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7617600 |
Process of making an electronic circuit device having flexibility and a reduced footprint
An electronic circuit formed by removing only a baseboard from an electronic module. The electronic circuit may be formed by providing a baseboard made of a water-soluble material, applying a...
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7617596 |
Method of forming a housing for an electronic device
The described embodiments relate to electronic devices. One exemplary device includes a pair of sidewall components extending between respective top portions and bottom portions, the bottom...
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7614149 |
Methods for assembling computers
Apparatuses and methods for preventing disengagement of electrical connectors in the assembly of computers. In one embodiment, a computer system includes a chassis, an electrical component...
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7614146 |
Method for fabricating circuit board structure
The present invention provides a circuit board structure and a method of fabricating circuit board structure the same, the circuit board structure consisting of a carrier board having a first...
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7614142 |
Method for fabricating an interposer
A method for fabricating an interposer includes: forming on one primary surface of a first substrate a thin-film capacitor including a first capacitor electrode, a crystalline capacitor dielectric...
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7614128 |
Method of manufacturing piezoelectric element and method of manufacturing liquid-jet head
While a piezoelectric element is being formed by sequentially laminating a lower electrode whose uppermost layer is made of iridium, a titanium layer, a piezoelectric layer and an upper electrode...
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7612445 |
Circuit apparatus and method of fabricating the apparatus
The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a...
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7610679 |
Method of producing inkjet printhead
There is disclosed a method of producing an inkjet printhead including a cavity unit having therein ink passages and formed by stacking a plurality of kinds of flat plates each of which has a...
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7607228 |
Method of manufacturing liquid ejection head
The method manufactures a liquid ejection head in which piezoelectric bodies are formed on a diaphragm which constitutes walls of a plurality of pressure chambers. The method comprises the steps...
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7607222 |
Method of manufacturing an electronic component package
An electronic component package and a manufacturing method thereof are disclosed. A method of manufacturing an electronic component package, which includes: forming a protrusion part on a first...
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7607221 |
Method of making an electronic device housing
An apparatus and methods are provided for housing an electronic device. In one implementation, a method of housing an electronic device includes positioning an electronic device on a base,...
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7600315 |
Method of manufacturing printed circuit board
This invention relates to a method of manufacturing a printed circuit board, in which a dummy metal frame enclosing the outer periphery of a product part is formed, thus simultaneously assuring the...
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7600313 |
Part cartridge for mounter device
A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are...
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7596864 |
Stacked module connector
A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire...
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7596863 |
Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein
A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each...
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7596842 |
Method of making multilayered construction for use in resistors and capacitors
The invention concerns a method of making multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic...
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7595982 |
Low airflow impedance PCBA handling device
A computer server includes a printed circuit board and a fan. The printed circuit board includes electronic components and a handling device mounted thereon. The fan is arranged to blow air across...
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7594328 |
Method of forming a slotted substrate with partially patterned layers
A method of forming a slotted substrate that includes patterning a thin film over a substrate so that at least a portion of the substrate within a slot region is not covered by the thin film. In...
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7594322 |
Methods of fabricating substrates including at least one conductive via
A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures....
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7594321 |
Substrate-imprinting methods
A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on...
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7594318 |
Multilayer circuit board with embedded components and method of manufacture
A multilayer substrate assembly ( 80 ) includes at least one embedded component ( 52 ) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core...
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7594316 |
Method of manufacturing composite electronic component
A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block...
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7594105 |
Multilayer print circuit board
This invention effectively prevents potential fluctuation in the power supply terminal of a semiconductor device, that is, noise from flowing out to a main power supply wiring. A multilayer print...
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7591937 |
Method of fixing macro-objects to an electricity conducting- or semi-conducting surface by means of electrografting, surfaces thus obtained and applications thereof
The invention relates to a method of fixing macro-objects to an electricity conducting- or semi-conducting surface by means of electrografting. The invention also relates to the electricity...
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7591067 |
Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same
A thermally enhanced coreless thin substrate with embedded chips, which mainly includes a patterned carrier metal layer, at least one chip, at least one dielectric layer and at least one wiring...
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7587816 |
Method of improving the stability of a circuit board
A printed circuit board includes a mounting hole for receiving a connector pin of either of a first SMC and a second SMC, and a signal line. The signal line is electrically connected to the...
