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6791035 |
Interposer to couple a microelectronic device package to a circuit board
An interposer to couple a microelectronic device package to a motherboard is formed from a PCB substrate. Multiple via holes are drilled through a copper-clad PCB substrate and then coated inside...
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6789298 |
Finishing method for producing thin-laminate panels
Provided are thin-laminate panels (i.e., thin-laminate panels having dielectric layers of about 0.006 inches or less and conductive layers on either side of the dielectric layer), wherein the edges...
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6791036 |
Circuit elements using z-axis interconnect
Methods for producing circuit elements the resultant circuit elements, and methods for making circuits therefrom are disclosed. A precursor circuit element includes a first insulating layer with...
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6785941 |
Method for manufacturing multi layer ceramic components
A method of manufacturing a multi-layer ceramic electronic part involves the steps of preparing an unbaked laminated body containing a ceramic layer and internal electrodes laminated on one...
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6787013 |
Biosensor
A spacer forming method for a biosensor that has a biosensor possessing a capillary sampling channel and electrical connecting tracks for the use of a specific portable meter. A pair of electrodes...
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6782611 |
Method of assembling a multi-chip device
A method of assembling a multi-chip device may include coupling solder balls only to selected ones of the conductive pads on an interposer with cache memory devices. The cache memory devices are...
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6782621 |
Method of fabricating a fluid ejector
A method of fabricating a fluid ejector is disclosed. In the present embodiment, a plurality of thin film layers are deposited on a first surface of a printhead substrate, the plurality of thin...
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6779262 |
Method for manufacturing a multilayer printed circuit board
A method for manufacturing a multilayer printed circuit board includes providing a core board, a composite foil including a carrier foil, a functional copper foil and a non-reinforced thermosetting...
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6779263 |
Method for molding a polymer surface that reduces particle generation and surface adhesion forces while maintaining a high heat transfer coefficient
The invention provides a system and apparatus by which a workpiece pad is supplied to support workpieces being implanted in a rotating or spinning batch implanter process disk. The workpiece pad...
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6778247 |
Method for cutting tape carrier packages of a LCD and LCD structure
A cutting method of a tap carrier package of a liquid crystal display. The cutting method cuts a film comprising a first straight layout along a predetermined direction on a wiring layer comprising...
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6772515 |
Method of producing multilayer printed wiring board
To provide a method of producing a multilayer printed wiring board that can be intended to have low-profile, light-weight and high-density wiring of a printed wiring board, and a multilayer printed...
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6769158 |
Method for making a piezo electric actuator
A piezo-electric printhead is formed from a first piezo-electric actuator disposed parallel to a second piezo-electric actuator. The first and second piezo-electric actuators have a shared inner...
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6769159 |
Method for producing a ceramic electronic part
A method for producing a ceramic electronic part includes forming a plurality of internal electrodes arranged in a ceramic sintered compact, superimposed via a ceramic layer. The free ends of the...
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6766577 |
Method for changeably connecting electronic devices
A connection technique for switchably and mutually exclusively coupling a plurality of device sets. The connection technique utilizes a low profile connector having multiple circuit sets, each of...
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6766567 |
Ink jet print head having a porous ink supply layer
A liquid droplet ejection device, which includes a number of liquid ejection nozzles, a liquid supply layer including porous material, with the liquid supply layer featuring holes related to the...
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6766576 |
Method for producing a double-sided wiring board
The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via...
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6760970 |
Method for forming modular sockets using flexible interconnects and resulting structures
Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of...
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6762094 |
Nanometer-scale semiconductor devices and method of making
A semiconductor device including a substrate having a dopant of a first polarity, a first semiconducting structure including a dopant of a second polarity disposed over the substrate, and having...
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6757947 |
Method for manufacturing piezoelectric actuators and a piezoelectric actuator
A method for a parallel manufacturing of a plurality of piezoelectric actuators and a corresponding piezoelectric actuator utilize a plurality of thin foils composed of an unfired piezoelectric...
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6751832 |
Piezoelectric/electrostrictive device and production method thereof
A method of manufacturing a piezoelectric/electrostrictive device includes the following steps. An integrated layered body is obtained by laminating at least one green sheet that is to be a thin...
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6748652 |
Circuit board and method of manufacturing the same
Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined...
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6748650 |
Method for making a circuit assembly having an integral frame
A circuit assembly comprises a substrate comprising one or more conductors. An integral frame of frame elements supports the substrate. The frame elements spaced apart to expose intervening regions...
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6747862 |
System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector
A system and method for providing high voltage resistance capability in a receptacle apparatus for accepting a high-density compliant pin connector. A plurality of high-density compliant pin...
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6744638 |
Construction and method for interconnecting flexible printed circuit and wiring board, liquid crystal display device, and method for manufacturing the same
A wiring board is arranged on the back side of a tape carrier package (TCP), the upper edge of a notch in the leftmost TCP and an outer edge of a branch of the leftmost terminal of the leftmost...
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6742247 |
Process for manufacturing laminated high layer count printed circuit boards
The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder...
