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6393696 |
Method for manufacturing printed circuit board
A method for manufacturing a printed circuit board is disclosed. When a metal is plated on an upper board to form a circuit, bonding fingers for being bonded with a semiconductor chip are prevented...
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6389686 |
Process for fabricating a thin multi-layer circuit board
A process for fabricating thin multi-layer circuit boards. A substrate is disposed over a heat-accumulating block adjacent thereto so that it is uniformly heated from the back side thereof during...
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6381836 |
Clip and pin field for IC packaging
An electronic assembly that incorporates a heat sink. The subassembly includes an integrated circuit package that is mounted to a substrate. The substrate is mounted to a spacer block which...
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6378199 |
Multi-layer printed-wiring board process for producing
A multi-layer printed-wiring board including a substrate having a plurality of wiring pattern layers sequentially transferred thereon, each wiring pattern layer containing an electrically...
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6378201 |
Method for making a printed circuit board
A multilayer printed circuit board and a corresponding fabrication method are disclosed, which circuit board achieves a relatively high degree of wiring density and a relatively high degree of...
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6370030 |
Device and method in electronics systems
The present invention relates to a device and a method at a printed board for obtaining good transmission qualities in transmission conductors on a predetermined area ( 10 ) of the printed board (...
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6353997 |
Layer build-up method for manufacturing multi-layer board
A layer build-up process for forming a multi-layer board. A conductive substrate has a plurality of bumps formed thereon. The space between the bumps is filled with a dielectric material. The...
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6354000 |
Method of creating an electrical interconnect device bearing an array of electrical contact pads
A method of constructing a planar array of electrical contact pads is disclosed, comprising the following steps. First, providing a set of dielectric layers each having two major surfaces and...
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6356451 |
Multi-layered substrate, method for manufacturing the multi-layered substrate and electric apparatus
Conductive layers have at least a portion of a conductive member arranged in a nonlinear or polygonal configuration and having a greater layout area and an insulating layer is alternately stacked...
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6356455 |
Thin integral resistor/capacitor/inductor package, method of manufacture
A thin electrical circuitry structure is formed which contains conductive circuitry traces, integral capacitors and integral resistors. A first laminate structure comprises a conductive foil having...
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6353189 |
Wiring board, wiring board fabrication method, and semiconductor package
A wiring board provided with a line 1 , a shield pattern 2 formed in parallel with the line 1 , a conductor layer 4 formed so as to face the line 1 and the shield pattern 2 through an...
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6342682 |
Printed wiring board and manufacturing method thereof
A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and...
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6341417 |
Pre-patterned substrate layers for being personalized as needed
A method and structure for personalizing a multi-layer substrate structure includes supplying a generic layer having electrical features and altering the electrical features to produce a...
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6338642 |
Electrical connector
Electrical connector having an insulative body ( 12 ) with contact elements ( 32 ). The contact elements ( 32 ) have at one end thereof spring contact portions ( 40 ) arranged within a socket ( 44...
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6338776 |
Dielectric processing with included stabilization periods
The present invention is directed to allowing a work piece to stabilize in regard to temperature and humidity/water content prior to precision operations so as to minimize any problems resulting...
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6338194 |
Method of making a circuitized substrate assembly with carrier having substrates therein
A method of making an assembly comprised of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier through the use of appropriate, paired...
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6338195 |
Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet
A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer...
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6336990 |
Thermocompression bonding method for electrically and mechanically connecting conductors
A tape carrier package is stacked on an array substrate while interposing a thermosetting type anisotropic conductive adhesive between a plurality of first conductors formed on the end portion of...
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6336269 |
Method of fabricating an interconnection element
Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then...
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6334249 |
Cavity-filling method for reducing surface topography and roughness
A method of minimizing the volume of the depressions 240 in aluminum cavity filling processes, by-depositing a conformal first layer of aluminum alloy 220 by chemical vapor deposition,...
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6332267 |
Process of manufacturing a removably interlockable assembly
A process for making a removably interlockable connector assembly that includes a first connector having a head on a mesa and a second connector having an opening that receives the head on the...
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6333468 |
Flexible multi-layered printed circuit cable
A thin flexible multi-layered printed circuit cable manufactured by a relatively simple process and having improved electro-magnetic interference and impedance characteristics is described. The...
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6327776 |
Circuit component mounting system and circuit component mounting method
A system for mounting circuit components on a circuit substrate, including a circuit-substrate supporting device which supports the circuit substrate, a circuit-component mounting device which...
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6324755 |
Solid interface module
A microwave solid interface module having transmit and receive functionality includes a substrate supporting microwave, logic, and DC bias circuits. In one embodiment, the substrate can be formed...
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6324756 |
Method and system for sealing the edge of a PBGA package
A system and method for providing plastic ball grid array ("PBGA") packages is disclosed. In one aspect, the method and system provide a plurality of PBGA packages. Each of the plurality of PBGA...
