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6981323 |
Method for fabricating a fluid injection head structure
The present invention provides a fluid injection head structure and a method of fabricating the same. The fluid injection head structure is disposed on a substrate and has a bubble generator, a...
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6978525 |
Method of manufacturing a lamination-type piezoelectric element
A method of manufacturing a lamination-type piezoelectric element includes forming a ceramic laminated body in which ceramic layers and inner electrode layers are alternately laminated on each...
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6978538 |
Method for making a microelectronic interposer
A microelectronic interposer is made by providing a sacrificial layer over the surface of a planar body. Apertures are formed passing through the body and the sacrificial layer. A layer of an...
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6978543 |
Method of manufacturing an ink jet head having a plurality of nozzles
A printer having a plurality of nozzles each for discharging ink supplied from an ink supply part ( 50 ) comprises a head main body ( 3 ) including a plurality of pressure chambers each provided...
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6976295 |
Method of manufacturing a piezoelectric device
A compact and thin piezo-electric resonator is provided having a high air-tightness and available at a low cost, in which a piezo-electric resonator element is provided in a housing having a...
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6976306 |
Modular method for manufacturing circuit board
The present invention discloses a modular method for manufacturing circuit boards, which is a method of manufacturing multilayer printed circuit boards with blind and buried vias structure by using...
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6973719 |
Method of making a thermal management for a circuit board panel
A method of making a thermal management material for a circuit board panel comprising the steps of cutting a thermally conductive, rigid substrate from a larger sheet of heat conducting material,...
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6973715 |
Method of forming a multichip module having chips on two sides
A method of forming a multichip module in which a thin film structure is formed on a temporary carrier and then an electrically insulating frame is attached to the thin film structure. A...
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6973716 |
Electronic circuit construction method, as for a wireless RF tag
A method for making an electronic circuit arrangement comprises providing a substrate having an electrical conductor thereon, wherein the electrical conductor includes two contacts spaced apart...
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6971167 |
Multilayered circuit board forming method and multilayered circuit board
A multilayered circuit board and a method of forming the multilayered circuit board are provided. In a first circuit forming process, a first circuit is formed on an insulating board with a...
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6972379 |
Circuit board and a method for making the same
A method 10 for making a multi-layer electronic circuit board 110 having electroplated apertures 18, 20 which may be selectively and electrically isolated from electrically grounded member ...
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6972382 |
Inverted microvia structure and method of manufacture
A multilayer circuit board ( 50 ) includes a plurality of substrate cores ( 34 and 44 ), an adhesive/bonding layer ( 55 ) between at least two among the plurality of substrate cores, and a...
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6968617 |
Methods of fabricating fluid ejection devices
In one example embodiment, a method of fabricating a fluid ejection device is provided. The method can including fabricating a thinflim structure on a device substrate and forming a peripheral...
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6964086 |
Method of manufacturing thin film piezoelectric element, and element housing jig
A method comprises: bonding a plurality of thin film piezoelectric elements, formed on a substrate, onto a temporary fixing substrate via an adhesive layer; selectively removing the substrate to...
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6961993 |
Method of transferring and mounting elements
A device mounting method capable of efficiently, accurately arraying micro-devices on a circuit board is provided. The method includes a device separating step of separating a plurality of LED...
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6961981 |
Method of producing a piezoelectric resonator
The invention concerns a piezoelectric resonator piece of a piezoelectric resonator having electrode patterns for forming exciting electrodes each of which is composed of an under a metal layer....
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6961990 |
Method of manufacturing multilayer microwave couplers using vertically-connected transmission line structures
A microwave coupler is constructed in a multilayer, vertically-connected stripline architecture provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure....
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6959490 |
Method of manufacturing silicon device, method of manufacturing liquid jet head and liquid jet head
Disclosed are a method f manufacturing a silicon device and a method of manufacturing a liquid jet head, which are capable of surely preventing damage of a piezoelectric element in manufacturing....
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6954984 |
Land grid array structure
A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of...
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6954987 |
Method of interconnecting a circuit board to a substrate
A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape...
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6954986 |
Method for fabricating electrical connecting element
A method for manufacturing electrical connecting elements or semifinished products. Microvias are formed in a dielectric substrate layer by piercing a substrate layer ( 1 ) through a first...
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6954985 |
Method for plugging holes in a printed circuit board
A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via...
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6952872 |
Method for reducing stress on the multi-conductor cable
The object of this invention is to provide an improved connection between a TTY keypad and an emergency call box. This is accomplished by lengthening and re-routing the multi-conductor ribbon cable...
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6952871 |
Method for manufacturing printed circuit boards
It consists of making a first engraving over a first face of a panel of electro-conducting material to form some reliefs and depressions corresponding to future tracks and intermediate tracks;...
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6951048 |
Method for producing a stacked piezoelectric element
A method for producing a stacked piezoelectric element by alternately stacking a plurality of layers of an electrode material and piezoelectric layers having an electro-mechanical energy converting...
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6948242 |
Process for producing a contact-making device
A process for producing a contact-making device is provided for making electrical contact between components, which includes the step of producing an electrical zero-insertion-force connector which...
