Matches 401 - 450 out of 1133 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >
Match Document Document Title
5382546 Semiconductor device and method of fabricating same, as well as lead frame used therein and method of fabricating same  
In a semiconductor device having a number of pins, there is used an inner lead group comprising a group of upper inner leads 7A present in an upper plane and a group of lower inner leads 7B in a...
5380952 Integrated circuit package with stabilizer bar  
A stabilizer bar made of non-conductive material (such as a poly enid plastic) is secured to the top side of extended leads on each side of a flat high density integrated circuit package. The bar...
5378581 Application specific tape automated bonding  
A method for patterning a tape to which an integrated circuit may be bonded including providing a tape having a top layer of unexposed film which, when exposed in an interconnection pattern and...
5378657 Method for making an aluminum clad leadframe and a semiconductor device employing the same  
A quad leadframe (22') for a CERQUAD is manufactured using conventional cladding and stamping technologies. A first metal layer (12) is provided with multiple cavities (14). A second metal layer...
5377403 Method of manufacturing a pressure sensor assembly  
A carrier frame has cells with inwardly extending thin flexible tabs. Pressure sensor housings are molded into the frame cells such that only the tips of the tabs penetrate the housing wall and...
5375320 Method of forming "J" leads on a semiconductor device  
A method for forming a small outline "J" lead for a semiconductor device having a main body and a lead comprises three bend steps. The lead comprises a surface attached to the body, a distal end...
5371943 Method of making a lead frame  
A hole is formed in a metal plate, and after a concave portion is formed by pressurizing a predetermined area on the metal plate including the hole to cause plastic deformation, an island of a lead...
5372972 Method of and an apparatus for processing a lead frame  
Improved transportation accuracy of a lead frame and reduced transportation time is attained. On the both sides of a heat block (1), rails (3a) equipped with a vertical drive mechanism are...
5369059 Method for constructing a reduced capacitance chip carrier  
A method for making an integrated circuit chip carrier having reduced and regulable interlead capacitance and reduced glass chip formation. The chip carrier includes a substrate having a central...
5367763 TAB testing of area array interconnected chips  
A method and apparatus for testing and connecting integrated circuit chips to external packaging and circuitry. A plurality of electrically conductive leads are formed on an electrically insulative...
5365655 Method of making an electronic module for a memory card and an electronic module thus obtained  
The invention relates to a method of making electronic modules for electronic memory cards and to electronic modules thus obtained. Starting with a metal strip, in which patterns have been cut out...
5366933 Method for constructing a dual sided, wire bonded integrated circuit chip package  
A method for constructing a dual sided integrated circuit chip package. A leadframe is formed comprising a set of die pads, and a set of lead fingers corresponding to each die pad. An integrated...
5361490 Method for making tape automated bonding (TAB) semiconductor device  
Deformation of TAB tapes due to temperature changes is prevented by thermo-mechanical leads. In one embodiment of the invention, a semiconductor device (30) includes an electronic component (31)...
5362679 Plastic package with solder grid array  
Solderable connections are formed in a grid array pattern on the surface of a plastic package by modifying conventional lead frame assemblies so that the outer ends of the leads terminate at the...
5361486 System of machining devices  
A system of machining lead frames (7), such as punching, cutting and bending of the leads consists of a number of machining devices (1, 2, 3) placed in series. Transport means (8) are provided for...
5362656 Method of making an electronic assembly having a flexible circuit wrapped around a substrate  
An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top...
5358905 Semiconductor device having die pad locking to substantially reduce package cracking  
A semiconductor device package (10) comprises plastic encapsulation (20) around a die pad (14) and a semiconductor chip (12). The semiconductor chip (12) is electrically interconnected to lead...
5358598 Folded bus bar leadframe and method of making  
A leadframe has a bus bar extending between two lead fingers on the leadframe. The bus bar and lead fingers are etched to reduce the thickness thereof, and the bus bar is folded under the lead...
5358906 Method of making integrated circuit package containing inner leads with knurled surfaces  
A lead on chip package comprising a semiconductor chip having a plurality of bonding pads and a plurality of minute protrusions formed at both side portions of the upper surface thereof, an...
5357674 Method of manufacturing a printed circuit board  
A method of manufacturing a printed circuit board (PCB) for interconnecting integrated circuit devices includes a lead frame sandwiched between two multilayer substrates. Integrated circuit devices...
5352632 Multichip packaged semiconductor device and method for manufacturing the same  
A plurality of semiconductor chips are mounted on a plurality of islands formed on a lead frame. Inner lead portions of the lead frame and electrode pads formed on the semiconductor chips are...
5347709 Method of making lead frame  
A lead frame at least provides a semiconductor-element-mounting portion, plural leads and plural auxiliary leads. The auxiliary leads are arranged to be associated with plural leads, while a tie...
5345670 Method of making a surface-mount power magnetic device  
A magnetic device (10), suitable for attachment to a substrate, includes at least one sheet winding (24) having a pair of spaced-apart terminations (26), each receiving an upwardly rising portion...
5344795 Method for encapsulating an integrated circuit using a removable heatsink support block  
A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the...
5343615 Semiconductor device and a process for making same having improved leads  
A process for producing a semiconductor device having a package with a semiconductor element molded therein, and a plurality of leads, each constituted by an inner lead located inside the package...
