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7401405 |
Method of fabricating inkjet nozzles having associated ink priming features
A method of fabricating a plurality of inkjet nozzles on a substrate, each nozzle comprising a nozzle chamber having a roof spaced apart from said substrate and sidewalls extending from said roof...
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7400157 |
Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes
A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data...
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7397666 |
Wedge lock
Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.
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7394027 |
Multi-layer printed circuit board comprising a through connection for high frequency applications
A high frequency multi-layer printed circuit board, according to the present invention, comprises a through connection having an impedance adapting structure surrounding the through connection and...
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7392583 |
Securing solid-matrix panels for cutting using a tooling fixture
Tooling fixtures and methods are described for securing a solid-matrix panel for cutting. In one embodiment, a tooling fixture includes a first clamping system and a second clamping system. The...
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7388158 |
Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
In one embodiment, a substrate assembly includes a flat substrate having oppositely disposed planar surfaces and a conductor. The conductor is formed on at least one of the planar surfaces and...
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7383629 |
Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof
A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically...
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7380337 |
Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module
A first cavity in a holder is provided with a plurality of spiral contactors and a thermosetting adhesive member. In a state where a first bare chip is mounted in the first cavity and spherical...
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7380333 |
Chip resistor fabrication method
A method of making a chip resistor is provided. The method includes the following steps. First, a resistive element is provided on a substrate. Then, a resin layer is formed on the substrate to...
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7377033 |
Method of making circuitized substrate with split conductive layer and information handling system utilizing same
A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate...
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7377032 |
Process for producing a printed wiring board for mounting electronic components
A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4...
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7377030 |
Wiring board manufacturing method
The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is...
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7370411 |
Wiring board manufacturing method
A method of manufacturing a wiring board includes: forming a first insulating layer on a supporting board; mounting at least one reinforcing member on the first insulating layer; mounting at least...
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7367116 |
Multi-layer printed circuit board, and method for fabricating the same
To provide an interlayer-connected, multi-layer flexible printed circuit board having high bonding reliability and most suitable for micropatterning the circuit layers in the device; and to provide...
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7367114 |
Method for plasma etching to manufacture electrical devices having circuit protection
Methods of manufacturing a variety of circuit protection devices are provided as well as devices so manufactured. In an embodiment, a surface mount electrical device having a substrate and a pair...
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7362586 |
Electronic component with shielding case and method of manufacturing the same
Shielding cases each include a pair of opposed first surfaces with catching pieces protruding therefrom and a pair of second surfaces without catching pieces. A motherboard forms substrates each...
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7361844 |
Power converter package and thermal management
Power conversion apparatus includes a circuit board with power conversion circuitry and a package having an upper portion and a lower portion that respectively enclose circuitry on a top surface...
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7361842 |
Apparatus and method for an embedded air dielectric for a package and a printed circuit board
A method, apparatus, and system for a printed circuit board (PCB) and package with an embedded air dielectric includes a conductor formed on a surface of a first core layer, a conductor layer...
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7360308 |
Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers
A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central...
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7360305 |
Method for manufacturing multi-layered ceramic electronic component
A method for manufacturing a multi-layered ceramic electronic component includes positioning a multi-layered unit including a release layer, an electrode layer and a ceramic green sheet formed on a...
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7356924 |
Manufacturing process for a power distribution assembly of an electrical system
A modular multi-component power distribution system is provided having a plurality of modular components which includes a bus-bar-like power distribution assembly (PDA), branching connectors, flex...
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7356923 |
Rigid flex interconnect via
A rigid-flexible printed wire assembly which employs a blind via for interconnection is disclosed. Preferably, the assembly includes a rigid section having a through hole formed therethrough and a...
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7356921 |
Method for forming a conductive layer pattern
A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the...
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7356917 |
Method for manufacturing multi-layer printed circuit board
A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the...
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7356916 |
Circuit-formed substrate and method of manufacturing circuit-formed substrate
A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness...
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7356894 |
Method of producing a micro-actuator
In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to...
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7353604 |
Method for manufacturing an inkjet head
A method for manufacturing an inkjet head includes producing a flow path unit, producing an actuator unit, bonding the actuator unit with the flow path unit to produce a bonded structure; measuring...
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7353592 |
Method of fabricating an RF substrate with selected electrical properties
Method for fabricating a textured dielectric substrate ( 400 ) for an RF circuit. The method can include the step ( 104 ) of selecting a plurality of dielectric substrate materials, each having a...
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7353591 |
Method of manufacturing coreless substrate
A method for manufacturing coreless substrates is provided herein. The method first provides a base whose top and bottom sides are covered with metal layers respectively that are detachable from...
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7353590 |
Method of forming printed circuit card
A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the...
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7350296 |
Method of fabricating a printed circuit board including an embedded passive component
Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit...
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7350295 |
Method of fabricating multi-layered printed circuit board for optical waveguides
A method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the...
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7350293 |
Low profile ball-grid array package for high power
A low-profile, high power ball grid array, or land grid array, device including a plastic tape having first and second surfaces, a portion of the first surface covered with an adhesive layer. First...
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7346982 |
Method of fabricating printed circuit board having thin core layer
A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is...
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7346981 |
Method for fabricating microelectromechanical system (MEMS) devices
A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate...
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7345244 |
Flexible substrate and a connection method thereof that can achieve reliable connection
A flexible substrate is connectable to electrodes of an external member. The flexible substrate includes a base material having flexibility and including an insulative base film and a conductive...
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7343675 |
Method of constructing a structural circuit
A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a...
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7343674 |
Method of making circuitized substrate assembly
A method of making a circuitized substrate assembly wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, and a cover is...
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7340830 |
Method of manufacturing LED light string
A method of manufacturing LED light string includes the steps of forming an LED light body from multiple serially connected printed circuit boards, fixing the LED light body to a base, and...
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7340829 |
Method for fabricating electrical connection structure of circuit board
A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of...
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7340828 |
Method for producing metal/ceramic bonding circuit board
There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required...
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7339118 |
Printed wiring board and method for manufacturing the same
In a printed wiring board, an odd number (n) of conductive layers ( 11 - 13 ) and insulating layers ( 21 - 23 ) are alternately laminated upon each other. The first conductive layer ( 11 ) is a...
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7337540 |
Method of manufacturing a structure body bonding with a glass substrate and semiconductor substrate
Provided is technology capable of avoiding complex processes and high costs while securing the protection of the functional unit upon forming a device including a glass substrate. A manufacturing...
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7334335 |
Method of manufacturing a monolithic ink-jet printhead
A monolithic ink-jet printhead, and a method of manufacturing the same, includes a substrate having an ink chamber, an ink channel, and a manifold, a nozzle plate formed on the substrate, a nozzle,...
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7334326 |
Method for making an integrated circuit substrate having embedded passive components
A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer...
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7334323 |
Method of making mutilayered circuitized substrate assembly having sintered paste connections
A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder...
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7331092 |
Method and manufacturing surface acoustic wave device
A method of manufacturing a surface acoustic device that has a surface acoustic wave filter including comb-like electrodes, electrode pads, and wiring patterns formed on a joined substrate produced...
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7325300 |
Method of manufacturing printed wiring boards
In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between...
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7320173 |
Method for interconnecting multi-layer printed circuit board
A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer,...
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7318273 |
Method for producing pH probes
A method for producing a pH measuring probe includes: providing an electrode wire protruding out of both sides of a recording device, the electrode wire being fixed to the recording device with the...
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