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6446334 |
Heat transfer material for an improved die edge contacting socket
An improved die edge contacting socket incorporates particles of a thermally conducting material into an elastomeric compression pad disposed in the sealing cap of the socket. The elastomeric...
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6442813 |
Method of producing a monolithic ceramic capacitor
A monolithic ceramic capacitor includes a plurality of dielectric ceramic layers, a plurality of inner electrodes formed between the dielectric ceramic layers in such a manner that one end of each...
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6441319 |
Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate
A technique for connecting signal tracks within a multi-layer substrate is disclosed. In one embodiment, the technique is realized by providing an opening in a substrate and fitting an inserted...
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6438831 |
Method of manufacturing an interconnector
A method of manufacturing an interconnector that is interposed between a pair of terminal plates each having electrodes arranged in a predetermined pattern, for electrically connecting the...
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6438825 |
Method to prevent intrusions into electronic circuitry
An integrated circuit package which has a flexible circuit that covers an integrated circuit. The flexible circuit contains a conductive line which prevents a probe from accessing the integrated...
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6438821 |
PTC thermistor and method for manufacturing the same
The present invention aims to provide a PTC thermister which uses a conductive polymer having a positive temperature coefficient and has a high withstand voltage and high reliability and in which...
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6436803 |
Manufacturing computer systems with fine line circuitized substrates
Circuit boards are manufactured by forming a substrate with a dielectric surface and laminating a metal foil onto the substrate. The metal foil is patterned to form a first wiring layer. A...
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6434819 |
Production of multilayer circuit board
To enable vias to be arranged at an improved density and ensure good electrical connection between conductor wiring patterns in the adjoining insulating layers, a process of producing a multilayer...
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6434036 |
Card-type storage device
A method of manufacturing a small, thin card-type storage device is capable of easily manufacturing a frame for the storage device from a variety of resin materials without molding a very thin...
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6427325 |
Flowable compositions and use in filling vias and plated through-holes
A printed circuit board or card having plated through-holes is provided wherein plated through-holes are filled with a photocured polymerized composition. Also, a method for fabricating these...
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6427324 |
Inherently robust repair process for thin film circuitry using UV laser
A multilayer thin film structure having defined strap repair lines thereon and a method for repairing interconnections in the multilayer thin film structure (MLTF) and/or making engineering changes...
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6427323 |
Method for producing conductor interconnect with dendrites
A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming...
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6423622 |
Lead-bond type chip package and manufacturing method thereof
A lead-bond type chip package includes a multilayer substrate for supporting and electrical interconnecting a semiconductor chip. The multilayer substrate has a slot defined therein. The multilayer...
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6421911 |
Apparatus and method for providing automatic alignment of a circuit board within a chassis
An apparatus for providing automatic alignment of a circuit board within a chassis includes a housing member having an end wall portion. The end wall portion includes a plurality of openings formed...
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6418616 |
Full additive process with filled plated through holes
A method provides for additive plating on a subcomposite having filled plated through holes. Fine-line circuitry is achieved via electroless deposition onto a dielectric substrate after the through...
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6418615 |
Method of making multilayered substrate for semiconductor device
A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face...
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6417024 |
Back-to-back semiconductor device module, assemblies including the same and methods
A back-to-back semiconductor device module including two semiconductor devices, the backs of each being secured to one another. Each of the bond pads of both of the semiconductor devices are...
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6412168 |
Method of making an electrical circuit board
A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26.
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6409869 |
Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material
A method for manufacturing a printed wiring board, comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin...
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6408511 |
Method of creating an enhanced BGA attachment in a low-temperature co-fired ceramic (LTCC) substrate
A method for providing an enhanced ball grid array attachment in low-temperature co-fired ceramic (LTCC) substrate is provided. A termination cup is formed in a substrate. The termination cup has a...
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6408507 |
Heat sink to semiconductor module assembly equipment and method
Automated equipment mounts heat sinks on printed circuit boards. First heat sinks, semiconductor modules and second heat sinks are consecutively seated on a plurality of built-up pads as the...
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6407333 |
Wafer level packaging
An integrated circuit package ( 50 ) may include an integrated circuit chip ( 22 ) having an integrated circuit ( 14 ). A lead frame ( 28 ) may be opposite the integrated circuit chip ( 22 ). The...
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6405431 |
Method for manufacturing build-up multi-layer printed circuit board by using yag laser
A method for manufacturing a build-up multi-layer printed circuit board is disclosed in which a YAG laser is used upon the formation of a via hole in the multi-layer printed circuit board, such...
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6397459 |
Printed wiring board with mounted circuit elements using a terminal density conversion board
A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first...
