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6618936 |
Method for configuring a portable computer with a battery housing
A system and method are disclosed for configuring a portable computer comprises encasing the computer in an enclosure, providing battery slot defined by at least one wall of the enclosure, encasing...
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6618934 |
Method of manufacturing small volume in vitro analyte sensor
A sensor utilizing a non-leachable or diffusible redox mediator is described. The sensor includes a sample chamber to hold a sample in electrolytic contact with a working electrode, and in at least...
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6612028 |
Method for manufacturing a built-up circuit board
Methods are provided for the manufacture of a conductive layer on an insulating layer and for the manufacture of a built-up circuit board, each include an innovative step of irradiating the surface...
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6612025 |
Method for creating a connection within a multilayer circuit board assembly
A method for forming connections within a multi-layer electronic circuit board 10 . The method includes forming an aperture within the circuit board and selectively coating the interior surface of...
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6609294 |
Method of bulk fabricating printed wiring board laminates
A novel process for fabricating metal clad laminates used in the manufacture of printed wiring boards. The process which eliminates multiple use separator plates within laminate books during...
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6609297 |
Method of manufacturing multilayer printed wiring board
A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30 b and an opening 3 a through which a via hole is formed. A camera senses this register...
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6606792 |
Process to manufacturing tight tolerance embedded elements for printed circuit boards
A process for forming printed circuit substrates incorporating impedance elements in which a pattern of impedance elements and a conductor pattern are incorporated on an insulating support. The...
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6607780 |
Process of forming a ceramic structure using a support sheet
The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more...
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6604267 |
Method for manufacturing a piezoelectric device
A method for manufacturing a piezoelectric device includes the steps of providing a piezoelectric substrate having a piezoelectric driving unit and laminating outer coating substrates on major...
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6604282 |
Circuit board manufacturing method
Terminals of a plurality of types of components to be mounted on a circuit board are provided beforehand with a joining material corresponding to the type of component. A basic joining material is...
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6605868 |
Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layer
An insulating substrate ( 1 ) has insulative ceramic layers ( 2, 3 ) laid one upon another, an intermediate layer ( 4 ) made of a material that is different from a material of the ceramic layers...
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6601295 |
Method of producing chip-type electronic devices
Chip-type electronic devices are produced by providing a base board which is later to be cut into rectangular substrates, forming longitudinally and transversely aligned throughholes through the...
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6594875 |
Method for producing a piezoelectric/electrostrictive actuator
A method for forming a piezoelectric/electrostrictive actuator in which a piezoelectric/electrostrictive file is formed on a vibrating plate or lower electrode by applying a layer of a ceramic...
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6594890 |
Method of separating a plate-like workpiece held by adhesion on an elastic adsorption pad
A method of separating a plate-like workpiece held by adhesion on an elastic adhesive pad from the pad. The elastic adhesive pad has innumerable pores in its surface and generates adhesive force...
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6594891 |
Process for forming multi-layer electronic structures
A process of forming a multi-layer electronic composite structure. The process includes providing at least one core including at least one plane of at least one electrically conducting material...
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6591491 |
Method for producing multilayer circuit board
A producing method of a multilayer circuit board for ensuring that a circuit board, such as an interposer, is provided on the multilayer circuit board. The method includes the steps forming the...
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6591490 |
Method of constructing a multilayer electric apparatus
A method of constructing a multilayer electric apparatus. The method includes forming a set of conductive features and a plurality of fiducial markings on a first dielectric layer in mutual...
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6584681 |
Method for producing a microelectronic component of sandwich construction
A method for producing a microelectronic component of sandwich construction, which includes the steps of providing a first substrate which has a first conductor track plane, providing a plurality...
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6584684 |
Method for assembling a carrier and a semiconductor device
A module or assembly is formed by interposing a polymer between a carrier and a semiconductor device to be secured to the carrier. The polymer has ionized metallic particles suspended in it. Before...
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6585566 |
Method for manufacturing dielectric wave guide
A method for manufacturing a dielectric waveguide at a low manufacturing cost, the dielectric waveguide comprising a pair of conductor plates approximately parallel to each other and the dielectric...
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6581279 |
Method of collectively packaging electronic components
Method of collectively packaging a plurality of electronic components formed in a first substrate, wherein the electronic components are separated from one other by separation strips associated...
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6581278 |
Process and support carrier for flexible substrates
A substrate carrier which is used through beginning assembly operations such as solder reflow for attaching ball grid array devices to flexible substrates. The carrier includes a main structural...
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6578260 |
Method for assembling a multi-deck power supply device
A method for assembling a multi-deck power supply device including control and power components. The method comprises providing a first circuit board having a first and a second side. Two...
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6574862 |
Method for coupling PCB sheet
In a method for coupling a PCB sheet, if a defective PCB is found after the manufacture of continuously arranged circuit patterns, then the defective PCB sheet portion is removed to replace it with...
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6574863 |
Thin core substrate for fabricating a build-up circuit board
Disclosed is a method of preparing a thin core substrate for fabricating a build-up multilayer circuit board. The method involves the use of an insulating layer which is covered with the...
