Matches 301 - 350 out of 1133 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
5586389 Method for producing multi-board electronic device  
In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a...
5580466 Metal plate processing method, lead frame processing method, lead frame, semiconductor device manufacturing method, and semiconductor device  
An object of the present invention is to, in methods of processing metal plates and lead frames, enable workpieces to be finely processed into a satisfactory configuration with high dimensional...
5577319 Method of encapsulating a crystal oscillator  
A method of encapsulating a crystal oscillator (100). First, a dielectric material is assembled or connected to the bottom side of a lead frame (102). Second, oscillator components including a...
5576246 Personalized area leadframe coining or half etching for reduced mechanical stress at device edge  
A lead on chip (LOC) semiconductor leadframe package provides notched lead-fingers to eliminate mechanical shear-stress at the peripheral edge of a semiconductor chip. Opposite rows of...
5569625 Process for manufacturing a plural stacked leadframe semiconductor device  
A semiconductor process includes a stage, a semiconductor chip which is mounted on the stage, a plurality of electrode members which are wire bonded to the semiconductor chip, where a first gap is...
5567655 Method for forming interior bond pads having zig-zag linear arrangement  
A technique for reducing thermally-induced mechanical stresses on bond pads in semiconductor device assemblies is accomplished by grouping (laying out) the bond pads in two parallel rows,...
5563103 Method for manufacturing thermoplastic resin molded semiconductor  
A semiconductor assembly is sandwiched by two metal molds so that the semiconductor assembly is located within a cavity formed between the metal molds. Thermoplastic resin is injected through an...
5557842 Method of manufacturing a semiconductor leadframe structure  
A semiconductor leadframe structure (11,41) includes a die bond portion (12) and a plurality of leads (13) coupled to the die bond portion (12). The leadframe structure (11) comprises a metal (23)...
5554569 Method and apparatus for improving interfacial adhesion between a polymer and a metal  
A leadframe (11) and a method for improving adhesion of a polymer (17, 19) to the leadframe (11). The leadframe (11) has a flag (14) having a top surface (15) and a bottom surface (18), and leads...
5549716 Process for manufacturing integrated circuits using an automated multi-station apparatus including an adhesive dispenser and apparatus therefor  
A process for manufacturing an electronic component and an apparatus therefor capable of permitting die-bonding, wire-bonding and molding to be successively executed on a through-line. Die-bonding...
5548890 Lead frame processing method  
In a method for forming a lead frame (1) from a metallic plate, a metallic plate (11) is first etched to form outer leads (4) and outer portions (3b) of inner leads of the lead frame (1). Inner...
5546655 Method of applying flex tape protective coating onto a flex product  
A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by...
5541447 Lead frame  
A lead frame for use in producing of a semiconductor integrated circuit comprises a lead frame member, a plurality of leads, a tie bar, a plurality of auxiliary leads, a support-stay portion and a...
5537737 Method for manufacturing an optical module  
The optical module manufacturing apparatus according to the present invention includes a pallet 205 on which the optically operating members and the lead frame are set to be kept in a positional...
5535509 Method of making a lead on chip (LOC) semiconductor device  
A semiconductor device including a lead on chip structure employs two frames. One of the frames includes a die pad and an outer frame portion and the other frame includes a plurality of leads and...
5531860 Structure and method for providing a lead frame with enhanced solder wetting leads  
A lead frame for used in a surface mount package is provided leads which are each notched at the tip of the lead to reduce the exposed area of based metal and to increase the area on which solder...
5532186 Process for manufacturing bumped tab tape  
A manufacturing method for a TAB tape which forms a plurality of bumps on a plurality of sheet-like leads of the TAB tape. First, the leads are fixed to a belt-shaped tape member having a plurality...
5529959 Charge-coupled device image sensor  
A charge-coupled device image sensor has a base of resin having a mount area on an upper surface with a charge-coupled device chip being connected to the mount area, leads mounted on the base and...
5527740 Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities  
A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto...
5527742 Process for coated bonding wires in high lead count packages  
A transfer molded high lead count plastic semiconductor package is described. The packaged IC chip is mounted upon a suitable leadframe and the bonding pads wire bonded to the leadframe fingers. To...
5525547 Method of fabricating a molded semiconductor device having blocking banks between leads  
A molded semiconductor device has a plurality of slender leads formed with a sealing strip connecting them together to prevent the molding material from leaking out between the leads. Specifically,...
5521124 Method of fabricating plastic transfer molded semiconductor silicone bridge rectifiers with radial terminals  
The method includes the steps of (i). preparing a substrate from a fiber glass reinforced plastic board, then processing the substrate with terminal mounting holes and pre-scared grooves, (ii)...
5518957 Method for making a thin profile semiconductor package  
A process for manufacturing a thin profile semiconductor package by means of TAB (tape automated bonding). A barrier metal layer is formed on bonding pads formed on portions of a chip covered with...
5513792 Bonding apparatus  
An outer-lead bonding apparatus according to the present invention comprises: (1) a punching die to stamp out chips from a film carrier tape, (2) a mounter to mount TAB chips on a substrate, ...
