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6530147 |
Microfiber dielectrics which facilitate laser via drilling
This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic...
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6528732 |
Circuit device board, semiconductor component, and method of making the same
A circuit device board having a desired characteristic is provided by bonding dielectric substrates. A printed board 11 carrying patterns 11 a and 11 b incorporating a resonator is joined by...
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6528734 |
Semiconductor device and process for fabricating the same
A packaged semiconductor device comprises a packaging substrate having a core substrate having core wiring layers formed on opposite surfaces thereof, respectively, and a plurality of core via...
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6526653 |
Method of assembling a snap lid image sensor package
An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form...
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6526654 |
Method of producing double-sided circuit board
The method comprises forming a plurality of wiring pattern layers on the front surface of a substrate. In the process of forming the wiring pattern layers, an insulator protection film keeps...
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6528733 |
Multi-layer circuit board and method of manufacturing same
An inner layer circuit board with a convex inner layer circuit pattern having a predetermined thickness, a prepreg sheet having conductive material disposed in a plurality of through-holes and...
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6523252 |
Coaxial cable, method for manufacturing a coaxial cable, and wireless communication device
The invention relates to a coaxial conductor having an inner conductor (S), an outer conductor (U) encasing the inner conductor (S) at least partly, and a dielectric (E) placed between the two. The...
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6523256 |
Method of manufacturing a wiring board
A resin structure includes a resin layer and a metal layer. The resin layer is formed of a single material. The metal layer is laminated directly on the resin layer without intervention of an...
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6519843 |
Method of forming a chip carrier by joining a laminate layer and stiffener
A cavity-type chip module. The module is formed with an adhesive joining layer of photoimageable material interposed between a metal stiffener and a laminate top layer with a central aperture...
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6516513 |
Method of making a CTE compensated chip interposer
A multilayer CTE compensated chip interposer for connecting a semiconductor chip to a laminate chip carrier. A first dielectric layer, on the chip side of the interposer, is made of a stiff, high...
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6509528 |
Printed circuit board and manufacturing process thereof
A printed circuit board and a manufacturing method thereof can realize a thick film laminated structure of single resin material of low dielectric constant without reinforcement material. The...
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6499214 |
Method of making a circuit board
A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge ...
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6499215 |
Processing of circuit boards with protective, adhesive-less covers on area array bonding sites
A method for processing circuit boards containing area array surface treated bonding sites, such as noble metal terminal pads of a Land Grid Array (LGA) assembly. The circuit board includes a...
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6496384 |
Circuit board assembly and method of fabricating same
A circuit board assembly and method of fabricating an assembly are provided. The assembly preferably comprises a first circuit board defining an aperture and a second circuit board having an edge....
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6495771 |
Compliant multi-layered circuit board for PBGA applications
A electronic package is constituted of a compliant multi-layered circuit board or printed circuit board package, particularly for use in ball grid array (BGA) applications wherein two or possibly...
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6490786 |
Circuit assembly and a method for making the same
A method 10 for producing a circuit assembly 30 having a polymeric member 14 upon which conductors, such as conductors 64 , may be easily and selectively interconnected to another circuit...
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6489182 |
Method of fabricating a wire arrayed chip size package
A chip size package is fabricated by: etching portions of a copper film on an insulating film tape, forming a solder mask on the insulating film tape excluding inner holes of metal pattern units...
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6486394 |
Process for producing connecting conductors
A method for the manufacture of screened or shielded interconnecting conductors ( 1 ) begins with semifinished foil products (H 1, H 2, H 3 ), a first semifinished foil product (H 1 ) having at...
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6483710 |
Method and apparatus to facilitate removal and installation of removable components
A method and apparatus for facilitating the removal and installation of components of a system. The installation and removal of the component may be a completed without the need to manually...
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6478920 |
Chip-type circuit component and method of manufacturing the same
A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second...
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6473963 |
Method of making electrical circuit board
A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes is disclosed. The method includes forming channels in a first and second pre-circuit...
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6470545 |
Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrate
Embedded green multi-layer ceramic capacitors in low-temperature co-fired ceramic (LTCC) substrates are provided. A first set of electrodes is printed on a ceramic tape. A first dielectric layer is...
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6471805 |
Method of forming metal contact pads on a metal support substrate
A method of forming low resistance contact pads on a metal support substrate for a multilayer ceramic printed circuit board comprising forming a patterned layer of a conductive metal on the metal...
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6467138 |
Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same
This invention is provided a method for making a backing layer for an ultrasonic matrix array transducer useful in diagnostic imaging, non-destructive material testing and treatment of human...
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6467161 |
Method for making a circuit board
A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of...
