Matches 351 - 400 out of 1133 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
5447888 Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pins  
A process wherein the parts of a lead frame that are outside a cavity are directly supported by ejecting pins extending from above and from below when the lead frame is sandwiched between an upper...
5444909 Method of making a drop-in heat sink  
A heat sink incorporated into an electronic package. The package contains an integrated circuit enclosed by a dielectric housing. Coupled to the circuit is a lead frame which has a plurality of...
5445995 Method for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sink  
A mold is disclosed for semiconductor devices intended for surface mounting, being of a type which comprises a metal plate and a body of solidified plastic resin. It consists of two plates which...
5444025 Process for encapsulating a semiconductor package having a heat sink using a jig  
A method of producing a semiconductor device includes the steps of fitting a bottom part of a radiator block within a tapered hole which is provided at a bottom of a recess of a jig and positioning...
5442228 Monolithic shielded integrated circuit  
A monolithic shielded integrated circuit is formed using a leadframe (11) having electrically isolated flag areas (12 and 13). Semiconductor die are attached to the electrically isolated flag areas...
5441918 Method of making integrated circuit die package  
A package for integrated circuit dies is disclosed comprising a ceramic base capable of having an integrated circuit die mounted to a central portion of one surface thereof to provide heat...
5439159 Lead frame retaining apparatus  
A holding device of a frame retainer on a retainer holder used in bonding machines for manufacture of semiconductor devices including a pair retainer guides formed in the retainer holder so that...
5438750 Method of manufacturing a chip card  
A method of manufacturing a chip card comprising a card base in which a cover section is secured, which cover section comprises a circuit support and at least one microcircuit arranged on a lower...
5438021 Method of manufacturing a multiple-chip semiconductor device with different leadframes  
A multiple-chip semiconductor device of the present invention comprises a first and a second leadframes. The same package envelops a power semiconductor chip mounted on a power chip mounting area...
5437095 Method of making plastic encapsulated integrated circuit package  
A method of making an integrated circuit package is disclosed herein along with the package itself, which package is encapsulated by plastic that is caused to flow in a given direction during the...
5437764 Lead frame and manufacturing method therefor  
An inner lead of a lead frame has an outer end portion extending so as to be connected with a side surface of an etching stop layer and with an upper surface of an outer lead. The outer lead is...
5437096 Method for making a multilayer metal leadframe  
A fabrication method and leadframe construction in which the leadframe is formed by selectively removing portions of a multilayer clad strip to expose a selected pattern of a conductive metal to...
5438478 Electronic component carriers and method of producing the same as well as electronic devices  
An electronic component carrier for mounting an electronic component such as a semiconductor element, IC chip or the like comprises a printed wiring substrate having conductor pattern and...
5434105 Process for attaching a lead frame to a heat sink using a glob-top encapsulation  
A method is disclosed for packaging an integrated circuit having a heat spreader for cooling an integrated circuit die and glob-topping to both protect bonding wires and attach the heat spreader to...
5434106 Integrated circuit device and method to prevent cracking during surface mount  
A semiconductor package device is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe having leadfingers is an integrated circuit. The integrated circuit has a...
5432127 Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads  
A method for electrically connecting a lead frame (10) to an integrated circuit (40). Each lead conductor (16) and (18) of the lead frame (10) has the identical geometric area in order to provide...
5428889 Method for manufacturing composite lead frame  
An outer lead of a metal lead frame is connected to an inner lead of a flexible lead-patterned substrate via a Au--Sn alloy layer. The Au--Sn alloy layer contains Au of 10 to 40 weight %. An inner...
5427641 Method of forming a mounting structure on a tape carrier  
A tape carrier for electronic components is provided with enlarged regions along cut out lines defining the boundaries of the electronic component mount area. Provision is made for temporarily...
5427984 Method of making a cooling package for a semiconductor chip  
A cooling package for a semiconductor chip includes, in addition to the chip, leads for the chip provided by a tape automated bonding frame, a cold header attached to the chip, a header frame, a...
5424249 Method of making mold-packaged pressure sensing semiconductor device  
A pressure sensor element (50) is bonded to a die bonding pad (4). The pressure sensor element (50) is thereafter entirely covered with epoxy resin (11) and completely packaged. Following this, the...
5424251 Method of producing semiconductor device having radiation part made of resin containing insulator powders  
A semiconductor device includes a stage having top and bottom surfaces, a semiconductor element which is mounted on the top surface of the stage, a package part which is made of a first resin and...
5422163 Flexible substrate with projections to block resin flow  
A flexible substrate to be used for assemblage of a semiconductor chip having connecting points to be electrically connected to an external side, comprises a base film unit made of a flexible...
5422314 Lead frame and production method for producing semiconductor device using the lead frame  
A lead frame includes a die pad on which a semiconductor chip is mounted, a plurality of leads each having an end which faces the die pad, and tie bars connecting the leads, wherein each of the tie...
5420757 Method of producing a radio frequency transponder with a molded environmentally sealed package  
A method of forming an environmentally sealed transponder type circuit wherein the circuit components are mounted on a lead type substrate frame, the components are encapsulated in a plastic...
5420752 GPT system for encapsulating an integrated circuit package  
The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold...
5418189 Integrated circuit device and method to prevent cracking during surface mount  
A lead over chip packaged device that is less prone to package cracking during surface mounting is disclosed. The lead over chip lead frame overlies the active face of a semiconductor circuit, The...