5501004 Outer-lead bonding apparatus and method therefor  
An outer lead bonding apparatus and method bonds an outer lead of a tape carrier package to an electrode formed on a display panel. During the observation stage when positional deviations between...
5501003 Method of assembling electronic packages for surface mount applications  
The method is used to assemble an electronic package of the type having a plurality of external conductive output pads for subsequent surface mounting of the electronic package. The method includes...
5496435 Semiconductor lead frame lead stabilization  
The invention is to an apparatus and method for applying a plastic material to a lead frame for stabilizing the leads and retaining them in a common plane.
5492866 Process for correcting warped surface of plastic encapsulated semiconductor device  
A process for correcting the warped surface of a plastic encapsulated semiconductor lead frame device. The semiconductor device is placed on a transporting plate and transported to a heating...
5491110 Metal semiconductor package with an external plastic seal  
An improved metal semiconductor package is described. The semiconductor package includes a lead frame with a top side and a bottom side. A semiconductor is positioned on the top side of the lead...
5483740 Method of making homogeneous thermoplastic semi-conductor chip carrier package  
A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid...
5484097 Fabrication of hybrid semiconductor devices  
Two phase bridge rectifiers are fabricated starting with three lead flames and bonding a first pair of semiconductor chips on mounting pads of a first of the frames and a second pair of...
5482897 Integrated circuit with on-chip ground plane  
An integrated circuit includes a ground plane structure which provides a uniform ground potential throughout the integrated circuit and improves its performance. The ground plane structure is...
5482898 Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding  
An inexpensive packaged integrated circuit with improved heat dissipative capacity and electrical performance. In one embodiment, the packaged integrated circuit includes a semiconductor die, a...
5481899 Pressure differential downset apparatus  
The edges of a semiconductor die are moved away from the lead frame leads attached to the die by using a pressure differential across the semiconductor die.
5481798 Etching method for forming a lead frame  
A lead frame capable of easily connecting an inner lead to an electrode of a semiconductor element by way of a bump of the inner lead, and a method of manufacturing the lead frame capable of...
5480841 Process of multilayer conductor chip packaging  
A process of providing an external wiring and connecting package for a semiconductor chip wherein the chip is a major contributor to the strength of the package. External contacts and wiring are...
5475918 Method of preventing deformation of lead frames  
Based on the fact that those portions of a lead frame which are liable to undergo deformation are the to-be-nonplated portions, the to-be-nonplated portions defined around the to-be-plated portions...
5474957 Process of mounting tape automated bonded semiconductor chip on printed circuit board through bumps  
Conductive leads are connected at inner ends thereof to electrodes of a semiconductor chip through a tape automated bonding process, and bumps are formed on the other ends of the conductive leads...
5474958 Method for making semiconductor device having no die supporting surface  
A wire bondable plastic encapsulated semiconductor device (58) having no die supporting surface can be manufactured. In one embodiment, a semiconductor die (22) and a plurality of conductors (12)...
5471088 Semiconductor package and method for manufacturing the same  
A semiconductor package having lead bars provided with upper and lower surfaces outwardly exposed, thereby enabling a stacked mounting, a memory extension and a reduction in mounting area. The...
5462624 Embedded inter-connect frame  
Method and apparatus for connecting an I/O pad of an integrated circuit die to an electrical lead or contact on a lead frame that uses interposers formed directly on the die attach pad of the lead...
5454905 Method for manufacturing fine pitch lead frame  
A pitch lead frame and a method for manufacturing the same is disclosed herein. A preferred embodiment of a fine pitch lead frame is generally comprised of a plurality of fine pitch leads, a die...
5455394 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Flexible printed polymer lead frame  
A polymer lead frame is made from a flexible substrate with flexible conductive traces. The generally square lead frame has diagonal cutouts partially extending from the corners towards the center,...
5454160 Apparatus and method for stacking integrated circuit devices  
An apparatus and method for stacking integrated circuit devices which combine flip-chip technology and soldering methods with laminated stack frames to provide a vertical stack array with minimal...
5455200 Method for making a lead-on-chip semiconductor device having peripheral bond pads  
A semiconductor device (10) has a lead-on-chip (LOC) configuration. Leads (24) of the device have central portions (36) which are electrically coupled to peripheral bond pads (14) by conductive...
5453913 Tab tape  
A TAB tape having multiple metallic conductors arranged on the surface of a base film with substantially square device holes is formed with designed areas of stress refief formed by one or more...
5452511 Composite lead frame manufacturing method  
A method for constructing a composite lead frame (10) wherein a plurality of lead segments (14) are separately constructed and then attached to a frame member (12). A plurality of the frame members...
5448824 Method for forming a lead during molding of an electronic housing  
A molding apparatus and a molding method are provided which enable leads which project from an electronic housing, such as a housing configured to receive an accelerometer, to be formed during the...
5448825 Method of making electrically and thermally enhanced integrated-circuit package  
An encapsulated electrically and thermally enhanced integrated circuit is disclosed. An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate. A lead frame...
5446959 Method of packaging a power semiconductor device  
A method of packaging a power semiconductor device is disclosed, comprising the steps of preparing a lead frame including a paddle for providing a semiconductor chip on a top surface thereof, tie...
Matches 301 - 350 out of 1133 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >