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6839960 |
Method for mounting electronic parts on a board
Method for taking out electronic parts from a parts supply section by a transfer head and transporting and mounting the electronic parts to and on a board positioned on a transfer passage. In an...
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6839959 |
Component mounting apparatus
There are disclosed an apparatus for mounting electronic components, with which the electronic components can be reversed, up and down, and mounted onto a circuit board in a short mounting process...
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6836960 |
Board transfer apparatus, board transfer method, and component mounting apparatus
The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in...
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6836959 |
Size reduction of chip mounting system
A chip mounting system includes a substrate supply apparatus and a chip supply apparatus. The substrate supply apparatus includes a transport conveyor formed to be moved for a length corresponding...
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6836961 |
Ceramic packaging method employing flip-chip bonding
In a ceramic packaging method employing a flip-chip bonding, a gold bump is formed on a chip bond pad in a wafer and the wafer is divided into a plurality of chips by a die sawing. A Cu pattern and...
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6836953 |
Method of producing a biometric sensor
In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip...
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6834419 |
Method of producing sensor element
The invention relates to an electromechanical drive or a sensor element composed of piezoelectric elements arranged in the form of a stack. The drive or the sensor element is intended for...
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6834427 |
Method for depopulating of a ball grid array to allow via placement
The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid...
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6832420 |
Method of manufacturing a thin film capacitor array
An electronic device has a plurality of capacitors in an ultra-small integrated package. The device has a plurality of terminal structures on one terminal side of the package to permit inverted...
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6826828 |
Electrostatic discharge-free container comprising a cavity surrounded by surfaces of PMMA-poly covered metal-PMMA
A ESD-free container is provided. A compound material is used for the creation of the container, the compound material comprising a metallic material that is wedged between layer of polymide...
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6826829 |
Method for attaching a die with a low melting metal
A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding...
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6823586 |
Method of mounting a butterfly package on a PCB
A method of mounting a package such as a Butterfly package to a printed circuit board in order to make efficient use of the board's real estate is described. According to a preferred embodiment of...
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6820329 |
Method of manufacturing multi-chip stacking package
The present invention discloses a method of manufacturing a multi-chip stacking package. The characteristic of the invention is that after the alignment of the bumps of at least two chips, welded...
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6820328 |
Method of removing heat from an electronic assemblage
A method removes heat from a densely packed electronic assemblage. Densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for...
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6817091 |
Electronic assembly having solder thermal interface between a die substrate and a heat spreader
An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die...
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6817093 |
Electronic component and manufacturing method therefor
A plurality of surface-mounting components are mounted on a mother printed-circuit board provided with component-connecting electrodes, engagement holes, and case-fixing electrodes provided inside...
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6818477 |
Method of mounting a component in an edge-plated hole formed in a printed circuit board
A printed circuit board (PCB) assembly comprising a PCB having a top circuitry layer and a bottom layer with a hole through the PCB, a component, and a pallet. The printed circuit board...
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6816754 |
Method and system for controlling drive of a robot
A method and system for controlling drive of a robot having two or more drive axes and driven in accordance with an action program transmitted from a system controller to a robot controller by a...
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6807725 |
System for mounting of electric components
A system of mounting a plurality of electric components on a circuit substrate and thereby producing an electric circuit including a system for performing the following steps of taking, immediately...
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6807727 |
Manufacturing and carrier system with feeder/programming/buffer system
A circuit board manufacturing system is provided which includes a production assembly line with a carrier handling system for a plurality of feeder/programming/buffer systems. The...
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6807730 |
Pad structure of semiconductor package
A pad structure for a semiconductor package is provided by forming solder lands at predetermined locations on a printed circuit board. First circular pad portions are formed protruding laterally...
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6807731 |
Method for forming an electronic assembly
An overmolded electronic assembly having an electromagnetic interference shield, in the form of a thin metal film or foil, coupled to the top of or within an overmolded body. The shield effectively...
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6809268 |
Printed wiring substrate and method for fabricating the same
A printed wiring substrate 1 includes a core substrate 2 having a front surface 3 and a back surface 4 and an chip capacitor 10 serving as an electronic component embedded via a resin 13...
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6804882 |
Method for manufacturing a coil device
A coil device includes terminal electrodes each including a bottom-surface electrode provided on a bottom surface of a flange, side-surface electrodes provided on side surfaces of the flange, and...
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6802918 |
Fabrication method for adhesive pressure bonding two components together with closed-loop control
Two components are bonded together in a bonding apparatus using a bonding medium of malleable metallic spheres and a curable adhesive. The two components are bonded by positioning the components in...
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6802119 |
Conductive pedestal on pad for leadless chip carrier (LCC) standoff
A device and method for insuring the separation between a leadless chip carrier and printed wiring board, comprising aligning and attaching conductive pedestals to contact pads of either member and...