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6944945 |
Sequential build circuit board
A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal and...
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6944941 |
Method for assembling cassette-loaded microcomponents
Disclosed is a method for assembling cassette-loaded microcomponents, requiring only a small number of component-specific ejector tools and capable of being implemented more quickly. According to...
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6947288 |
PCMCIA card
A process of manufacturing a card comprising: (a) placing a circuit board within a plastic panel and a metal panel, the metal panel having a plurality of tabs with barbs thereon, the plastic panel...
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6944946 |
Porous power and ground planes for reduced PCB delamination and better reliability
Power and ground planes that are used in Printed Circuit Boards (PCBs) and that comprise porous, conductive materials are disclosed. Using porous power and ground plane materials in PCBs allows...
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6942745 |
Production method of circuit board module
The present invention provides a method of manufacturing a circuit board module for connecting a circuit conductor ( 2 ) of a first circuit board ( 1 ) to a circuit conductor ( 4 ) of a second...
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6941640 |
Method of manufacturing a base plate for a miniature hard disc drive
The present invention is directed to a miniature hard disc drive having a metal base plate, an actuator assembly wherein the actuator assembly comprises a plurality of bearings, a shaft, and a...
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6941625 |
Method of producing a piezoelectric/electrostrictive device
A method of producing a piezoelectric/electrostrictive device in which a piezoelectric/electrostrictive element including a substantially trapezoidal laminate having narrower and wider surfaces...
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6941648 |
Method for producing printed wiring board
A method for making a printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate 2 ,...
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6938334 |
Vibrating beam accelerometer two-wafer fabrication process
A method for fabrication of microelectromechanical systems (MEMS) integrated micro devices and acceleration sensor devices formed according to the method, the method being micromachining an array...
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6938311 |
Method to generate electrical current using a plurality of masses attached to piezoceramic supports
A method is provided to generate electrical current. The method includes creating a plurality of unitary masses each connected to one of a plurality of piezoceramic mass supports. The mass supports...
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6938331 |
Method for fabricating a filament affixed trace within an electronic device
A method for fabricating a filament-affixed trace within an electronic device, such as a circuit board or microelectronic device. Conductive traces are affixed to the surface of a composite...
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6938332 |
Method for manufacturing multilayer ceramic substrates
A method for manufacturing multilayer ceramic substrates in accordance with a multiple formation method using a non-shrinkage process allows the multilayer ceramic substrates to be smoothly formed...
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6935018 |
Copper plated invar with acid preclean
A method for forming a copper-Invar-copper (CIC) laminate having an intermetallic layer of negligible thickness, and a structure associated with the CIC laminate. Starting with a block of Invar,...
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6931702 |
Inkjet recording head and method for manufacturing the same
An inkjet recording head includes a two-dimensional array of a pressure chambers and corresponding array of piezoelectric elements each for applying a pressure wave to ink in a corresponding...
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6931722 |
Method of fabricating printed circuit board with mixed metallurgy pads
A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is...
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6931724 |
Insulated multilayered substrate having connecting leads for mounting a semiconductor element thereon
A method of producing a multilayered substrate having: a first face being provided with pads bondable to electrode terminals of a semiconductor element, and a body containing a plurality of wiring...
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6928726 |
Circuit board with embedded components and method of manufacture
A substrate assembly ( 10 ) and method of making same has at least one embedded component ( 25 ) in a via ( 24 ) of a substrate core ( 22 ) and includes a first adhesive layer ( 20 ) coupled to the...
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6925710 |
Method for manufacturing microelectromechanical combdrive device
Methods of making microelectromechanical combdrive devices are disclosed. The device may optionally be formed using three device layers. A moveable element and flexure may be formed from a first...
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6924655 |
Probe card for use with microelectronic components, and methods for making same
The present disclosure provides probe cards which may be used for testing microelectronic components, including methods of making and using such probe cards. One exemplary implementation provides a...
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6924439 |
Signal conducting applique and method for use with printed circuit board
The invention herein pertains to improved methods and apparatus for electrically coupling components within a digital data system without the use of ribbon cables and other wires. The disclosed...
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6920688 |
Method for a semiconductor assembly having a semiconductor die with dual heat spreaders
A method of making an integrated circuit device using an encapsulated semiconductor die, having leads extending therefrom and attaching a heat spreader to each of the major outer encapsulant...
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6915566 |
Method of fabricating flexible circuits for integrated circuit interconnections
A method for the fabrication of a double-sided electrical interconnection flexible circuit ( 200 ) particularly useful as a substrate for an area array integrated circuit package. A copper matrix...
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6912761 |
Method of producing multilayer piezoelectric resonator
A method of producing a piezoeIectric resonator includes the steps of forming first to third internal electrodes by printing an electrically conductive paste onto a green sheet, punching out...
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6910272 |
Method of manufacturing an ink jet recording head
A method of forming an ink jet recording head having a passage forming substrate made of a silicon monocrystalline substrate, having pressure generating chambers communicating with nozzle orifices,...
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