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6742248 |
Method of forming a soldered electrical connection
A reliable, long-lived soldered electrical connection is made to a ceramic substrate having a thick-film metallization thereon, over which is deposited a joint-structure-stabilizing thin-film...
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6739046 |
Method for producing dendrite interconnect for planarization
A method is provided for connecting two conductive surfaces in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive surface, applying a...
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6739042 |
Method for assembling a mechatronics sensor
A method of mounting a mechatronics control module ( 14 ) includes an electronic control unit ( 16 ) having a flex foil circuit ( 34 ) with a multiple of mounted electronic components including...
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6739047 |
Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate
A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to...
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6741466 |
Modular electronics system chassis
A chassis for a ruggedized modular electronics system is disclosed. The chassis includes an open support structure that is configured to support ruggedized electronics modules. The open support...
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6739040 |
Method of manufacturing multilayered printed wiring board using adhesive film
The present invention relates to a method of manufacturing a multilayered printed wiring board by a buildup system in which a conductive circuit layer and an insulating layer are alternately piled...
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6735855 |
Methods for electrical connector
In a socket to test semiconductor die, a recessed socket contact that avoids pinching the die contacts is diclosed. The socket contacts allow for smaller socket holes and, allow denser contact...
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6735858 |
Manufacturing method for an electronic apparatus and electronic apparatus with plastic housing
A method of manufacturing an electronic apparatus having a plastic housing. The method includes blow molding with a one-piece plastic housing around an electronic circuit board populated with...
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6738253 |
Electronic power module and a power component designed to equip such a module
An electronic power module including at least one semi-conductor power component disposed on an electrically insulating substrate, wherein said semi-conductor power component includes a face in...
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6735859 |
Method of manufacturing chip scale package
A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member which is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Dice...
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6735860 |
Heat transfer material for an improved die edge contacting socket
An improved die edge contacting socket incorporates particles of a thermally conducting material into an elastomeric compression pad disposed in the sealing cap of the socket. The elastomeric...
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6732428 |
Method for increasing electronic component density on an electronic circuit board
A technique for increasing electronic component density on circuitry boards is disclosed. In one embodiment, the technique is realized as a method for increasing electronic component density on an...
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6729023 |
Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material
A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having...
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6722028 |
Method of making electronic device
A method of manufacturing an electronic device including a first electronic component mounted on one main surface of a wiring board by being thermo-compression bonded by means of a...
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6722031 |
Method for making printed circuit board having low coefficient of thermal expansion power/ground plane
Conductive materials that have low coefficients of thermal expansion (CTEs) and that are used for power and ground planes are disclosed. Fibrous materials (such as carbon, graphite, glass, quartz,...
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6722026 |
Apparatus and method for removably adhering a semiconductor substrate to a substrate support
A process and apparatus is disclosed capable of removably adhering a semiconductor substrate to a substrate support in a sub-atmospheric environment using a plurality of individual fibers, each...
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6718631 |
Process for producing a flexible wiring board
Process for producing a flexible wiring board by etching a metal foil halfway to form a thick film part and a thin film part, etching the thin film part in order to form a first wiring film having...
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6715197 |
Laminated ceramic electronic component and method for manufacturing same
A laminated ceramic electronic component significantly simplifies a step of forming external electrodes and has reliable electrical connection between an internal electrode and the external...
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6711810 |
Method of assembling a land grid array module
A method in which an alignment tool consisting of a nest and guide tool is used to align an LGA module in the nest and then the LGA module is removed from the nest and aligned with a circuit card...
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6711812 |
Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages
A method of making a thermally enhanced BGA substrate in which a metal (copper) core, has dielectric layers applied to each side thereof and conductive through-core build-up vias are provided....
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6713683 |
Wiring board with terminals and method for manufacturing the same
In a wiring board having a terminal for connection of circuits in a variety of electronic devices, a joining section of the terminal is placed on a connecting section of a wiring pattern on the top...
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6708392 |
Method of fabricating uncooled IR detector and arrays using colossal magneto-resistive materials and rock salt structure material substrates
A method of fabricating a colossal magneto-resistive detector using a thin film transfer method includes the use of a rock salt structure material as a substrate. In a second embodiment, the method...
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6708400 |
Method of attaching printed circuits boards within an electronic module housing
Reflow soldering of a variety of circuit boards ( 9, 11, 15 ) in a variety of sizes and shapes to assigned locations on the base or carrier ( 13 ) of the electronic module housing ( 3 ) is...
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6705005 |
Method of forming assemblies of circuit boards in different planes
A method of forming a circuit board with electronic assemblies lying in different planes, includes providing a single circuit board with entire electronic assemblies pressed thereon. A channel is...
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6705003 |
Printed wiring board with plurality of interconnect patterns and conductor bumps
A manufacturing method of a printed wiring board. On a conductor plate 1, approximately conical conductor bumps 1 a, 1 a, . . . are formed, the conductor bumps 1 a, 1 a, . . . being caused...
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