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6467137 |
Method of manufacturing an ink jet recording head
A method of manufacturing an ink jet recording head. On one and the other surfaces of an ink supply plate, formed with a plurality of discrete ink supply ports and a corresponding number of...
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6466294 |
Liquid crystal display panel using sealing adhesive containing conductive particles
A liquid crystal display panel with a narrow frame, fabricated by eliminating the space required for applying conductive paste. Sealing adhesive containing conductive particles is applied along a...
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6465742 |
Three dimensional structure and method of manufacturing the same
Disclosed is a three dimensional structure comprising a porous body and a plurality of regions having a substance loaded in the porous body. An average period of a part of the plural regions loaded...
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6460247 |
Wiring board constructions and methods of making same
A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped in the top surface thereof. A conductor material is disposed within...
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6454878 |
Cladded material construction for etched-tri-metal circuits
A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation...
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6453553 |
Method for making an anisotropic conductive coating with conductive inserts
A process for manufacturing an anisotropic conducting film including an insulating film in which holes are formed. Conducting inserts are located in the holes. First ends of the inserts project...
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6449821 |
Method of constructing segmented connections for multiple elevation transducers
A method for constructing a connection assembly for use in a multiple aperture ultrasonic tranducer including an array of elements for transmitting or receiving signals, wherein each element is...
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RE37840 |
Method of preparing a printed circuit board
Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board has two types of plated through holes. The first type of plated through holes...
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6449840 |
Column grid array for flip-chip devices
A method for providing C4-type bumps which are higher than conventional C4 bumps. A dielectric substrate is copper cladded on both sides. At each prospective bump location, a via is laser ablated...
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6449836 |
Method for interconnecting printed circuit boards and interconnection structure
In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive...
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6448509 |
Printed circuit board with heat spreader and method of making
A method of making a PCB having an integral heat spreader and/or central ground plane includes forming one or more first openings in a first layer of a metal at selected locations and filling the....
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6442813 |
Method of producing a monolithic ceramic capacitor
A monolithic ceramic capacitor includes a plurality of dielectric ceramic layers, a plurality of inner electrodes formed between the dielectric ceramic layers in such a manner that one end of each...
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6441319 |
Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate
A technique for connecting signal tracks within a multi-layer substrate is disclosed. In one embodiment, the technique is realized by providing an opening in a substrate and fitting an inserted...
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6438831 |
Method of manufacturing an interconnector
A method of manufacturing an interconnector that is interposed between a pair of terminal plates each having electrodes arranged in a predetermined pattern, for electrically connecting the...
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6438825 |
Method to prevent intrusions into electronic circuitry
An integrated circuit package which has a flexible circuit that covers an integrated circuit. The flexible circuit contains a conductive line which prevents a probe from accessing the integrated...
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6438821 |
PTC thermistor and method for manufacturing the same
The present invention aims to provide a PTC thermister which uses a conductive polymer having a positive temperature coefficient and has a high withstand voltage and high reliability and in which...
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6434819 |
Production of multilayer circuit board
To enable vias to be arranged at an improved density and ensure good electrical connection between conductor wiring patterns in the adjoining insulating layers, a process of producing a multilayer...
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6436803 |
Manufacturing computer systems with fine line circuitized substrates
Circuit boards are manufactured by forming a substrate with a dielectric surface and laminating a metal foil onto the substrate. The metal foil is patterned to form a first wiring layer. A...
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6434036 |
Card-type storage device
A method of manufacturing a small, thin card-type storage device is capable of easily manufacturing a frame for the storage device from a variety of resin materials without molding a very thin...
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6427323 |
Method for producing conductor interconnect with dendrites
A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming...
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6421911 |
Apparatus and method for providing automatic alignment of a circuit board within a chassis
An apparatus for providing automatic alignment of a circuit board within a chassis includes a housing member having an end wall portion. The end wall portion includes a plurality of openings formed...
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6418615 |
Method of making multilayered substrate for semiconductor device
A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face...
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6417024 |
Back-to-back semiconductor device module, assemblies including the same and methods
A back-to-back semiconductor device module including two semiconductor devices, the backs of each being secured to one another. Each of the bond pads of both of the semiconductor devices are...
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6408507 |
Heat sink to semiconductor module assembly equipment and method
Automated equipment mounts heat sinks on printed circuit boards. First heat sinks, semiconductor modules and second heat sinks are consecutively seated on a plurality of built-up pads as the...
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6408511 |
Method of creating an enhanced BGA attachment in a low-temperature co-fired ceramic (LTCC) substrate
A method for providing an enhanced ball grid array attachment in low-temperature co-fired ceramic (LTCC) substrate is provided. A termination cup is formed in a substrate. The termination cup has a...
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