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6574859 |
Interconnection process for module assembly and rework
An interconnection structure and methods for making and detaching the same are presented for column and ball grid array (CGA and BGA) structures by using a transient solder paste on the electronic...
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6571444 |
Method of manufacturing an ultrasonic transducer
A method is provided for making an ultrasonic transducer particularly useful in medical imaging. The transducer includes a transducer body having a major front surface for radiating ultrasonic...
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6571465 |
Electronic component feeding and mounting apparatus
An apparatus includes a component storage device, a transfer head, a component alignment section, and a mounting head. The component storage device houses a plurality of lattice-shaped trays on...
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6571467 |
Method for producing a doublesided wiring board
The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via...
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6568054 |
Method of producing a multilayer electronic part
A method of producing a multilayer electronic part having the shape of a substantially rectangular parallelopiped is constituted which has a multilayer body formed by superposing coil conductors...
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6564450 |
Contacting-making system for two printed circuit boards
In a printed circuit board pair, each of the printed circuit boards having a contact region with contact elements, a contact-making system includes a first circuit board having three-dimensionally...
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6564452 |
Method for creating printed circuit board substrates having solder mask-free edges
A substrate for a plurality of electronic assemblies includes a strip of printed circuit board (PCB) material including a surface and a plurality of segments. Each segment is adapted to receive at...
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6564448 |
Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it
A resin structure includes a resin layer and a metal layer. The resin layer is formed of a single material. The metal layer is laminated directly on the resin layer without intervention of an...
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6564451 |
Hole filling method for a printed wiring board
On carrying out a hole filling method for a printed wiring board having an interlayer connection hole, first and second printed wiring boards ( 1 and 2 ) are prepared, each of which has the...
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6564449 |
Method of making wire connection in semiconductor device
A method of making a wire connection in a semiconductor device, the method comprising: (a) forming an under bump metallurgy (UBM) over a chip including the bonding pad formed thereon; (b) forming a...
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6560860 |
Low temperature co-fired ceramic with improved registration
A low temperature co-fired ceramic assembly (LTCC) with a constraining core to minimize shrinkage of outer ceramic layers during firing. The outer ceramic layers have high density circuit features....
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6557250 |
Multilayer board compound and method for the manufacture thereof
A multilayer printed board compound comprises at least two planely superposed printed boards, each of which having an electrically insulating mother board, electrically conductive circuit paths,...
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6553658 |
Assembling a stacked die package
A method for assembling a multi-chip module does not necessitate more than one pass through a die attach machine. The method involves attaching a smaller die to a larger die without using a die...
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6550117 |
Multilayer ceramic electronic element and manufacturing method therefor
Internal electrode layers of a multilayer ceramic electronic element are structured such that spaces, which are formed between adjacent internal electrodes, are eliminated so as to substantially...
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6546623 |
Structure equipped with electrical contacts formed through the substrate of this structure and process for obtaining such a structure
A process for manufacturing a structure equipped with at least one electrical contact, including forming on a substrate a first layer, forming on a front side of the first layer the structure...
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6546622 |
Printed-wiring substrate and method for fabricating the same
A printed-wiring substrate 1 includes internal dielectric resin layers 12 and 14 . A main-surface-side external dielectric resin layer 13 is formed on the internal dielectric resin layer 12...
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6548858 |
Multi-layer circuit board
A multi-layer circuit board includes first, second, third, fourth and fifth insulating substrates, first, second, third and fourth signal wiring layers, a ground wiring layer and a power wiring...
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6545228 |
Semiconductor device with a plurality of stacked boards and method of making
A semiconductor device includes a semiconductor chip and a substrate having an interconnecting pattern formed thereover. The substrate has the semiconductor chip mounted on one surface thereof. The...
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RE38062 |
Microwave and millimeter wave stripline filter and process for fabricating same
Pre-fired ceramic substrates are elected according to the desired electrical performance of the filter. If necessary for enhanced performance, the surfaces of the substrate may be lapped to assure...
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6539625 |
Chromium adhesion layer for copper vias in low-k technology
In integrated circuits having copper interconnect and low-k interlayer dielectrics, a problem of open circuits after heat treatment was discovered and solved by the use of a first liner layer of...
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6539626 |
Process of making curved ceramic moulded part containing internal electrically conductive paths
A curved multilayer ceramic moulded part, particularly curved in directions perpendicular to one another, is limited by two virtually parallel surfaces and an edge. Electrically conductive path(s)...
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6531660 |
Printed substrate board
A printed substrate board constructed, from a substantially unitary body includes at least one edge part along a side mountable into an external mounting device. The printed board includes...
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6530147 |
Microfiber dielectrics which facilitate laser via drilling
This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic...
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6528732 |
Circuit device board, semiconductor component, and method of making the same
A circuit device board having a desired characteristic is provided by bonding dielectric substrates. A printed board 11 carrying patterns 11 a and 11 b incorporating a resonator is joined by...
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6528734 |
Semiconductor device and process for fabricating the same
A packaged semiconductor device comprises a packaging substrate having a core substrate having core wiring layers formed on opposite surfaces thereof, respectively, and a plurality of core via...
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