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7587815 |
Resin-coated metal plate and method of drilling printed wiring board using the metal plate
A resin-coated metal plate used as a protective plate in drilling a printed wiring board has a metal plate and a resin film including a thermoplastic resin coated on at least one surface of the...
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7584537 |
Method for making a microcircuit card
A method for mounting a microcircuit module in a card body to make the card non-detachable without damage includes fixing the module ( 22 ) in a cavity ( 12 ) of the card body ( 11 ) with a resin...
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7584535 |
Method of manufacturing multi-layer wiring board
A method of manufacturing a multi-layer circuit wiring board, including simultaneously laminating a second flexible resin film on one surface of a first flexible resin film having a first wiring...
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7581312 |
Method for manufacturing multilayer flexible printed circuit board
A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder...
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7578058 |
Production method of a multilayer ceramic substrate
A multilayer ceramic substrate having a cavity is formed by the steps of laminating a plurality of ceramic green sheets including ceramic green sheets having through holes corresponding to the...
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7578056 |
Method of coating contacts on a surface of a flip chip
A method for encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal...
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7575148 |
Multilayer capacitor and method for manufacturing multilayer capacitor
A plurality of anode foils ( 7 ) and a plurality of cathode foils ( 8 ) respectively having connecting portions ( 12 a, 12 b ) are alternately arranged with insulating separators ( 9 ) interposed...
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7574794 |
Method of manufacturing a touch screen
A method for manufacturing a touch screen that deposits a conductive layer or coating directly onto a surface of a sheet or ribbon or roll of thin glass material. The coated thin glass material may...
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7574793 |
Process of forming a laminate ceramic circuit board
A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions...
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7571540 |
Production method of suspension board with circuit
A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a...
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7571536 |
Method of making capacitive/resistive devices
A method of making capacitive/resistive devices provides both resistive and capacitive functions. The capacitive/resistive devices may be embedded within a layer of a printed wiring board....
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7571529 |
Method for forming an electronic device in multi-layer structure
A method for forming an organic or partly organic switching device, comprising: depositing layers of conducting, semiconducting and/or insulating layers by solution processing and direct printing;...
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7570494 |
Structure of flexible printed circuit board
A recording apparatus that has a recording head and a flexible printed circuit board. The recording head, which performs recording on a recording medium, has a plurality of recording elements. One...
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7565738 |
Method for manufacturing circuit device
A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for...
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7565737 |
Manufacturing method of package substrate
A package substrate for carrying a chip with a plurality of bumps thereon is provided. The package substrate includes a first substrate, and an interposer. The first substrate has a first circuit...
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7565736 |
Process for manufacturing printed circuit boards and a machine for this purpose
Process and machine for manufacturing printed circuit boards wherein a press packet comprised of at least two press plates of metal material between which is arranged a printed circuit board...
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7562451 |
Method of manufacturing actuator device for ink jet head
A method of manufacturing an actuator device configured to prevent separation of a vibration plate and to enhance durability and reliability, and a liquid-jet apparatus are provided. The method...
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7559138 |
Method for replacing defective PCB from PCB panel
An apparatus for replacing a defective PCB unit formed on a PCB panel includes a location correcting table on which a nondefective PCB unit for replacing the defective PCB unit is disposed, a panel...
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7549220 |
Method for making a multilayer circuit
A method for the manufacture of a multilayer circuit comprising a liquid crystalline polymer layer, the method comprising treating the multilayer circuit with an amount of heat effective to raise...
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7546681 |
Manufacturing method for wiring circuit substrate
A method of making a microelectronic element includes making a connection component by providing a metal layer having a top surface and a bottom surface, providing a dielectric layer over the top...
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7545636 |
Method and apparatus for coupling a drive to a chassis
A drive coupling apparatus includes a carrier base defining a drive channel and comprising a first symmetry plane. A plurality of drive coupling members are located on the carrier base and adjacent...
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7543376 |
Manufacturing method of flexible printed wiring board
Provided is an FPC, which comprises an insulating layer 2 , wiring layers 3 and 4 laminated above and under the insulating layer 2 , and a layer connection for connecting the wiring layers 3...
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7543374 |
Method of manufacturing wiring substrate
In a method of manufacturing a wiring substrate according to the present invention, a metal foil is tentatively fixed onto a temporary substrate, which is made of a nonwoven fabric impregnated with...
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7543373 |
Gel package structural enhancement of compression system board connections
A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of...
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