5341563 Apparatus for manufacturing optical module  
The optical module manufacturing apparatus according to the present invention includes a pallet 205 on which the optically operating members and the lead frame are set to be kept in a positional...
5339518 Method for making a quad leadframe for a semiconductor device  
A quad leadframe (30) for a semiconductor device is made from multiple dual-in-line leadframes (10). Two dual-in-line leadframes (10) are provided, wherein each leadframe has two opposing siderails...
5340771 Techniques for providing high I/O count connections to semiconductor dies  
Techniques for providing semiconductor packages capable of forming connections to "high I/O" semiconductor dies is described, wherein there are at least two distinct pluralities of conductive...
5338899 Packaging of electronic devices  
An electronic device (10) encased within a moulded package body (11) has a leadframe (12) extending therefrom. In order to protect the leads (16) for the electronic device a guard ring (14) is...
5338705 Pressure differential downset  
The edges of a semiconductor die are moved away from the lead frame leads attached to the die by using a pressure differential across the semiconductor die.
5337216 Multichip semiconductor small outline integrated circuit package structure  
A semiconductor package houses a plurality of single two terminal semiconductor components. The package is a plastic or ceramic small outline integrated circuit package and is adapted for surface...
5336639 Method for securing a semiconductor chip to a leadframe  
A semiconductor chip (26) is attached to a leadframe (20, 30, 40). The leadframe (20, 30, 40) has an opening (24) or a cavity (34, 44) for receiving the semiconductor chip (26). The opening (24) or...
5336272 Method for molding a semiconductor package on a continuous leadframe  
A method and apparatus for sealing a semiconductor wherein an upper seal block of a cope and a lower seal block of a drag are provided with sealants for nipping a portion of a long size lead frame,...
5336650 Method of making tape carrier semiconductor device  
A tape carrier semiconductor device has a resin sealed area not so larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger...
5336564 Miniature keeper bar  
A process for forming a keeper bar upon TAB tape leads for maintaining position of the leads during excise and form operations, integrated circuit placement, and lead bonding, utilizes the steps of...
5333375 Substrate lead strip mounting machine and method  
An apparatus and method for simultaneously mounting lead strip segments onto each side of a rectangular ceramic substrate. Four lead strip mounting assemblies are equally spaced 90 degrees apart...
5334553 Telecommunication equipment protector  
A surge protection device to protect telecommunication equipment coupled to telephone lines is shown having in a first embodiment three cells with each cell having a semiconductor element with a...
5328552 Leadframe processing for molded package arrangements  
A method for processing a leadframe for use with a molded package is disclosed. In particular, the method is suited for arrangements where direct wirebond attachment sites are exposed through the...
5328870 Method for forming plastic molded package with heat sink for integrated circuit devices  
An improved integrated circuit package including a heat sink and an improved method for making the package is disclosed. The package incorporates an improved sealing (or locking) ring located...
5327008 Semiconductor device having universal low-stress die support and method for making the same  
A semiconductor device (10) includes a lead frame (12) having tie bars (16). In one form of the invention, the tie bars are used to support a semiconductor die (20) to alleviate package cracking...
5323532 Method for providing novel hybrid circuit assembly carrier bracket  
An apparatus and method (200) for providing a hybrid circuit assembly carrier bracket are included wherein the bracket is constructed and arranged to provide controlled placement of at least a...
5319847 Method and apparatus for conditioning leads of packaged electronic devices  
A method and apparatus for conditioning the leads of integrated circuit devices having a plurality of sequential stations. The flat device packages have rows of J-shaped leads along the edges....
5314842 Resin-sealed type semiconductor device and method for manufacturing the same  
A resin-sealed type semiconductor device comprises a lead frame having a bed and external leads, a semiconductor element mounted on the bed and having electrodes, a fine metal wire for making an...
5313367 Semiconductor device having a multilayer interconnection structure  
Actualized are fingers through which a semiconductor integrated circuit including high density electrode strings can be easily safely mounted on a circuit substrate in the same manner with the...
5310702 Method of preventing short-circuiting of bonding wires  
A method of preventing the interconnecting fine wires of a bonded semiconductor devices from moving from their preferred loop position after being bonded in an automatic wire bonder includes the...
5307929 Lead arrangement for integrated circuits and method of assembly  
A lead arrangement is provided having a number of leads to be mechanically and electrically connected to a substrate. Retaining means are also provided integral with the lead arrangement to hold...
5307559 Method of providing a capacitor within a semiconductor device package  
A capacitor is disposed within a semiconductor device assembly atop a plastic layer pad, beneath which passes a pair of leads connected to a semiconductor device. The capacitor is connected to the...
5306664 Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device  
A bump electrode of an inexpensive and reliable semiconductor device is provided in which a remaining metal wire portion produced during bump electrode formation is eliminated. The remaining metal...
5304512 Process for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the process  
A chip 12 having an electric circuit and a plurality of leads 8 connected electrically with the chip 12 are molded in a resin-sealed package 46 by a molding material containing a main component of...
5301420 Method for manufacturing a light weight circuit module  
A method for making a light weight circuit module includes steps of providing a substrate, drilling through holes in the substrate and plating the through holes with a metal. The substrate is a...
Matches 401 - 450 out of 1133 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >