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6910264 |
Method for making a multilayer circuit board having embedded passive components
A method for fabricating a core circuit board having passive components, such as resistors, capacitors and inductors, is disclosed, which can be used to construct a multilayer circuit board having...
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6910261 |
Method of fabricating a colossal magneto-resistive detector using a thin film transfer method
A method of fabricating a colossal magneto-resistive detector using a thin film transfer method includes the use of a perovskite oxide material as a substrate, and a rock salt structure material as...
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6911606 |
Electronic component for adhesion of a plurality of electrodes and method of mounting the same
A chip cover with an insulative property and having a radiating portion has a housing portion on its lower surface. A flip chip piece, which has an electrode surface on which a plurality of...
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6910250 |
Piezo-electric/electrostrictive device, and method of manufacturing same
The present invention provides a piezo-electric/electrostrictive device including a pair of thin plate sections in an opposed relation to each other, a fixing section for supporting the thin plate...
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6904674 |
Process for manufacturing a printed wiring board
A printed wiring board, particularly, an interposer 20 for a chip scale package, comprising an outer insulator layer 22 having outer electrodes 31, a conductor layer 21, and an inner...
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6901660 |
Method for making an abrasion resistant conductive film and gasket
A method for making a conductive gasket for use in apparatus to block the exit or entry of electromagnetic interference (EMI) between adjacent metal surfaces of the apparatus. The gasket is formed...
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6898851 |
Electronic device manufacturing method
It is an object to provide a semiconductor device having a buried multilayer wiring structure in which generation of a resolution defect of a resist pattern is suppressed and generation of a...
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6898845 |
Method for manufacturing hybrid electronic circuits for active implantable medical devices
A method for manufacturing a plurality of hybrid electronic circuits for active implantable medical devices and circuits made by the process. The process includes the following stages: a) preparing...
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6898846 |
Method and components for manufacturing multi-layer modular electrical circuits
A method for manufacturing a modular electrical circuit includes the steps of pre-manufacturing a plurality of components having fine features such as resistors, capacitors, inductances, and...
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6895645 |
Methods to make bimorph MEMS devices
A bimorph structure is produced by depositing a first material on a first surface of a first substrate to form a first element structure. A second material is deposited onto a surface of a second...
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6892432 |
Nanotube cartridge and a method for manufacturing the same
A method for manufacturing a nanotube cartridge including the steps of: adhering numerous nanotubes to a surface of a holder, disposing a knife edge at an inclination to the surface of the holder...
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6892453 |
Method for forming an encapsulation device
An improved die edge contacting socket incorporates particles of a thermally conducting material into an elastomeric compression pad disposed in the sealing cap of the socket. The elastomeric...
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6892449 |
Method of manufacturing electro-optical devices
A method of manufacturing a plurality of electro-optical sub-assemblies in parallel is provided. A plurality of printed circuit boards (PCBs) are preferably formed in a panel of flex material....
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6890449 |
Method for manufacturing printed-circuit board
A method of manufacturing a PCB comprising the steps of: forming through-holes in a substrate having releasing layers on front and back faces; filling conductive paste in the through-holes;...
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6886247 |
Circuit board singulation methods
Methods to singulate circuit forming regions of a circuit board substrate assembly includes providing a plurality of circuit forming regions including at least one pair of adjacent circuit forming...
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6886243 |
Method for manufacturing a flat panel display module
A manufacturing method for a flat panel display module includes forming a display section having a transparent substrate with a wiring line terminal section adjacent at least one edge. A light...
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6884313 |
Method and system for joining and an ultra-high density interconnect
Techniques are given for determining the data transmission or sending rates in a router or switch of two or more input queues in one or more input ports sharing an output port, which may optionally...
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6877220 |
Method for feeding a component
An occurrence component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare...
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6871394 |
Method for aligning substrates in a tray
A substrate 110 that is not lying flat on its substrate tray 100 can present significant process problems when a vacuum pickup attempts to pick up the substrate and fails due to the lack of a...
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6872595 |
Technique for electrically interconnecting signals between circuit boards
A technique for electrically interconnecting a signal between a first circuit board and a second circuit board is disclosed. In each board, at least one signal conductor is shielded by an...
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6865785 |
Method for producing a piezoelectric speaker
A piezoelectric speaker is manufactured by processing a plate to form a frame, a plurality of vibrating plates and a plurality of dampers. The plurality of dampers are connected to the frame and...
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6866368 |
Flexible circuit board
A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and...
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6866741 |
Method for joining large substrates
A method for joining large area semiconductor substrates, a liquid thermoset polymer. Two large area substrates, such as wafers or circuit boards (e.g., rigid or flexible), can be joined together...
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6865786 |
Method for manufacturing a surface acoustic wave device using a shear horizontal type surface acoustic wave
In a method of manufacturing a surface acoustic wave device using a Shear Horizontal type surface acoustic wave, at least one interdigital transducer (IDT) is made of a material having a larger...
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6860003 |
I-channel surface-mount connector
In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by...
