377031 |
Fabrication method of semiconductor integrated circuit device
A method of fabricating a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include...
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7377034 |
Method for flexible circuits
A flexible printed circuit improves data transfer rates by disposing ground wires in a ground plane proximate to signal wires disposed in a signal channel plane. One or more ground wires is...
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7377030 |
Wiring board manufacturing method
The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is...
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7377028 |
Electrical connector insertion and removal tool
A connector insertion and removal tool for an electrical system including a circuit board and at least one electrical connector therefor includes a first portion configured for coupling to a first...
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7370410 |
Method of manufacturing a device, device, non-contact type card medium, and electronic equipment
Wirings 2 B 1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent...
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7370411 |
Wiring board manufacturing method
A method of manufacturing a wiring board includes: forming a first insulating layer on a supporting board; mounting at least one reinforcing member on the first insulating layer; mounting at least...
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7370396 |
Method for manufacturing an electronic component
An electronic component includes a substrate; a piezoelectric material layer supported directly or indirectly by the substrate; a first electrode arranged on a surface of the piezoelectric material...
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7368032 |
RFID label technique
An RFID webstock containing a relatively high pitch-density array of semiconductive chips is provided and joined to a web bearing relatively widely spaced antennas in a continuous process. The RFID...
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7368666 |
Surface-mounting type electronic circuit unit without detachment of solder
A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of...
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7363694 |
Method of testing using compliant contact structures, contactor cards and test system
A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein....
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7363704 |
RFID tag and method of manufacturing RFID tag
A method of manufacturing an RFID tag includes forming through-holes on a sheet to embed a plurality of electronic components, such as IC chips; forming a substrate by sticking a bottom plate sheet...
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7361843 |
AC coupling of power plane sections using improved capacitance stitching material
An information handling system has a printed circuit board with a split power plane having a plurality of sections that may be used for distributing different voltages on a single conductive foil...
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7360293 |
Method of manufacturing recognition sensor
A method of manufacturing a surface shape recognition sensor. A sacrificial film is formed on an interlevel dielectric to cover a lower electrode while keeping an upper portion of a support...
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7360307 |
Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors
A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure...
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7361842 |
Apparatus and method for an embedded air dielectric for a package and a printed circuit board
A method, apparatus, and system for a printed circuit board (PCB) and package with an embedded air dielectric includes a conductor formed on a surface of a first core layer, a conductor layer...
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7360306 |
Process for producing a cover with a glass pane and electrical function elements
A process for producing a cover ( 11 ) with a glass pane ( 14 ) for a motor vehicle roof, in which, first, a combination film ( 10 ) with a shatter prevention film and electrical function elements...
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7362562 |
Electronic unit of radio system and method of producing the same
The invention relates to a method of producing an electronic unit of a radio system automatically, an electronic unit of a radio system and an electronic component. The method of producing an...
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7356918 |
Component mounting method
An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no...
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7356919 |
Component mounting method
A component mounting apparatus has a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a...
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7356894 |
Method of producing a micro-actuator
In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to...
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7353594 |
Component mounting method
When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is...
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7353596 |
Component mounting method
In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto...
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7353593 |
Method for assembling micro structures
A method for making three-dimensional structures comprises providing a plurality of components, each of which is moveably coupled to a substrate. The components may be pivotally coupled to the...
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7353604 |
Method for manufacturing an inkjet head
A method for manufacturing an inkjet head includes producing a flow path unit, producing an actuator unit, bonding the actuator unit with the flow path unit to produce a bonded structure; measuring...
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7353598 |
Assembly comprising functional devices and method of making same
Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional...
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7353595 |
Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon
A tape substrate includes IC lands electrically connected to pins of a driver IC (integrated circuit), circuit board terminal lands electrically connected to an external circuit board, test lands...
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7350295 |
Method of fabricating multi-layered printed circuit board for optical waveguides
A method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the...
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7350298 |
Method for fabricating circuit board with conductive structure
A method for fabricating a circuit board having a conductive structure is disclosed. The method includes: forming first and second insulating protective layers respectively on first and second...
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7350285 |
Method of manufacturing a switch panel to be disposed close to a magnetic sensor
A method of manufacturing a movable contact unit includes manufacturing a movable contact, sticking the movable contact to a base sheet made of insulating resin, and applying demagnetization to the...
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7350281 |
Method of protecting a capacitor
An electric device includes an electric element, such as a wound film capacitor, with power input and output leads. The electric element includes a coating layer of parylene that provides moisture...
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7350292 |
Method for affecting impedance of an electrical apparatus
A method for affecting an impedance of a portion of an electrical circuit loop in an electrical circuit apparatus includes providing an electrical circuit apparatus having at least a portion of an...
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