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6701614 |
Method for making a build-up package of a semiconductor
A method for making a build-up package of a semiconductor die and a structure formed from the same. A copper foil with conductive columns is bonded to an encapsulated die by thermal compression,...
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6703565 |
Printed wiring board
A printed wiring board includes at least one insulator sheet having through holes filled with conductive material and a conductive wiring pattern. The wiring pattern is embedded in the insulator...
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6698091 |
Method and apparatus for coupling circuit boards
A method and circuit board assembly provide a zero interconnection height in a board-to-board interconnect while maintaining efficient space allocation for multiple axis connections by providing a...
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6694613 |
Method for producing a printed-circuit board having projection electrodes
A method for producing a printed-circuit board includes forming via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via holes with a conducting paste;...
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6694612 |
Mask film having a non-parting portion
A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be...
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6694583 |
Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate
An apparatus and method for creating multi-layer embedded ceramic capacitors in low-temperature co-fired ceramic (LTCC) substrates. In order to create multiple layers of electrodes, the individual...
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6691409 |
Method of producing a circuit board
A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member...
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6687985 |
Method of Manufacturing a multi-layer circuit board
A multilayer wiring board comprising a mother wiring board and a carrier wiring board, in which all of the composing layers have IVH structure. The mother wiring board ( 11 ) is formed in the...
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6687984 |
Method for manufacturing flexible multilayer circuit board
An internal layer circuit board to which an opening portion 14 is provided at a predetermined position and a required wiring pattern 1 is formed so as to expose a terminal portion 1 A to the...
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6690088 |
Integrated circuit package stacking structure
A stack of integrated circuits in thin small outline packages (TSOP's) is constructed with an air space in between adjacent packages. The TSOP's have a plurality of connection terminals extending...
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6686824 |
Toroidal printed coil
A toroidal printed coil includes a plurality of annular holes ( 2 ) and a plurality of center holes ( 3 ) surrounded by the annular holes ( 2 ) in an insulating substrate ( 1 ). A plurality of...
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6684493 |
Vertically mountable interposer, assembly and method
A support assembly for mounting a semiconductor device vertically relative to a carrier substrate is disclosed. The support assembly includes an interposer to which the semiconductor device is...
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6683260 |
Multilayer wiring board embedded with transmission line conductor
Transmission line structure is composed of a pair of signal conductors which are embedded in one wiring region of a dielectric layer and a thickness in height of the signal conductor is larger than...
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6680517 |
Anisotropic conductive film, production method thereof, and display apparatus using anisotropic film
An anisotropic conductive film which can be appropriately applied for the display apparatus by which the user can directly write characters•figures on the display, or erase characters and figures...
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6678946 |
Method of manufacturing a circuit unit
An upper surface of a bottom surface ( 31 ) of a lower casing ( 30 ), covering a lower surface of an FPC ( 23 ), is made flat so as not to hinder a coating operation in which solder paste is coated...
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6675469 |
Vapor phase connection techniques
Electrical connections are made between a pair of elements disposed on opposite side of the hole extending through a dielectric layer by evaporating a conductive material such as a metal having...
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6675456 |
Alignment plate with matched thermal coefficient of expansion method
Proper registration between layers of a laminated multi-layer interconnect can be achieved by precisely dimensioning the alignment plate, selecting the materials of which the alignment plate is...
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6675470 |
Method for manufacturing an electro-optical device
A method is provided for manufacturing an electro-optical device including a flexible wiring board having a conductive terminal electrically connected to an electro-optical display apparatus,...
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6671952 |
Method of lead wire connection
A method of lead wire connection includes mounting a lead wire onto an uppre surface of a land portion, supplying a cover member onto the lead wire, pressing the lead wire via the cover member...
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6673190 |
Lasable bond-ply materials for high density printed wiring boards
This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of...
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6668448 |
Method of aligning features in a multi-layer electrical connective device
A method of constructing an electric apparatus, comprising the following steps. First, a set of dielectric layers is provided. Next, a set of conductive features and at least one fiducial marking...
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6668447 |
Multilayered board comprising folded flexible circuits and method of manufacture
An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a...
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6662442 |
Process for manufacturing printed wiring board using metal plating techniques
A process for producing a printed wiring board, particularly an interposer for a chip size package, which comprises the steps of (1) forming an outer insulator layer 22 having outer via-holes 24...
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6662441 |
Method for making multi-layer printed circuit board registration
A method for detecting misalignment of layers of a multi-layer circuit board. A plurality of layers of electrically insulating material are formed. At least one artwork feature is formed on a...
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6662443 |
Method of fabricating a substrate with a via connection
A method of fabricating a multilayer interconnected substrate is disclosed. In one embodiment, the method includes providing a structure having a dielectric substrate having a first substantially...
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6658729 |
Method of controlling shock and vibration of electrical interconnects
An electronic subassembly comprises a printed circuit board and an electronic module, particularly a ceramic module, electrically connected to one another through a planar interposer. The...
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6658727 |
Method for assembling die package
A method of assembling a multi-chip module does not necessitate more the one pass through a die attach machine. The method involves attaching a smaller die to a larger die without using a die...
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6658731 |
Method for fabricating connectors for interconnecting etched tri-metal circuit structures
In conventional ETM circuit structures a pin connector in which the pin is etched from the ETM substrate and the mating cavity is etched from the ETM substrate to be mated. The connector utilizes...
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6655017 |
Electronic controller unit and method of manufacturing same
An electronic controller unit is formed of first and second base plates parallel to one another and spaced apart having a flexible substrate circuit board thereon with an intermediate portion of...
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6656314 |
Method of manufacturing multilayer substrates
A multi-layered substrate is manufactured utilizing a sheet material. The sheet material is a dielectric material with a dielectric adhesive coated on one side. A catalyst layer is at a boundary...
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6655001 |
Process for a diaphragm for electroacoustic transducers
A diaphragm for an electroacoustic transducer has a) a core layer containing poly(meth)acrylimide foam and b) at least one cover layer. The diaphragm is produced by laminating the cover layer with...
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6658375 |
Compensation model and registration simulation apparatus and method for manufacturing of printed circuit boards
Methods and apparatuses are provided for modeling the compensation error and simulating registration error of a multilayer printed circuit board. Experiments are conducted in order to model...
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6651311 |
Disk assembly method for adjusting the disk balance of the hard disk drive
A disk drive recording device comprises at least two platters for storing magnetic recording data and a spindle motor rotating at high speed for mounting the platters. The disk drive is assembled...
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6651324 |
Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer
A process of manufacturing printed circuit boards which is useful in the formation of printed circuit boards containing both areas of thick conductive traces and areas of fine resolution conductors...
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6647618 |
Method of assembling a circuit board into a housing
A method of assembling a circuit board into a housing to form an assembly is disclosed. The method includes inserting a first end of the circuit board into a first slot of the housing, flexing the...
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6647619 |
Positioning arrangement and method
The arrangement includes first and second patterns such as photolithographic patterns of electrically conductive indicia provided on respective first and second surfaces of the components to be...
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6643923 |
Processes for manufacturing flexible wiring boards
A process for manufacturing a flexible wiring board according to the present invention includes growing metal bumps ( 16 ) using a mask film patterned by photolithography. Fine openings are formed...
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6640403 |
Method for forming a dielectric-constant-enchanced capacitor
A method for forming a dielectric-constant-enhanced capacitor is provided. A wafer in a reaction chamber is provided, wherein said wafer comprises a first conductive layer. Then, a first dielectric...
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6640429 |
Method of making multilayer circuit board
A multi-layer circuit board comprises: an insulating layer having upper and lower surfaces thereof, and wiring patterns arranged on the upper and lower surfaces of the insulating layer. A...
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6637102 |
Process for producing an industrial member having throughholes of high aspect ratio
A fabrication method of an industrial part having high-aspect-ratio through-hole sections using a punch and a die, includes: a first step of drilling a first hole section in a first sheet of sheet...
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6631556 |
Fixture to couple an integrated circuit to a circuit board
A fixture to couple an integrated circuit to a circuit board is disclosed and claimed. The fixture includes a base member and a holder to retain the circuit board in a selected position relative to...
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6631555 |
Method of thin film deposition as an active conductor
A method includes populating components in a cavity of a substrate, disposing a polymer over the components and within the cavity. The polymer is cured and a thin film is formed on the polymer. In...
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6629366 |
Method of producing a multilayer wiring board
A multilayer wiring board having a core substrate and wiring line patterns formed on both faces of the core substrate, the core substrate having conducting members piercing through the core...
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6629362 |
Method of manufacturing a circuit print board
The present invention is provided to prevent a rise of temperature of a heating element and temperature of a board by inserting a graphite sheet 1 having high thermal conductivity to a circuit...
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6630630 |
Multilayer printed wiring board and its manufacturing method
A multilayer printed wiring board includes (a) an inner layer material that includes an insulating substrate, an inner conductive pattern formed of a metal foil and disposed on both sides of the...
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6625880 |
Method for producing printed wiring board
A multi-layer printed wiring board is manufactured by forming a wiring pattern and a component mounting portion on a first substrate. An insulating spacer, formed with a first opening, is stacked...
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6625854 |
Ultrasonic transducer backing assembly and methods for making same
An acoustic backing element includes a glass fiber epoxy composite planar substrate to the outer major surfaces of which are applied electrically conductive material. The electrically conductive...
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6625876 |
Methods of manufacturing a push button switch cover
A method for manufacturing a push button switch cover includes providing a cover substrate that is formed on a front surface thereof with at least one key top and on a rear surface thereof with at...
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6618941 |
Method of forming freestanding metal dendrites
A technique for making acicular, branched, conductive dendrites, and a technique for using the dendrites to form a conductive compressible pad-on-pad connector are provided. To form the dendrites,...
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6618933 |
Liquid thermosetting insulating resin composition and method for permanently filling holes in printed circuit board by the use thereof
A liquid thermosetting insulating resin composition and a method for permanently filling holes in a printed circuit board by the use of the composition are provided. The liquid thermosetting...
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