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7040013 |
System and method for printed circuit board net routing
A method, system, and product for routing nets along a printed circuit board through an obstacle field and a circuit board having traces produced in accordance with the routed nets is disclosed....
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7040012 |
Method of electrically and mechanically connecting electronic devices to one another
A method is provided for electrically and mechanically connecting a first electronic device to a second electronic device. At least one electric contact of the first device is located against an...
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7036215 |
Method and program for obtaining positioning errors of printed-wiring board, and electronic-circuit-component mounting system
An electronic-circuit-component mounting system including at least two component mounting units concurrently operated to mount electronic circuit components on a printed-wiring board, wherein a...
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7036219 |
Method for manufacturing a high-efficiency thermal conductive base board
A method for manufacturing a high-efficiency thermal conductive base board for electrical connection with an electronic component includes the steps of: (a) placing a metal substrate in an...
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7036214 |
Manufacturing method of rigid-flexible printed circuit board and structure thereof
In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are...
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7032301 |
Dry physiological recording electrode
The present invention relates to a dry physiological recording electrode that can be used without skin preparation or the use of electrolytic gels. The dry physiological recording electrode...
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7032290 |
Manufacturing method for brush holder
A brush holder incorporates a terminal integral part, which has a coupling portion. The coupling portion couples the terminals with each other. The brush holder has a resin body and a plurality of...
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7032300 |
Wire insulation displacement connection apparatus with pitch conversion mechanism
Wire insulation displacement connection apparatus including a wire supply portion, a first press-contacting portion arranged downstream from the wire supply portion, and a second press-contacting...
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7032307 |
Method for fabricating a probe pin for testing electrical characteristics of an apparatus
A probe pin for testing electric characteristics of a semiconductor device comprises a silicon pin core ( 3, 23, 33 ), and a conductive film ( 4, 24, 34 ) covering the entire surface, including the...
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7032309 |
Method for reinforcing the connection of flat cable member and method for manufacturing image display unit
The present invention discloses a method for reinforcing the connection between a wire formed on a substrate and a flat cable member with a reinforcing material. The method includes the step of...
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7035591 |
Ceramic microelectromechanical structure
A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing...
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7028397 |
Method of attaching a semiconductor chip to a chip mounting substrate
A semiconductor chip, substrate employing plural bonding steps to ensure complete bonding particularly of peripheral edges. Embodiments include placing an adhesive layer on a chip mounting...
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7028400 |
Integrated circuit substrate having laser-exposed terminals
An integrated circuit substrate having laser-exposed terminals provides a high-density and low cost mounting and interconnect structure for integrated circuits. The laser-exposed terminals can...
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7025862 |
Plating uniformity control by contact ring shaping
An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The...
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7024763 |
Methods for making plated through holes usable as interconnection wire or probe attachments
Methods are provided for making plated through holes usable for inserting and attaching connector probes. In a first method, a curved plated through hole is formed by bonding curved etchable wires...
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7020960 |
Systems and methods for fabricating printed circuit boards
Systems and methods for plating printed circuit boards. Traces are formed using internal and external layers of a printed circuit board from conductive paths including contact pads to a side edge...
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7020957 |
Methods and apparatus for high performance electrical connections
Coax and twinax connector assemblies, suitable for low-cost manufacturing and high-frequency performance, include one or more slices of insulating material having a series of through-holes therein....
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7017261 |
Component suction device, component mounting apparatus and component mounting method
A component suction device includes a suction nozzle for sucking and holding a component, a nozzle turning device for holding the suction nozzle and turning the suction nozzle, and a nozzle...
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7018136 |
Method installing a duct, device for carrying out said method, and a tape-shape element for use with said method
Method for installing a duct where an existing longitudinal member is present along a section over which the duct is to be installed. The longitudinal member is utilized as a guide for the duct....
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7017263 |
Electronic component mounting method
The invention provides an electronic component mounting method which improves a work efficiency and enables pickup of electronic components without fail. A component feeding unit mounted with a...
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7017260 |
Method of making an elastomeric conductive sheet
Devices and methods of stressing anisotropic conductive elastomer (ACE) sheet material that defines a plurality of electrical pathways through its thickness. The perimeter of the sheet is...
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7017265 |
Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured thereby
A method is provided for manufacturing a multilayer wiring board wherein good adhesion is achieved between an insulating layer and a wiring pattern. The multilayer wiring board has a laminar...
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7013560 |
Process for fabricating a substrate
A substrate comprises at least a semi-finished substrate, a circuit line, a contact and a solder mask layer. The circuit line and the contact are formed on the semi-finished substrate. The circuit...
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7013562 |
Method of using micro-contact imprinted features for formation of electrical interconnects for substrates
An imprinting stamp to imprint an opening in a material layer in which the imprint stamp has a coating of a seed material. The seed material is transferred onto the surface within the opening to...
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7012117 |
Water-dispersible resin composition for use in boring hole in printed wiring board, sheet comprising the composition, and method for boring hole in printed wiring board using the sheet
The present invention provides a water-dispersant resin composition for perforating a printed wiring board excellent in preciseness of the processing position and plating throwing power when...