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6395374 |
Method of making microwave, multifunction modules using fluoropolymer composite substrates
A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite...
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6393696 |
Method for manufacturing printed circuit board
A method for manufacturing a printed circuit board is disclosed. When a metal is plated on an upper board to form a circuit, bonding fingers for being bonded with a semiconductor chip are prevented...
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6389686 |
Process for fabricating a thin multi-layer circuit board
A process for fabricating thin multi-layer circuit boards. A substrate is disposed over a heat-accumulating block adjacent thereto so that it is uniformly heated from the back side thereof during...
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6381836 |
Clip and pin field for IC packaging
An electronic assembly that incorporates a heat sink. The subassembly includes an integrated circuit package that is mounted to a substrate. The substrate is mounted to a spacer block which...
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6378201 |
Method for making a printed circuit board
A multilayer printed circuit board and a corresponding fabrication method are disclosed, which circuit board achieves a relatively high degree of wiring density and a relatively high degree of...
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6378199 |
Multi-layer printed-wiring board process for producing
A multi-layer printed-wiring board including a substrate having a plurality of wiring pattern layers sequentially transferred thereon, each wiring pattern layer containing an electrically...
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6370030 |
Device and method in electronics systems
The present invention relates to a device and a method at a printed board for obtaining good transmission qualities in transmission conductors on a predetermined area ( 10 ) of the printed board (...
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6360431 |
Processor power delivery system
A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the...
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6356455 |
Thin integral resistor/capacitor/inductor package, method of manufacture
A thin electrical circuitry structure is formed which contains conductive circuitry traces, integral capacitors and integral resistors. A first laminate structure comprises a conductive foil having...
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6356451 |
Multi-layered substrate, method for manufacturing the multi-layered substrate and electric apparatus
Conductive layers have at least a portion of a conductive member arranged in a nonlinear or polygonal configuration and having a greater layout area and an insulating layer is alternately stacked...
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6354000 |
Method of creating an electrical interconnect device bearing an array of electrical contact pads
A method of constructing a planar array of electrical contact pads is disclosed, comprising the following steps. First, providing a set of dielectric layers each having two major surfaces and...
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6353997 |
Layer build-up method for manufacturing multi-layer board
A layer build-up process for forming a multi-layer board. A conductive substrate has a plurality of bumps formed thereon. The space between the bumps is filled with a dielectric material. The...
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6353189 |
Wiring board, wiring board fabrication method, and semiconductor package
A wiring board provided with a line 1 , a shield pattern 2 formed in parallel with the line 1 , a conductor layer 4 formed so as to face the line 1 and the shield pattern 2 through an...
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6342682 |
Printed wiring board and manufacturing method thereof
A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and...
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6341417 |
Pre-patterned substrate layers for being personalized as needed
A method and structure for personalizing a multi-layer substrate structure includes supplying a generic layer having electrical features and altering the electrical features to produce a...
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6338776 |
Dielectric processing with included stabilization periods
The present invention is directed to allowing a work piece to stabilize in regard to temperature and humidity/water content prior to precision operations so as to minimize any problems resulting...
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6338642 |
Electrical connector
Electrical connector having an insulative body ( 12 ) with contact elements ( 32 ). The contact elements ( 32 ) have at one end thereof spring contact portions ( 40 ) arranged within a socket ( 44...
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6338195 |
Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet
A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer...
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6338194 |
Method of making a circuitized substrate assembly with carrier having substrates therein
A method of making an assembly comprised of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier through the use of appropriate, paired...
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6336990 |
Thermocompression bonding method for electrically and mechanically connecting conductors
A tape carrier package is stacked on an array substrate while interposing a thermosetting type anisotropic conductive adhesive between a plurality of first conductors formed on the end portion of...
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6336269 |
Method of fabricating an interconnection element
Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then...
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6334249 |
Cavity-filling method for reducing surface topography and roughness
A method of minimizing the volume of the depressions 240 in aluminum cavity filling processes, by-depositing a conformal first layer of aluminum alloy 220 by chemical vapor deposition,...
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6334247 |
High density integrated circuit apparatus, test probe and methods of use thereof
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The...
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6333468 |
Flexible multi-layered printed circuit cable
A thin flexible multi-layered printed circuit cable manufactured by a relatively simple process and having improved electro-magnetic interference and impedance characteristics is described. The...
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6332267 |
Process of manufacturing a removably interlockable assembly
A process for making a removably interlockable connector assembly that includes a first connector having a head on a mesa and a second connector having an opening that receives the head on the...
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6327776 |
Circuit component mounting system and circuit component mounting method
A system for mounting circuit components on a circuit substrate, including a circuit-substrate supporting device which supports the circuit substrate, a circuit-component mounting device which...
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