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6860000 |
Method to embed thick film components
The invention is directed to a method to embed a thick film resistor composition into a printed wiring board comprising the steps of applying a reinforcing composition onto a resistor composition...
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6860006 |
Method for manufacturing a monolithic ceramic electronic component
A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic...
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6858807 |
Substrate for receiving a circuit configuration and method for producing the substrate
A substrate is adapted to accommodate a circuit configuration. The novel substrate is stable under alternating loads and it favorably dissipates heat. To this end, the substrate has a fastening...
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6857186 |
Method of manufacturing a piezoelectric print-head
A method of manufacturing a piezoelectric ink-jet print-head uses a metallic layer and a thick film layer with a slot hole therein instead of a ceramic vibration plate and an ink layer. The...
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6848171 |
Method of fabricating temperature control device
A temperature control device with heat conduction properties such as heat homogeneity, responsiveness or the like is fabricated by improving flatness. In a method of fabricating a temperature...
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6848176 |
Process for manufacturing flexible wiring boards
A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be...
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6841739 |
Flexible circuit board having electrical resistance heater trace
A flexible circuit board ( 20 ) having a substantially rigid substrate ( 22 ) and an electrical resistance heater trace ( 24 ). The substantially rigid substrate ( 22 ) has a first portion ( 26 ),...
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6839964 |
Method for manufacturing a multi-layer printed circuit board
A method of manufacturing a multilayer printed circuit board (PCB) is provided, the PCB having blind vias connecting to power layers. A portion of the blind vias in the power layers are grouped...
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6836961 |
Ceramic packaging method employing flip-chip bonding
In a ceramic packaging method employing a flip-chip bonding, a gold bump is formed on a chip bond pad in a wafer and the wafer is divided into a plurality of chips by a die sawing. A Cu pattern and...
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6834426 |
Method of fabricating a laminate circuit structure
A method for fabricating a laminate circuit structure is provided. The method comprises: providing at least two modularized circuitized voltage plane subassemblies wherein each of the subassemblies...
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6831235 |
Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof
Each via hole of a printed wiring board is filled with a metal conductor. A distal end of each metal conductor is covered with a diffusing metal layer. The distal end of the metal conductor is...
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6828669 |
Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof
An interconnection substrate comprises an uppermost interconnection layer having a plurality of terminal pads located at positions corresponding to a plurality of solder bumps (external connection...
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6826828 |
Electrostatic discharge-free container comprising a cavity surrounded by surfaces of PMMA-poly covered metal-PMMA
A ESD-free container is provided. A compound material is used for the creation of the container, the compound material comprising a metallic material that is wedged between layer of polymide...
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6826827 |
Forming conductive posts by selective removal of conductive material
A method of fabricating interconnection members for a microelectronic device. An electrically conductive sheet having a uniform thickness is coupled to a first surface of a support substrate....
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6826816 |
Multi-layer multi-dimensional transducer and method of manufacture
A method of manufacturing multiple dimension transducer arrays of multiple layer elements from modules is provided. A plurality of multiple layer strips are formed. The strips are separate, such as...
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6823585 |
Method of selective plating on a substrate
A method and structure to form surface plating metallization on a substrate. Two layers of tape are applied to the surface of the substrate. A first path is cut through both layers of tape exposing...
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6820332 |
Laminate circuit structure and method of fabricating
A substrate and a method of making the substrate is provided. The substrate includes a layer of metal with at least one through hole therein, the layer of metal having an adhesion promoting layer...
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6817091 |
Electronic assembly having solder thermal interface between a die substrate and a heat spreader
An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die...
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6813829 |
Method for removing punched fragments and a method for producing an article by punching
In a method for removing punched fragments in a workpiece formed using a punch and a die, the workpiece, which is tightly attached to a stripper, is lifted without extracting the punch from the...
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6813815 |
Method of producing a piezoelectric/electrostrictive element
A piezoelectric/electrostrictive element including a substantially trapezoidal laminate having narrower and wider surfaces lying substantially in parallel to each other and first and second...
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6807729 |
Method of manufacturing metal foil
The present invention provides a method of manufacturing a metal foil laminated product including the steps of forming a bonding layer containing a thermosetting resin on a lower wiring layer, a...
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6804881 |
Multilayer circuit board manufacturing process
A method for manufacture of a multilayer board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and...
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6800169 |
Method for joining conductive structures and an electrical conductive article
Embodiments of the invention include a method comprising disposing a thin metallic layer having a low melting temperature between one end of a conductive post on a substrate and a conducting...
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6794581 |
Method and apparatus for distributing power to integrated circuits
A system and method for distributing power to an integrated circuit. In one embodiment, a power laminate may be mounted to a printed circuit board (PCB). The integrated circuit for which power is...
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6792679 |
Method of producing electrical connecting elements
A method of making electrical connecting elements includes a metallic thin film 15 is formed on a mold 11 having protrusions 12 complementary in shape to a conductor pattern to be formed; a...
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