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6317967 |
System for extracting circuit cards from a circuit card carriage
An avionics LRU having multiple circuit cards therein which are arranged in readily accessible slots and have insertion/extraction apparatuses coupled thereto which use a rack and pinion...
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6319811 |
Bond ply structure and associated process for interconnection of circuit layer pairs with conductive inks
A unique bond-ply structure and associated processes for processing of the bond-ply structure and for joining together circuit layer pairs which makes it possible to create a bond-ply having raised...
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6316732 |
Printed circuit boards with cavity and method of producing the same
A printed circuit board with at least one cavity produced by combining a dielectric core layer with an adhesive layer. The adhesive layer is a no-flow bond film without a corresponding window. Thus...
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6308405 |
Process for preparing an electrode substrate
An electrode substrate and a recording medium having a smooth surface with surface unevenness of 1 nm or less and a size of 1 μm.quadrature. or more are disclosed. An electrode substrate and a...
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6305074 |
Support for integrated circuit and process for mounting an integrated circuit on a support
The process for mounting an integrated circuit (11) on a support (10) comprising a structure (13) of conductors (14) comprises connecting the conductors to respective terminals (12) of the...
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6307160 |
High-strength solder interconnect for copper/electroless nickel/immersion gold metallization solder pad and method
A high-strength solder interconnect formed on a copper/electroless nickel/immersion gold metallization solder pad and method. The invention provides a low cost, high-strength solder interconnect on...
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6298551 |
Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areas
An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and...
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6300786 |
Wafer test method with probe card having on-board multiplex circuitry for expanding tester resources
A probe card, a test method and a test system for testing semiconductor wafers are provided. The test system includes the probe card, a tester for generating test signals, and a wafer prober for...
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6293008 |
Method for producing foil circuit boards
A method for producing a foil circuit board including a plurality of flexible electrically non-conductive and flexible conductive layers, which are laminated together. The non-conductive layers are...
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6292370 |
Flexible circuit board and method for making a flexible circuit board
A flexible circuit board and a method for making a flexible circuit board. The flexible circuit board (10) is formed from a substantially rigid material and includes a first portion (12) and a...
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6286204 |
Method for fabricating double sided ceramic circuit boards using a titanium support substrate
An integrated double sided metal supported display device has a green tape stack on both sides of the metal support. The green tape stacks incorporate circuitry and conductor filled vias to access...
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6288905 |
Contact module, as for a smart card, and method for making same
A module, such as a contact module for embedding an electronic device into a credit card, smart card, identification tag or other article, comprise a pattern of metal contacts having a first and a...
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6276055 |
Method and apparatus for forming plugs in vias of a circuit board layer
A method of forming one or more plugs in a circuit board layer is described which includes providing the circuit board layer, the circuit board layer having a first surface, a second surface, and...
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6272742 |
Method of electrically connecting substrates using solder balls
A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of placing one or more blind vias in a first substrate positioned on top of a first...
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6272741 |
Hybrid solder ball and pin grid array circuit board interconnect system and method
A circuit board interconnect system includes a carrier board with a hybrid solder ball and pin grid array. A plurality of electrically conductive pins extend through the carrier board and are...
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6266872 |
Method for making a connection component for a semiconductor chip package
A method of making a microelectronic assembly includes providing a connection component including a dielectric element with electrically conductive parts, providing a fugitive material in contact...
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6266874 |
Methods of making microelectronic components having electrophoretically deposited layers
A method of making a microelectronic component by providing a conductive element, providing a resist at selected locations on said conductive element and electrophoretically depositing an uncured...
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6263563 |
Method of manufacturing and checking electronic components
The invention relates to electronic technique, particularly to technology of fabricating and checking semiconductor integrated circuits and semiconductor structures. The method of manufacturing and...
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6256874 |
Conductor interconnect with dendrites through film and method for producing same
A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming...
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6254923 |
Solder particle deposition
Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211...
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6249962 |
Process for manufacturing a multi-layer circuit board with supporting layers of different materials
A circuit board is manufactured having a structure which includes a plurality of supporting layers each of different materials. The supporting layers support electrically conducting patterns. Each...
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6240636 |
Method for producing vias in the manufacture of printed circuit boards
In a process producing a multi-layer printed wiring board, an inner core having at least one wiring pattern on its surface and an outer layer of copper foil are laminated with an organic insulating...
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6237218 |
Method and apparatus for manufacturing multilayered wiring board and multi-layered wiring board
A method for manufacturing multi-layered wiring board in which the positions of alignment marks are detected by irradiating a base material with X rays, and the position of the base material is...
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6239980 |
Multimodule interconnect structure and process
A circuit design is logically partitioned into a plurality of blocks. As a first hierarchial assembly level, the blocks are fabricated as individual submodules each including at least one...
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6233820 |
Method for manufacturing of a multilayer microwave board and boards obtained on the basis of this method
Method for manufacturing a multilayer microwave board in one operation. Individually etched layers of a laminate, such as duroid, are bonded to form a package and drilled after which the resulting...
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