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7615127 |
Process of producing overhead transmission conductor
A process of producing an overhead transmission conductor. The process comprises: (a) continuously hot rolling a bar of AA 1350 aluminum or a similar aluminum alloy to form a rod; (b) hot-coiling...
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7614141 |
Fabricating substrates having low inductance via arrangements
A low inductance via arrangement for multilayer ceramic (MLC) substrates is provided. With the MLC substrate and via arrangement of the illustrative embodiments, the via-field inductance for a...
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7614135 |
Method for making reservoir-based sensor device
Methods are provided for making a reservoir-based sensor device. The method may include fabricating a first substrate portion which comprises an upper surface, an opposed lower surface, a plurality...
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7612445 |
Circuit apparatus and method of fabricating the apparatus
The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a...
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7610680 |
Methods for creating channels
Methods of creating an internal channel of a fluid-ejection device are provided. One method includes encapsulating a channel core in an element of the fluid-ejection device that corresponds to the...
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7607224 |
Method of monitoring locations in the brain
A multiple-use connection system includes an elongate body having an axial tail-receiving passage and having lengthwise sides, and at least two essentially parallel rows of axially-spaced pin...
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7607221 |
Method of making an electronic device housing
An apparatus and methods are provided for housing an electronic device. In one implementation, a method of housing an electronic device includes positioning an electronic device on a base,...
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7607220 |
Method for establishing electrical connections in a hybrid electro-mechanical transmission
A method for establishing electrical communication between a control module and a motor/generator in a hybrid electromechanical transmission includes providing a preassembled terminal subassembly...
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7603772 |
Methods of fabricating substrates including one or more conductive vias
Substrate precursor structures include a substrate blank having at least one aperture extending substantially through the substrate blank. At least a portion of at least one conductive layer covers...
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7603153 |
Multi-element probe array
A multi-element probe array suitable for sensing or stimulating is disclosed. In one embodiment, the multi-element probe array includes a plurality of microfibers extending longitudinally and...
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7600313 |
Part cartridge for mounter device
A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are...
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7596862 |
Method of making a circuitized substrate
A method of making the circuitized substrate. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially...
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7594318 |
Multilayer circuit board with embedded components and method of manufacture
A multilayer substrate assembly ( 80 ) includes at least one embedded component ( 52 ) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core...
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7594317 |
Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure
A method of manufacturing a wiring substrate including the steps of, obtaining a temporary substrate from a prepreg, and concurrently attaching a metal foil onto at least one surface of the...
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7594105 |
Multilayer print circuit board
This invention effectively prevents potential fluctuation in the power supply terminal of a semiconductor device, that is, noise from flowing out to a main power supply wiring. A multilayer print...
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7587816 |
Method of improving the stability of a circuit board
A printed circuit board includes a mounting hole for receiving a connector pin of either of a first SMC and a second SMC, and a signal line. The signal line is electrically connected to the...
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7585377 |
Critical current density in Nb3Sn superconducting wire
Critical current densities of internal tin wire having values of at least 2000 A/mm 2 at temperature of 4.2 K and in magnetic field of 12 T are achieved by controlling the following parameters in...
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7582955 |
Semiconductor device manufacturing method and manufacturing apparatus
A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is...
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7581304 |
Method of forming a spark plug with multi-layer firing tip
A spark plug having a multilayer firing tip that minimizes the amount of precious metal used and a method of assembling a spark plug with a multilayer firing tip. The firing tip includes a...
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7581303 |
Method of manufacturing a chassis assembly to reduce electromagnetic interference
A method of manufacturing a chassis assembly to reduce electromagnetic interference is disclosed. The method includes forming a chassis having a chassis cover top portion, a chassis cover step...
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7578048 |
Patterns of conductive objects on a substrate coated with inorganic compounds and method of producing thereof
According to embodiments of the present invention, a method for manufacturing a pattern of conductive elements on a substrate is provided. The method includes depositing in a vacuum deposition...
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7575148 |
Multilayer capacitor and method for manufacturing multilayer capacitor
A plurality of anode foils ( 7 ) and a plurality of cathode foils ( 8 ) respectively having connecting portions ( 12 a, 12 b ) are alternately arranged with insulating separators ( 9 ) interposed...
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7574794 |
Method of manufacturing a touch screen
A method for manufacturing a touch screen that deposits a conductive layer or coating directly onto a surface of a sheet or ribbon or roll of thin glass material. The coated thin glass material may...
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7571536 |
Method of making capacitive/resistive devices
A method of making capacitive/resistive devices provides both resistive and capacitive functions. The capacitive/resistive devices may be embedded within a layer of a printed wiring board....
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7571529 |
Method for forming an electronic device in multi-layer structure
A method for forming an organic or partly organic switching device, comprising: depositing layers of conducting, semiconducting and/or insulating layers by solution processing and direct printing;...
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7569835 |
Gating grid and method of manufacture
The present invention relates generally to grids for gating a stream of charged particles and methods for manufacturing the same. In one embodiment, the present invention relates to a...