5413970 Process for manufacturing a semiconductor package having two rows of interdigitated leads  
A process for manufacturing a semiconductor package having two rows of interdigitated leads. The two rows of leads (14, 16) are affixed on and extend from one side of the semiconductor package...
5411920 Lead frame, semiconductor device, and method of manufacturing same  
A lead frame has a die pad with an array of surrounding leads connected at their sides by tie bars and at their ends by coupling bars which are connected through narrow supports to surrounding side...
5410804 Method for manufacturing a single product from integrated circuits received on a lead frame  
Encapsulated integrated circuits (chips) (2, 3, 4, 5, 6) are manufactured by separating the encapsulated integrated circuits arranged on a lead frame (1), subsequently cutting away the...
5408741 Method for forming electronic device  
The exposed portions of the leads of a semiconductor chip package are first bent in a forming process so that the ends of the leads are in proper positions to be attached to and electrically...
5410451 Location and standoff pins for chip on tape  
A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by...
5409865 Process for assembling a TAB grid array package for an integrated circuit  
A TAB Grid Array (TGA) package is a package for an integrated circuit. A TGA package provides an efficient structure and method to connect a semiconductor die encapsulated in the TGA package to an...
5409866 Process for manufacturing a semiconductor device affixed to an upper and a lower leadframe  
A process for manufacturing semiconductor device including a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is...
5409863 Method and apparatus for controlling adhesive spreading when attaching an integrated circuit die  
An apparatus and method for controlling unwanted spread of adhesive used to attach a semiconductor integrated circuit die to an integrated circuit package assembly. A barrier prevents the adhesive...
5410124 Tracking sensor fixture and method for tracking reference locations on a moving semiconductor leadframe strip  
A tracking sensor fixture for mounting an optic sensor and for positioning reference locations on semiconductor leadframe strips with the sight line of the sensor is provided. The tracking sensor...
5406700 Method for producing pin integrated circuit lead frame  
Disclosed is an integrated circuit lead frame which comprises: a die-pad; die-pad suspension leads for supporting the die-pad; a number of inner leads provided around the die-pad so as to be...
5408050 Flat cable and method of making the same  
Disclosed is a flat cable having a plurality of parallel-arranged flexible conductor wires and two pieces of insulating tape applied to the opposite center areas of the parallel arrangement of...
5406699 Method of manufacturing an electronics package  
An electronics package is provided with a substrate on which a patterned circuit is printed, a plurality of conductive leads connected to the patterned circuit along the periphery of the substrate,...
5403785 Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby  
An IC chip package is fabricated from a substrate carrying an IC chip and formed with a conductive pattern of conductors for electrical connection to the IC chip, and a leadframe having a plurality...
5403784 Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment template  
A process for manufacturing a pin grid array package providing a plurality of electrical input and/or output connections using a plurality of stacked, but spaced apart, separate leadframes which...
5396701 Method for packaging an integrated circuit  
The present invention provides a modular electronic component (10) wherein a sequence of leads (26) of a lead frame (12) differs from a sequence of bonding pads (16) on an integrated circuit (14)....
5394675 Tab tape, method of bonding tab tape and tab tape package  
A TAB (tape automated bonding) tape is disclosed which includes one or more openings, each adapted to receive a semiconductor chip, and electrical leads extending into each such opening....
5396032 Method and apparatus for providing electrical access to devices in a multi-chip module  
Multi-chip module (MCM) (10) includes package body (12) having cavity (20) for accepting a plurality of devices and substrates and seal ring (26) to ensure the integrity of the package. Lead frame...
5394608 Laminated semiconductor device and fabricating method thereof  
A fabricating method of a laminated semiconductor device wherein two or more semiconductor chips are stacked as tape carrier packages and the tape carrier packages are mounted on at least one side...
5395800 Method for assembling semiconductor devices with lead frame containing common lead arrangement  
A lead frame for facilitating assembly and interconnection of a plurality of integrated circuit chips comprises a pattern of planar conductors including a surrounding outer connecting strip to...
5394607 Method of providing low cost heat sink  
The invention disclosed herein is a device and method in which a heat sink (22) is attached to support leads (18) of a leadframe (10) via a welding or mechanical joining technique. The method is...
5393705 Molded semiconductor device using intermediate lead pattern on film carrier formed from lattice pattern commonly available for devices and process of fabrication thereof  
A molded semiconductor device comprises a semiconductor chip mounted on an island portion, and external leads coupled with ball pumps on the semiconductor chip by means of a conductive leads...
5389577 Leadframe for integrated circuits  
A lead frame having a paddle for attaching a die thereon. The paddle comprises at least two separate segments for attaching to the die. Each segment can be connected to an input lead, such as a...
5387554 Apparatus and method for thermally coupling a heat sink to a lead frame  
A molded plastic package for an integrated-circuit die includes a lead frame having a central die-attach paddle. One side of the die-attach paddle has an integrated-circuit die fixed thereto. A...
5384286 Process for encapsulating a semiconductor chip, leadframe and heatsink  
A method mold for producing a semiconductor device having a heat-sinking plate and a leadframe. The heat-sinking frame and leadframe are precisely positioned on a lower mold with cooperating...
Matches 351 - 400 out of 1133 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >