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7181839 |
Method for producing a circuit board
After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being...
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7181834 |
Method of fabricating an RF substrate with selected electrical properties
Method for fabricating a textured dielectric substrate ( 400 ) for an RF circuit. The method can include the step ( 104 ) of selecting a plurality of dielectric substrate materials, each having a...
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7178234 |
Method of manufacturing multi-layer printed circuit board
Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50 , and via holes 66 are formed right on the through holes 36 , respectively. Due...
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7174628 |
Memory card production using prefabricated cover and molded casing portion
Secure-digital (SD) type memory cards are produced using one or more prefabricated cover portions and a molded casing portion. A sub-assembly is formed by mounting a printed circuit board assembly...
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7174631 |
Method of fabricating electrical connection terminal of embedded chip
An electrical connection terminal of an embedded chip and a method for fabricating the same are disclosed. An insulating layer is provided on a circuit board integrated with a chip and has a...
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7168164 |
Methods for forming via shielding
Methods to shield conductive layer from via. A protective coating of insulating material is formed around a clearance hole in a conductive layer of a printed circuit board, so that the conductive...
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7165322 |
Process of forming socket contacts
A socket contact formation process comprises forming a contact head from a conductive material, forming a contact body from a semiconductive material configured to be electrically conductive; and...
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7165323 |
Method of manufacturing a touch screen
A method for manufacturing a touch screen that deposits a conductive layer or coating directly onto a surface of a sheet or ribbon or roll of thin glass material. The coated thin glass material may...
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7162793 |
Apparatus for clamping printed circuit boards inside an electronic module housing
Reflow soldering of a variety of circuit boards ( 9, 11, 15 ) in a variety of sizes and shapes to assigned locations on the base or carrier ( 13 ) of the electronic module housing ( 3 ) is...
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7162794 |
Manufacturing method for multilayer ceramic elements
A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes...
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7159313 |
Solderless electronics packaging and methods of manufacture
To decrease the thickness, or stack height, of an electronics package, the package includes a solderless compression connector between an integrated circuit (IC) package and a substrate such as a...
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7159308 |
Method of making a circuit board
Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel...
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7161088 |
System, method and apparatus for optimizing power delivery and signal routing in printed circuit board design
A system, method and apparatus for providing a printed circuit board having optimized power delivery planes and signal routing regions are disclosed. In one aspect, the present disclosure teaches a...
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7155815 |
Electrical contacting method
A method for contacting printed conductors terminating at the edge of a circuit board with printed conductors of a MID component includes: on a panel which includes the circuit board, producing the...
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7155820 |
Method for manufacturing printed circuit board
The present invention provides a method of manufacturing a printed circuit board, which includes preparing a dielectric substrate, coating surfaces of the dielectric substrate, filling a via hole...
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7155816 |
Method for producing a multilayer ceramic substrate
A method for producing a multilayer ceramic substrate having a cavity formed therein includes punching a through opening corresponding to the cavity in green sheets constituting a laminate, and...
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7152313 |
Package substrate for integrated circuit and method of making the substrate
In some embodiments, an article of manufacture includes a metal layer and a first dielectric layer in contact with a first face of the metal layer. The article of manufacture also includes a second...
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7152314 |
Method of manufacturing circuit board
The method of manufacturing a circuit board is capable of preventing deformation of a core substrate, ensuring size thereof and highly concentrating cable patterns so as to realize compact and...
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7152312 |
Method for transmitting current through a substrate
A method for transmitting high-frequency current through a substrate is provided. The method comprises receiving the high-frequency current at a via passing through at least one conductive plane...
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7152315 |
Method of making a printed circuit board
A method 10, 80, 81 for making multi-layer electronic circuit boards 77, 137, 139 having metallized apertures 18, 20, 34, 40, 104, 106, 120.
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7152318 |
Method for manufacturing built-up printed circuit board with stacked type via-holes
A built-up printed circuit board includes stacked micro via-holes, each of which is provided for interconnection between layers in the printed circuit board, and in each of which a filling...
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7152289 |
Method for forming bulk resonators silicon <110> substrate
A method for forming a device on a substrate of <110> silicon includes forming a first conductive layer onto the substrate, and forming a piezoelectric layer on the first portion of a first...
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7152319 |
Method of making high speed circuit board
A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB...
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7146719 |
Multilayer circuit component and method for manufacturing the same
A multilayer circuit component and a method for manufacturing the same, in which the difference of the amounts of baking shrinkages between each of the glass-containing layers is small, and the...
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7143492 |
Printed circuit board defective area transplant repair method
A printed circuit board defective area transplant repair method in which printed circuit boards that are determined to be defective undergo a series of reworking procedures comprised of plotting...
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7143509 |
Circuit board and processing method thereof
A circuit board essentially comprises a first laminated structure, at least a first plated through hole, at least a second laminated structure, a middle dielectric layer and at least a second...
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7140531 |
Method of fabricating a substantially zero signal degradation electrical connection on a printed circuit broad
A method of fabricating a substantially zero signal degradation electrical connection on a printed circuit board includes providing a printed circuit board defined by a dielectric structure core....
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7141742 |
Alternating voided areas of anti-pads
A printed circuit board includes a first conductive plane and a second conductive plane substantially parallel to the first conductive plane. The printed circuit board includes a via signal barrel...
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7140101 |
Method for fabricating anisotropic conductive substrate
A method for fabricating an anisotropic conductive substrate is disclosed. A back holder has metal pins on a surface thereof. A liquid compound is formed on the surface of the back holder with...
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7138299 |
Method of electrically connecting a microelectronic component
A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a...
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7134194 |
Method of developing an electronic module
An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without...
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7131174 |
Ceramic electronic device and method of production of same
A method of production of a ceramic electronic device such as a multilayer ceramic capacitor, comprising forming a first ceramic coating layer on the surface of a substrate, forming an internal...
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7131193 |
Heat-shrinkable retainer for PCB double-sided assembly
An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided...
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7131195 |
Method for forming metal contacts on a substrate
Solder bump pads are formed on a semiconductor substrate by way of a semiconductor template that has been micromachined to receive solder paste material. The solder paste material is then formed...
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7127812 |
Process for producing a multi-layer printed wiring board
A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30 b and an opening 3 a through which a via hole is formed. A camera senses this register...
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7127810 |
Method of manufacturing electronic device including aligning first substrate, second substrate and mask, and transferring object from first substrate to second substrate, including irradiating object on first substrate with light through mask
A method of manufacturing an electronic device includes providing a mask substrate, a first substrate on which an object to be transferred is formed, and a second substrate to which the object is...
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7127808 |
Spiral couplers manufactured by etching and fusion bonding
A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having...
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7127807 |
Process of manufacturing multilayer modules
A method is disclosed for providing electrical connections to electronic elements within a multilayer module. The method includes providing first and second active layers having first and second...
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7124503 |
Method for forming multilayer circuit board
A method for forming connections within a multi-layer electronic circuit board 10 which allows for the selective, efficient, and reliable interconnection between at least one conductive layer and...
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7126828 |
System and method for retaining cards in an information handling system
A card retention system comprises a chassis and a bracket provided to secure to the chassis by a first retention member. The first retention member is selectively oriented in one of a first...
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7122746 |
Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs...
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7120999 |
Methods of forming a contact array in situ on a substrate
A substrate assembly is disclosed including a substrate and a plurality of spring-biased electrical contacts formed thereon for establishing electrical contact with the lead elements of an IC...
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7121000 |
Method for manufacturing multilayer wiring board
A method of manufacturing a multilayer wiring board according to the present invention comprises the step of heating and pressurizing a stacked product to be integrated in a state in which a...
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7117588 |
Method for assembling tiled detectors for ionizing radiation based image detection
The present technique provides a multi-tile detector and a process for assembling the multi-tile detector using a flexible structure and intermediate electrical connections. The present technique...
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7117587 |
Method for fabricating a substrate, including a plurality of chip package substrates
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on...
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7119030 |
Process for lining a surface using an organic film
The present invention relates to a method for cladding a simple or complex surface, electrically conducting or semiconducting, by means of an organic film from at least one precursor of said...
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7113410 |
Electromagnetic shield assembly with opposed hook flanges
An electromagnetic shield structure ( 100 ) has an elongated conductive wall ( 102 ) that continuously or discontinuously defines a shielding perimeter and has a flange ( 104 ) laying over...
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7107673 |
Technique for accommodating electronic components on a multiplayer signal routing device
A technique for accommodating electronic components on a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for...
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7107672 |
Method of mounting electronic parts on a flexible printed circuit board
A plurality of flexible printed circuit boards are held on a transfer carrier, which is formed by a base plate and a resin layer formed on an upper surface of the base plate. Reference pins are...
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7103972 |
Method of fabricating a fluid ejection device
A fluid ejection device comprising a composite substrate, wherein the composite substrate has two substrates with a patterned etch mask therebetween, and a fluid channel.
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