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6983536 |
Method and apparatus for manufacturing known good semiconductor die
A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer;...
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6981315 |
Method of manufacturing a flexure blank
The invention is directed toward a method of manufacturing a flexure blank whereby an opening portion is provided in a in a connecting portion of a flexure blank, an opening end portion of an...
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6981309 |
Method for producing (Nb, Ti)3Sn wire by use of Ti source rods
An improvement is disclosed in the method for producing a multifilament (Nb, Ti) 3 Sn superconducting wire by the steps of preparing a plurality of Nb or Nb alloy rods where Nb or Nb alloy...
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6981320 |
Circuit board and fabricating process thereof
A circuit board and a fabricating process thereof is provided. The present invention employs a core layer as a base layer, wherein the core layer is a core conducting layer, or is a core dielectric...
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6981316 |
Method of manufacturing vehicle electric power distribution system
A method of assembling a power distribution apparatus including a plurality of conductive circuit plates, each conductive plate including a plurality of contact pads that are interconnected by...
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6981314 |
Method of forming a lead
An implantable, substantially isodiametric, low resistance implantable lead having at least one electrode positioned in a stimulation/sensing portion of the lead as well as a method of...
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6978537 |
Method of transferring electric charge using a micrometer-scaled device
A charged species source and a charged species drain are provided. A moveable component is positioned proximate to the charged species source and the charged species drain. A first protrusion and a...
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6978540 |
Method for pre-applied thermoplastic reinforcement of electronic components
A method for utilizing one or more pre-formed underfill compositions in the application of surface mount components, most commonly chip scale packages (CSP's), to substrates for use in electronic...
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6977031 |
Anode assembly
An anode assembly for conducting electrical energy to an electrolytic smelting cell including an anode of high electrically conductive material connected to a yoke, the ends of the yoke being...
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6976306 |
Modular method for manufacturing circuit board
The present invention discloses a modular method for manufacturing circuit boards, which is a method of manufacturing multilayer printed circuit boards with blind and buried vias structure by using...
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6973709 |
Method of manufacturing printed-on-display antenna for wireless device
A method of manufacturing a printed-on-display (POD) antenna for a wireless device is provided. First, a conductive transparent layer comprising indium oxide doped with tin oxide (ITO) is coated on...
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6973717 |
Method for producing a semiconductor device in chip format
A semiconductor device in chip format having a chip which has at least one first insulating layer and electrical connection pads free of the insulating layer is described. On the first insulating...
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6971167 |
Multilayered circuit board forming method and multilayered circuit board
A multilayered circuit board and a method of forming the multilayered circuit board are provided. In a first circuit forming process, a first circuit is formed on an insulating board with a...
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6971164 |
Optical device
An optical device is provided which includes a plurality of optical modules. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference...
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6966909 |
Surgical instrument
An electrosurgical instrument for use in cutting and/or coagulating tissue includes one or more electrode surfaces ( 15 and 16 ) at least partly coated with tungsten disulphide. The tungsten...
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6964095 |
Method for producing a crimp ear
A method of manufacturing an electrical contact with a crimp ear from a flat ribbon of conductive material including applying a force to the ribbon to form an adjacent pair of approximately...
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6961993 |
Method of transferring and mounting elements
A device mounting method capable of efficiently, accurately arraying micro-devices on a circuit board is provided. The method includes a device separating step of separating a plurality of LED...
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6959481 |
Apertured probes for localized measurements of a material's complex permittivity and fabrication method
A probe for non-destructive determination of complex permittivity of a material and for near field optical microscopy is based on a balanced multi-conductor transmission line structure created on a...
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6959488 |
Method for retaining a first part against a second part
A system and method are disclosed which utilize a retaining mechanism to retain a first part against a second part in a manner that supplements or supplants use of adhesive. A retaining mechanism...
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6954984 |
Land grid array structure
A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of...
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6954983 |
Method for producing flat cables
A method for continuously producing flat cables with electric conductors embedded in an isolating material which are arranged at a certain distance from each other, parallel to each other....
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6952871 |
Method for manufacturing printed circuit boards
It consists of making a first engraving over a first face of a panel of electro-conducting material to form some reliefs and depressions corresponding to future tracks and intermediate tracks;...
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6952870 |
Integrated circuit wiring method
Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the...
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6948240 |
Method for shaping an object
A method for shaping an object. The method includes the steps of preparing an attachment material having a glass transition temperature lower than that of the object, fixing the attachment material...
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6948238 |
Method for dissociating metals from metal compounds
In the forming of copper interconnects for an integrated circuit, a method for dissociating copper oxides from copper surfaces is provided. An antireflective coating layer is formed over an...
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6948242 |
Process for producing a contact-making device
A process for producing a contact-making device is provided for making electrical contact between components, which includes the step of producing an electrical zero-insertion-force connector which...
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6944945 |
Sequential build circuit board
A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal and...