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7010855 |
Optical module
An optical module for use in an optical device is provided. The module includes an optical component and relative reference mount. The optical component is fixed spacially relative to a...
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7010856 |
Lead wire attachment method, electrode, and spot welder
A copper plate 2 is mounted on a titanium electrode element 1 by spot welding, and a lead wire 3 a is attached to the copper plate 2 by solder 4.
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7007378 |
Process for manufacturing a printed wiring board
A process for manufacturing a land grid array connector for a printed wiring board is disclosed. The process does not require electroplating precious metal overlays. Therefore, no commoning bar is...
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7007379 |
Production method of printed circuit board
The present invention provides a production method of a printed circuit board having a circuit pattern with a little variation in the thickness at a low cost without a special step for removal of a...
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7007380 |
TFI probe I/O wrap test method
A method for testing external connections to semiconductor devices. The method includes providing an external electrical path between selected external connections on the semiconductor devices.
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7003873 |
Method of making conformal fluid data sensor
A method of making a gaseous fluid data sensor assembly for acquiring data regarding the ambient environment adjacent a surface of an airframe with adjacent air speeds below 40 knots (or another...
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7003876 |
Method of constructing an in the ear auxiliary microphone for behind the ear hearing prosthetic
An In The Ear (ITE) microphone improves the acoustic response of a Behind The Ear (BTE) Implantable Cochlear Stimulation (ICS) system during telephone use. An acoustic seal provided by holding a...
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7003871 |
Solder paste stencil manufacturing system
A method and apparatus for manufacturing or assembling a plurality of printed circuit boards to reduce rework at a printed circuit board assembly facility, which may include the following: cutting...
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7003868 |
Coated stainless-steel/copper weld for electroplating cathode
A copper welding rod is used in an arc-welding operation to form a bead that joins a copper starter sheet and a stainless steel hanger bar. The amperage level of the arc-welding equipment is set to...
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7000302 |
Process for preparing a radio frequency cable for coupling
Radio frequency cables have a inner circular conductor and an outer circular conductor. The inner and outer circular conductors are usually formed from copper and are separated by a heavy...
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6996901 |
Production method of wired circuit board
A production method of a wired circuit board can prevent corrosion of a first thin metal film inwardly of a conductor layer, due to the forming of an undercut portion caused by a skirt portion of a...
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6996900 |
Production method for micro-strip filter
A production method for a band-pass micro-strip filter which need not conduct an adjusting process on the central frequency in a pass band based on the frequency characteristics of a filter that...
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6996897 |
Method of making a mount for electronic devices
method for making a mount for at least two electronic devices forming a first mounting surface ( 210 ) from a material ( 240 ), and forming a second mounting surface ( 220 ) from the material ( 240...
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6996899 |
Electronic assembly and a method of constructing an electronic assembly
Solder bumps are created on a substrate of an electronic assembly having lengths that are longer than the widths. The solder bumps are created by locating solder balls of power or ground...
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6993835 |
Method for electrical interconnection of angularly disposed conductive patterns
A method for electrical interconnection of angularly disposed and abutted conductive patterns is disclosed along with a device created from the method. Conventional wire bonding equipment is used...
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6993829 |
Method for producing centralized distribution unit of thin brushless motor for vehicle
In a method of producing a centralized distribution unit of a thin brushless motor for a vehicle having superior waterproof-ness and airtight-ness functions, and high dielectric strength, an...
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6993823 |
Method of manufacturing oxide superconducting wire
The inventive method of manufacturing an oxide superconducting wire comprises a step (S 1 , S 2 ) of preparing a wire formed by covering raw material powder of an oxide superconductor with a metal...
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6993836 |
Circuit board and method of manufacturing same
A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either...
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6990734 |
Methods for shielding one or more circuit of a printed circuit board
Methods for forming a metal shield on a printed circuit board ( 10 ) include depositing a first layer of metal ( 41 ) on a substrate ( 22 ) of the printed circuit board ( 10 ), depositing a first...
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6990732 |
Method of manufacturing a micrometer-scaled electronic-charge-transferring device
A method of manufacturing an electronic-charge-transferring device includes providing a charged species source and a charge species drain and providing a movable component for transferring charge...
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6988311 |
Method of grounding a jacketed metal tube using a clip welded to the jacket
A method of grounding a tube to a chassis wherein a plastic clip made conductive by the incorporation of conductive particles therein, is clamped onto the jacket of metal automotive vehicle tubing...
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6988310 |
Method of assembling an interconnect device assembly
A method of assembling an interconnect device assembly which consists of cylindrical resilient wire bundles captured within a carrier. In a step of the method, the interconnect device assembly is...
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6986199 |
Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials
A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to...
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6986197 |
Method of manufacturing an IC package
A method is provided for processing leadframe items of two or more types to form integrated circuit packages. The leadframe items are delivered along respective input paths and are received into...
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6983534 |
Method for partially exposing conductive strips of flat laminated cable
The invention relates to a continuous process and an apparatus for partially exposing conductor tracks in fully insulated laminated cables according to specifiable parameters selectable in...
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