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6803527 |
Circuit board with via through surface mount device contact
A circuit board apparatus and a method for a circuit board. An embodiment of a circuit board includes a first layer and a second layer; a substrate between the first layer and the second layer; a...
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6802118 |
Method for surface mounting electronic components on a printed circuit board
A method of mounting electrical components on a printed circuit board includes moving the printed circuit board to a first mounting location, picking up a plurality of electrical components with a...
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6796024 |
Method for making semiconductor device
According to the method of producing a semiconductor device, the substrate is provided with an opening formed at a substantially central position, interconnections and joining parts. The heat...
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6796025 |
Method for mounting electronic part and paste material
In a method for mounting an electronic part on a mounting substrate in that projection electrodes provided on the electronic part are welded by fusion to join connection terminals provided on the...
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6796481 |
Chip mounting method
A method for mounting a chip on a substrate includes applying the underfill agent onto at least one of the substrate and the chip and moving the chip to the substrate to bring the bump into contact...
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6796023 |
Method and apparatus for integrated circuit storage tube retention pin removal and insertion
While the manufacturing of integrated circuits (IC) has become a mostly automated process, the loading of the ICs into storage and shipping tubes 105 still requires a large amount of human...
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6792674 |
Apparatus for mounting electronic components
A recognition camera images an electronic component, and a recognition processing unit performs recognition processing of the electronic component based on the result of the imaging. The...
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6792676 |
Apparatus and method for mounting electronic parts
An electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and...
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6794737 |
Spring structure with stress-balancing layer
A stress-balancing layer formed over portions of a spring metal finger that remain attached to an underlying substrate to counter internal stresses inherently formed in the spring metal finger. The...
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6792667 |
Fully automatic process for magnetic circuit assembly
In accordance with the invention, a high quality magnetic device is produced without manual intervention by the step of providing a substrate including an aperture and conductive coil extending...
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6789312 |
Method of attaching an integrated circuit to a chip mounting receptacle in a PCB with a bolster plate
A bolster plate is attached to a printed circuit board and acts as a stiffener that reduces bending in the overall assembly during the attachment of an integrated circuit chip to the printed...
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6788545 |
Composite electronic component and method of producing same
A high frequency composite electronic component includes a laminate and a metallic case. The laminate is produced by laminating plural ceramic green sheets and includes circuit elements such as...
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6785960 |
Wave solder application for ball grid array modules
A method for fabricating a printed circuit board assembly comprising a via, wherein the method inhibits the flow of molten solder into the via during a wave soldering step, thereby preventing heat...
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6782601 |
Method of making interactive information closure
A method of making an interactive information package, including an interactive information closure including a radio frequency identification device, contemplates that a microelectronics assembly...
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6782616 |
Connection arrangements for electrical devices
The present disclosure relates to connection arrangements for electrical devices. In the connection arrangements, an electrical device having at least one ledge that includes a plurality of contact...
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6782611 |
Method of assembling a multi-chip device
A method of assembling a multi-chip device may include coupling solder balls only to selected ones of the conductive pads on an interposer with cache memory devices. The cache memory devices are...
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6782615 |
Method of surface-mounting electronic components
A plurality of electronic components having conductive connecting members are surface-mounted to a target surface of a circuit board by specifying terminal-forming areas that are each no greater...
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6782606 |
Tape guide and magazine at a component machine
A tape guide for guiding a carrier tape in a component mounting machine, a tape magazine for receiving the tape guide, and a system including the tape guide and the tape magazine. The carrier tape...
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6782617 |
Electrical equipment and method of assembling same
Electrical equipment is disclosed that comprises a front-mounting electrical component, such as an IEC connector, a switch, a circuit breaker or a lamp or indicator. The electrical component has a...
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6779260 |
Overmolded electronic package including circuit-carrying substrate
An overmolded electronic package includes a circuit-carrying substrate and a connector housing or shroud interconnected via a suitable interconnection arrangement. Some embodiments may include a...
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6779253 |
Grip tip of gripper for parts having different shape in surface mount device
A gripper having a grip tip for parts having different shapes is provided for a surface mount device. The gripper includes a piston installed inside of a through hole formed in a holder, and lifted...
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6778247 |
Method for cutting tape carrier packages of a LCD and LCD structure
A cutting method of a tap carrier package of a liquid crystal display. The cutting method cuts a film comprising a first straight layout along a predetermined direction on a wiring layer comprising...
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6775906 |
Method of manufacturing an integrated circuit carrier
A method of manufacturing an integrated circuit carrier includes providing a substrate. At least one receiving zone for an integrated circuit is demarcated on the substrate. A plurality of...
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6772510 |
Mapable tape apply for LOC and BOC packages
A method and apparatus for attaching an integrated circuit die to a leadframe or substrate. Specifically, a wafer, which is populated with integrated circuit dies, is electrically tested and a...
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