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6946604 |
Template for preparing a wire harness
A template for preparing a wiring harness allows for quick and accurate preparation of the harness for subsequent installation within a vehicle. The template has a base member with one or more...
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6938331 |
Method for fabricating a filament affixed trace within an electronic device
A method for fabricating a filament-affixed trace within an electronic device, such as a circuit board or microelectronic device. Conductive traces are affixed to the surface of a composite...
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6938338 |
Method of making an electronic contact
Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the...
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6935020 |
Method of producing a battery-connecting plate
A method of producing a battery-connecting plate by providing busbars which connect batteries together, attaching terminals to one end of wires to produce terminal-attached wires for detecting...
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6935018 |
Copper plated invar with acid preclean
A method for forming a copper-Invar-copper (CIC) laminate having an intermetallic layer of negligible thickness, and a structure associated with the CIC laminate. Starting with a block of Invar,...
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6935019 |
Method of mounting electronic components and apparatus therefor
For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3 a, 3 b, 3 c, 3 d, 3 e and 3 f are kept in holes 5 ...
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6931712 |
Method of forming a dielectric substrate having a multiturn inductor
A dielectric substrate having an embedded inductor wherein each turn of the inductor traverses several layers such that the top and bottom of each turn of the inductor are parallel to each other...
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6931721 |
Method for improving EMC of keyboard soft board
A method for improving the EMI compatibility of the keyboard soft board is disclosed. A low-pass filter is installed on the scan lines of the keyboard soft board to remove high-frequency noise...
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6928726 |
Circuit board with embedded components and method of manufacture
A substrate assembly ( 10 ) and method of making same has at least one embedded component ( 25 ) in a via ( 24 ) of a substrate core ( 22 ) and includes a first adhesive layer ( 20 ) coupled to the...
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6928727 |
Apparatus and method for making electrical connectors
A method and apparatus for manufacturing an electrical connection unit and connector array is provided. Such arrays may be used to solder together traces from opposed circuit boards, in which the...
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6922889 |
Shifting device for manufacturing continuous terminals
A shifting device for shifting two rows of continuous terminals includes a body and a shaft. The body is formed with a hole and an inlet and an outlet both communicating with the hole. A direction...
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6918696 |
Temperature sensor and method for manufacturing the same
A temperature sensor includes a casing having a first part and a second part, a temperature detector for detecting temperature of fluid and a pair of outside wires connecting to the temperature...
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6915567 |
Method of wiring for motorcycles
An housing of a meter unit is inserted from above into a meter unit support hole which is provided in the rear handle cover. Engagement claws of the housing are engaged with claw receiving portions...
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6915564 |
Method and apparatus for manufacturing coaxial cable with composite inner conductor
A method of making a coaxial cable includes forming a conductive tube and setting a settable material therein to define an inner conductor. Forming may include advancing a conductive strip and...
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6915566 |
Method of fabricating flexible circuits for integrated circuit interconnections
A method for the fabrication of a double-sided electrical interconnection flexible circuit ( 200 ) particularly useful as a substrate for an area array integrated circuit package. A copper matrix...
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6915563 |
Apparatus for removing attached die
An apparatus for removing attached die having a pivoting means, having a pivot point and first and second sides, the pivot point having a corresponding first y coordinate, the first and second...
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6910264 |
Method for making a multilayer circuit board having embedded passive components
A method for fabricating a core circuit board having passive components, such as resistors, capacitors and inductors, is disclosed, which can be used to construct a multilayer circuit board having...
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6907658 |
Manufacturing methods for an electronic assembly with vertically connected capacitors
An electronic assembly includes one or more discrete capacitors ( 506, 804, 1204 ), which are vertically connected to a housing, such as an integrated circuit package ( 1704 ). Surface mounted...
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6904666 |
Method of manufacturing microwave filter components and microwave filter components formed thereby
A simplified method for forming passive microwave components, such as a filter, and passive microwave components formed by the method. The method includes forming a ceramic insert having a...
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6904674 |
Process for manufacturing a printed wiring board
A printed wiring board, particularly, an interposer 20 for a chip scale package, comprising an outer insulator layer 22 having outer electrodes 31, a conductor layer 21, and an inner...
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6901658 |
Electric-component supplying apparatus and circuit-board assembling method for feeding a plurality of electric-component tapes
An apparatus for feeding a plurality of electric-component tapes each of which includes a carrier tape and holds a plurality of electric components in a lengthwise direction of the carrier tape,...
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6898851 |
Electronic device manufacturing method
It is an object to provide a semiconductor device having a buried multilayer wiring structure in which generation of a resolution defect of a resist pattern is suppressed and generation of a...
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6898839 |
Multi-layered brush of rotary electric machine and method of manufacturing the same
A brush of a rotary electric machine includes a brush element and a pigtail. The brush element includes a high-conduction member extending in the longitudinal direction and a low-conduction member...
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