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7428777 |
Method of making a heatsink device
A method and device for thermal conduction is provided. Methods of forming heatsinks are provided that include advantages such as the ability to produce intricate detailed features that other...
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7426779 |
Method of fabricating wire member
A wire member adapted to be used in a detection coil of an NMR spectrometer's probe. The wire member has a sleeve made of a copper tube having a high electrical conductivity, strands made of...
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7424772 |
Stacked bulk acoustic resonator band-pass filter with controllable pass bandwidth
The band-pass filter has a stacked pair of film bulk acoustic resonators (FBARs) and an acoustic decoupler between the FBARs. Each of the FBARs has opposed planar electrodes and a layer of...
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7418780 |
Method for forming stacked via-holes in a multilayer printed circuit board
An exemplary method for forming stacked via-holes in a multilayer printed circuit board includes the steps of: providing a base circuit board; attaching a first copper-coated-substrate having a...
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7415762 |
Interposer, method of fabricating the same, and semiconductor device using the same
An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor and an interposer portion provided around...
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7409762 |
Method for fabricating an interconnect for semiconductor components
A method for fabricating an interconnect for testing a semiconductor component includes the steps of providing a substrate, and forming interconnect contacts on the substrate configured to...
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7405656 |
Device and method for encapsulation and mounting of RFID devices
This invention involves encapsulating an RFID device in an encapsulating material by known encapsulating processes to form a domed, encapsulated RFID tag. The encapsulating material may be...
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7402254 |
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed...
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7401402 |
Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor
The invention relates to a method for high-frequency tuning a high-frequency plug connector, comprising a printed circuit board that has both contact points for high-frequency contacts as well as...
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7398588 |
SOI component comprising margins for separation
A method for producing a component is provided, in particular a deformation sensor, having a sensor element which includes at least one region that is sensitive with respect to expansion or...
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7395598 |
Face plate securement method
A method for installing an electrical fixture such as a power switch or power receptacle. The method may include the steps of selecting an assembly comprising an a face plate, an electrical...
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7392584 |
Methods and apparatus for a flexible circuit interposer
Methods and apparatus for testing a semiconductor device are disclosed. A flexible circuit interposer includes a flexible circuit substrate which allows in-situ probing of an attached device...
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7389581 |
Method of forming compliant contact structures
A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein....
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7386937 |
Method of making a biosensor
A method of making a biosensor is provided. The method includes providing an electrically conductive material on a base and partially removing the conductive material using laser ablation from the...
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7386934 |
Double layer patterning and technique for milling patterns for a servo recording head
Double photolithography is used to produce an under-layer of protective and filtering photoresist over a substrate that will have channels milled with a FIB. Secondary layers are applied with...
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7378345 |
Metal electroplating process of an electrically connecting pad structure of circuit board and structure thereof
A metal electroplating process of an electrically connecting pad structure of a circuit board and structure thereof are proposed. First, a circuit board with a patterned circuit layer formed on at...
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7377034 |
Method for flexible circuits
A flexible printed circuit improves data transfer rates by disposing ground wires in a ground plane proximate to signal wires disposed in a signal channel plane. One or more ground wires is...
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7377030 |
Wiring board manufacturing method
The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is...
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7375278 |
Mounting components to a hardware casing
Methods, systems, and media to mount one or more components to a hardware casing are disclosed. Embodiments include hardware and/or software for determining a pattern of interconnects to apply to...
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7373717 |
Method of manufacturing a self-sustaining center-anchor microelectromechanical switch
Provided is a manufacturing method of self-sustaining center-anchor microelectromechanical switch driven by an electrostatic force used for controlling a signal transmission in an electronic...
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7371975 |
Electronic packages and components thereof formed by substrate-imprinting
A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on...
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7370409 |
Method and apparatus for transferring wires that have been cut into lengths from a wire bundle into a single layer
A method and an apparatus for extricating and transferring wires cut into lengths from a loose, random wire bundle (B) into a single layer (L) of parallel wires, in which first the loose, random...
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7368021 |
Critical current density in Nb3Sn superconducting wire
Critical current densities of internal tin wire to the range of 3000 A/mm 2 at temperature of 4.2 K and in magnetic field 12 T are achieved by controlling the following parameters in a distributed...
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7367118 |
Method for forming metal wires by microdispensing pattern
A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the...
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7360308 |
Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers
A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central...
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7360293 |
Method of manufacturing recognition sensor
A method of manufacturing a surface shape recognition sensor. A sacrificial film is formed on an interlevel dielectric to cover a lower electrode while keeping an upper portion of a support...