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7566843 |
Wire inserting method and wire inserting apparatus in wire discharge processing
A wire inserting method comprises a pipe inserting step of inserting one pipe ( 5 ) into all through-holes ( 11 ) under the state where the plurality of through-holes ( 11 ) are arranged on the...
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7565740 |
Method for standardizing coaxial cable jacket diameters
A method of preparing the end of a coaxial cable for insertion within a coaxial cable connector involves stripping the cable jacket from the end of the cable, and reducing the outer diameter of the...
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7562444 |
Method for manufacturing a CPU cooling assembly
A CPU cooling assembly includes a copper cold plate in which a pattern of ultra thin fins and channels are formed, and a copper manifold-cover in which a series of alternating inlet and outlet...
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7559139 |
Method for manufacturing a probe unit
A method for manufacturing a probe unit includes: (a) preparing a substrate; (b) forming a hollow part in the substrate; (c) forming a sacrificial layer that buries the hollow part on the...
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7559137 |
Method for providing electrically conductive paths in polymer tubing
A method for forming electrically conductive patterns to provide an electrically conductive path on a polymer tube is provided. The method includes the steps of establishing a polymer tube and...
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7559131 |
Method of making a radio frequency identification (RFID) tag
Methods of making a radio frequency identification (RFID) tag. A flexible strap is provided by disposing a plurality of RFID chips on a first web of flexible material and removing the flexible...
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7555829 |
Method for adjusting an output parameter of a circuit
Electro-thermal trimming of thermally-trimmable resistors is used to trim one or more of the plurality of resistors in or associated with an analog electric circuit. The TCR of each of a subset of...
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7552530 |
Method of manufacturing a PCB having improved cooling
An improved cooling of an electronic component loaded to a printed circuit board, wherein the PCB comprises at its upper side at least one electronic component, and at least one heat conducting...
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7552528 |
Wafer expanding device, component feeder, and expanding method for wafer sheet
In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second...
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7552525 |
Method for the production of a circuit board element
A circuit board element ( 11 ) and production thereof are disclosed, whereby a noble metal ( 16 ) is applied to a structured conductor layer ( 13 ) on a circuit board substrate ( 12 ), comprising...
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7549222 |
Method of producing wiring board
A wiring base board and a method of producing thereof relate to a wiring base board of a multilayer structure, and make it possible to perform various kinds of transmission modes such as...
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7549221 |
Mounting method of electronic components
Methods of mounting electronic components on a plurality of printed circuit boards simultaneously are provided. An exemplary method may include supplying a first printed circuit board to a first...
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7546677 |
Method for fabricating a micro-electromechanical system switch
A method includes forming a signal line on the substrate so as to have a predetermined opening portion; at least one supporting frame each formed on the substrate at both sides of the signal line;...
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7546671 |
Method of forming an inlay substrate having an antenna wire
Forming an inlay comprising an antenna wire having two end portions and a site for a transponder chip, comprises: mounting the wire to a surface of substrate; and leaving the end portions of the...
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7546670 |
Method for producing thermally matched probe assembly
A method to fabricate a high density, minimal pitch, thermally matched contactor assembly to maintain electrical contact with contact regions on fully processed semiconductors, preferably while...
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7544275 |
Device and method for connecting inert anodes for the production of aluminum by fused-salt electrolysis
This invention relates to an anode assembly ( 1 ) to be used in a fused bath electrolysis aluminium production cell. This assembly comprises one inert anode ( 2 ) in the shape of a ladle, one...
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7543376 |
Manufacturing method of flexible printed wiring board
Provided is an FPC, which comprises an insulating layer 2 , wiring layers 3 and 4 laminated above and under the insulating layer 2 , and a layer connection for connecting the wiring layers 3...
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7543374 |
Method of manufacturing wiring substrate
In a method of manufacturing a wiring substrate according to the present invention, a metal foil is tentatively fixed onto a temporary substrate, which is made of a nonwoven fabric impregnated with...
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7543372 |
Method of electrically connecting conductive railroad attachment
Disclosed is a method for forming electrical interconnections between railroad track components and signal conductors/lines. In one arrangement, an electrically conductive adhesive is utilized to...
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7540081 |
Thermally conductive interface
A thermally conductive material is provided as a mixture of a silicone, a ceramic powder, and a curing catalyst. The material may be pre-formed into a pad and each side of the film protected with...
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7540078 |
Method for recycling wastes of an electrical appliance
A recycling method of wastes of an electrical appliance containing an article having a circuit soldered with parts soldered with a lead free solder. The method includes discriminating a first...
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7537668 |
Method of fabricating high density printed circuit board
A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a...
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7533462 |
Method of constructing a membrane probe
A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the...
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7533461 |
Method for interconnecting electrical conduits in a borehole
A method for interconnecting electrical conduits in an underground borehole by means of a self cleaning downhole electrical connector with a static and a moveable connector part, including...
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