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7100276 |
Method for fabricating wiring board provided with passive element
A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one...
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7100275 |
Method of producing a multi-layered wiring board
Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and...
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7102217 |
Interposer substrates with reinforced interconnect slots, and semiconductor die packages including same
A board-on-chip (BOC) semiconductor package includes a multisegmented, longitudinally slotted interposer substrate through which an elongate row of die bond pads is accessed for electrical...
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7096578 |
Manufacturing method for wiring circuit substrate
A method is provided for manufacturing a multi-layer wiring circuit substrate. A first metal layer is selectively etched in first areas to reduce a thickness of the metal layer in the first areas...
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7095624 |
Electromagnetic shield with vee-slot panel joints
An electromagnetic shielding structure has conductive parts for blocking propagation of electromagnetic interference, whereof at least one has an appendage or an edge configuration that is shaped...
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7093358 |
Method for fabricating an interposer
An interposer including a fence that receives and aligns a semiconductor device, such as a flip-chip type semiconductor device, with an interposer substrate. The fence may include edges that are...
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7093356 |
Method for producing wiring substrate
A wiring substrate with bumps protruding from a surface of the substrate covers one side of a metallic base with an electrical insulating film thereon, having open holes exposing the base, etching...
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7089637 |
Method of producing a piezoelectric/electrostrictive device
A method of producing a piezoelectric/electrostrictive device having a base including a pair of movable parts opposing each other, a fixing part that connects the movable parts with each other at...
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7089661 |
Method for packaging small size memory cards
A method is disclosed for packaging a small size memory card, including xD Picture card, Memory Stick™, Secure Digital™ (SD) card, SmartMedia™ (SM) card, Multimedia card (MMC),...
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7089659 |
Method of producing ceramic laminates
A method of producing ceramic laminates includes forming a ceramic green sheet by applying a ceramic slurry on a carrier film; forming, maintaining a predetermined gap, a plurality of electrically...
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7089636 |
Method of manufacturing a piezoelectric thin film element
The present invention provides a piezoelectric thin film element with superior piezoelectric properties in which the condition of the crystal of the piezoelectric thin film is appropriately...
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7089660 |
Method of fabricating a circuit board
A circuit board with an asymmetrical structure and a method for fabricating the same are proposed. A core circuit board is provided, with a build-up structure being formed on a side of the core...
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7089665 |
Method for fabricating a monolithic fluid injection device
A method for fabricating a monolithic fluid injection device. The method includes providing a substrate with a patterned sacrificial layer thereon. Next, a patterned support layer and a patterned...
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7086146 |
Method of manufacturing a shielding base member
The method of forming a radiation shielding structure includes a first adhesive layer, a resin layer, and a metal foil laminated sequentially on a release layer of a plastic film. A metal layer...
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7083901 |
Joining member for Z-interconnect in electronic devices without conductive paste
A layer for use in a modular assemblage for supporting ICES is formed with metal contacts for assembly by making a sandwich of metal interconnect members between two layers of dielectric; drilling...
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7084354 |
PCB method and apparatus for producing landless interconnects
An electronic assembly is disclosed. The electronic assembly includes a lower portion and a first elongate trace formed on an upper surface of the lower portion. The trace is covered by an upper...
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7082679 |
Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof
Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the...
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7085141 |
Methods and apparatus for holding circuit boards together
A circuit board holder includes a base portion, and a mounting portion coupled to the base portion. The mounting portion is configured to actuate with a first circuit board when the circuit board...
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7080445 |
Method for connecting printed circuit boards and connected printed circuit boards
A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating...
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7081412 |
Double-sided etching technique for semiconductor structure with through-holes
Double-sided etching techniques are disclosed for providing a semiconductor structure with one or more through-holes. The through-holes may be sealed hermetically such as by a feed-through...
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7076868 |
Wiring circuit board having bumps and method of producing same
A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps...
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7076873 |
Method of manufacturing an ink-jet head
A cavity plate of an ink-jet head is formed by stacking a clad plate on a manifold plate. The clad plate is formed by unitarily bonding a first layer and a second layer, which are made of different...
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7076869 |
Solid via layer to layer interconnect
The present invention relates to a method for providing an interconnect between layers of a multilayer circuit board. A first via extending through a total thickness of a first layer is formed. The...