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7356913 |
Process for manufacturing a microsystem
A process for making microswitches or microvalves, composed of a substrate and used for shifting between a first state of functioning and a second state of functioning by means of a bimetal-effect...
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7354486 |
Process for producing Ge-added Nb3Al base superconducting wire material
A composite multi-core wire rod in which a plurality of Al alloy wires containing 15 at % to 40 at % of Ge are arranged in Nb matrix at a core diameter of 2 μm to 20 μm is subjected to heating...
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7353602 |
Installation of spliced electrical transmission cables
A method of installing an electrical transmission cable includes providing an electrical transmission cable extending from a first end to a second end. The cable includes a flexible, full tension...
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7350297 |
Method of manufacturing a wiring substrate
A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first...
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7350294 |
Method of electroplating a plurality of conductive fingers
A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair...
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7350291 |
Method for manufacturing a cable by stringing an element through a sheath
A method for stringing a conductive element through a hollow sheath to assemble an electrical cable is provided by injecting compressed gas into the sheath to propel the conductive element...
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7350285 |
Method of manufacturing a switch panel to be disposed close to a magnetic sensor
A method of manufacturing a movable contact unit includes manufacturing a movable contact, sticking the movable contact to a base sheet made of insulating resin, and applying demagnetization to the...
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7346981 |
Method for fabricating microelectromechanical system (MEMS) devices
A process for fabricating a MEMS device comprises the steps of depositing and patterning on one side of a wafer a layer of material having a preselected electrical resistivity; bonding a substrate...
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7346974 |
Method for producing a conductor bar of transposed stranded conductors
A method for producing a conductor bar including transposed stranded conductors for a large, rotating electric machine. The method includes a first step of cabling a plurality of electrically...
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7343674 |
Method of making circuitized substrate assembly
A method of making a circuitized substrate assembly wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, and a cover is...
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7343673 |
Electromagnetic interference shielding filter manufacturing method thereof
An electromagnetic interference (EMI) shielding filter includes a conductive pattern for shielding electromagnetic waves; and blackened layers formed on a surface of the conductive pattern. The...
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7342498 |
Radio frequency identification (RFID) tag and manufacturing method thereof
An RFID tag includes a dielectric member, an antenna pattern formed on and around a surface of the dielectric member, and an IC chip that is electrically connected to the antenna pattern by means...
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7340819 |
Field weldable connections
The present invention provides a field weldable connection. In one embodiment, the field weldable connection is a downhole connector assembly for sealingly attaching a first and a second segment of...
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7340818 |
Method of improving the contact between bipolar plates and membrane electrode assembly of a flat panel fuel cell
A flat panel DMFC (direct methanol fuel cell) includes a first electrode plate, a set of membrane assemblies, at least a bonding sheet, a second electrode, and fuel container base. Because of the...
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7337535 |
Hole plugging method for printed circuit boards, and hole plugging device
A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via...
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7337532 |
Method of manufacturing micro-electromechanical device having motion-transmitting structure
A method of manufacturing a micro-electromechanical device is provided. The method comprises providing a substrate incorporating drive circuitry, and forming a drive member, a motion-transmitting...
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7337528 |
Textured dielectric patch antenna fabrication method
A textured dielectric patch antenna is fabricated by applying a first mask pattern ( 310, 510, 610, 710, 915, 1015, 1210 ) to a first side of a solid panel made of a first material that is a...
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7337527 |
Method including a heat treatment of manufacturing superconducting wires based on MgB2
A method of manufacturing superconducting wires based on MgB 2 is described and includes the steps of: production of a cylindrical wire comprising an MgB 2 core surrounded by a metal covering, in...
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7334325 |
Apparatus and method for improving coupling across plane discontinuities on circuit boards
The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout,...
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7334324 |
Method of manufacturing multilayer wiring board
A method of manufacturing a, in order to accommodate the words range and to clarify the multilayer wiring board, grooves for forming a wiring circuit and via holes are formed in an insulating...
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7334320 |
Method of making an electronic fuse with improved ESD tolerance
Tolerance to ESD is increased in an electronic fuse by providing at least one non-conductive region adjacent to a conductive region on the surface of an insulator. Such an arrangement reduces the...
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RE40046 |
Processing system
A processing system has an upper electrode with gas discharge holes of a shape corresponding to the external we of insulating members. The insulating members are formed of a poly(ether etherketone)...
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7328502 |
Apparatus for making circuitized substrates in a continuous manner
Apparatus for making circuitized substrates using a continuous roll format in which layers of conductor and dielectric are fed into the apparatus, bonded, and passed on to other nearby work...
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7325301 |
Method of manufacturing a wiring board
A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a...
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