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7074052 |
USB device with case having integrated plug shell
A Universal-Serial-Bus (USB) device includes a PCBA mounted inside a plastic housing, which in turn is inserted or otherwise secured inside an outer case. The case is made of metal or hard plastic,...
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7073253 |
Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same
An interconnect for attaching a module such as a PCB or a multi-chip module to a circuit substrate comprises a member elongated in a longitudinal direction. The member has at least a first...
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7069646 |
Techniques for reducing the number of layers in a multilayer signal routing device
Techniques for reducing the number of layers in a multilayer signal routing device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method wherein the...
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7069656 |
Methods for manufacturing monolithic ink-jet printheads
A monolithic ink-jet printhead includes a substrate having an ink chamber to be filled with ink to be ejected on a front surface, a manifold for supplying ink to the ink chamber on a rear surface,...
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7069652 |
Method for producing laminated smart cards
A smart card is laminated from at least two layers of paper or film as a mounting material. A first of the layers is fitted with a semiconductor chip and a second layer has connecting contacts as...
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7069650 |
Method for reducing the number of layers in a multilayer signal routing device
A technique for reducing the number of layers in a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing the...
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7069645 |
Method for producing a circuit board
A method for producing a circuit board having a metal circuit pattern on an insulating substrate is provided, including the steps of joining a metal plate onto a surface of the insulating substrate...
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7065869 |
Method for plating of printed circuit board strip
Disclosed is a design method for plating of a printed circuit board (PCB) strip, in which a main plating line is optionally formed on a component side, a solder side, or an inner layer of the PCB...
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7066344 |
Mask film, its manufacturing method, and manufacturing method of circuit board using the same
A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be...
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7065874 |
Method for making liquid ejection head
A method for making a liquid ejection head includes the steps of placing a vibrator unit including a plurality of piezoelectric elements arranged in a comb shape in a head housing; filling each of...
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7064431 |
Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts
An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows...
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7062841 |
Method of manufacturing a formable laminated stack in a progressive die assembly having a choke
A method of manufacturing a stack of interlocked laminations in a progressive die assembly having a choke. A strip of sheet stock material is provided and a plurality of laminations are stamped...
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7059046 |
Method for producing a captive wired test fixture and fixture therefor
A method for wiring a test fixture comprised of two parallel fixture plates wherein the wires are wired randomly from locations on one plate to locations on a second plate using a system of...
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7059039 |
Method for producing printed wiring boards
A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive...
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7059049 |
Electronic package with optimized lamination process
An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the...
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7059048 |
Wafer-level underfill process making use of sacrificial contact pad protective material
A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material...
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7059044 |
Method and material for manufacturing circuit-formed substrate
For the purpose of achieving enhanced reliability with respect to interlayer connections of printed wiring boards, a manufacturing method of printed wiring boards of the present invention includes...
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7051430 |
Method of manufacturing a printed board assembly
Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the...
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7051434 |
Designing a ball assignment for a ball grid array package
A method for designing a routing pattern for electrical contacts on a printed circuit board by arranging contacts in an array of rows and columns on the printed circuit board, connecting groups of...
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7051433 |
Multilayer circuit board
A technique for eliminating electrically conductive vias is disclosed. In one embodiment, the technique is realized as an improved multilayer circuit board for eliminating electrically conductive...
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7054162 |
Security module system, apparatus and process
A system, method and apparatus for protecting circuit components from unauthorized access. The circuit components to be protected are disposed on a first layer of a substrate with a plurality of...
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7047643 |
Method of manufacturing ink jet heads
A method of manufacturing an ink jet head, characterized in having the steps of: bonding a nozzle plate and a support member by heating to make a composite member; forming nozzle holes in the...
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7047630 |
Method of making circuitized substrate assembly
A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only...
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7047628 |
Impedance matching of differential pair signal traces on printed wiring boards
A printed wiring board having differential pair signal traces has increased spacing between signal-carrying vias and ground or power planes and/or is equipped with selectively placed ground vias to...
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7047631 |
Method for automatable insertion or removal of integrated circuit board
A method for the automatable insertion or removal of an integrated circuit board is disclosed. One or more linear actuators or similar devices are coupled to one or more cards of an electronic...
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7047629 |
Method of manufacturing circuit board
A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a...
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7047634 |
Method of making a multilayer wiring board
A built-in component type multilayer wiring board includes at least one resin layer and at least one frame resin layer. The resin layer includes electronic components buried therein. The frame...
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