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7100276 |
Method for fabricating wiring board provided with passive element
A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one...
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7100275 |
Method of producing a multi-layered wiring board
Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and...
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7102082 |
Electromagnetic interference shielding of electrical cables and connectors
A shielded cable includes a cable body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or...
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7100277 |
Methods of forming printed circuit boards having embedded thick film capacitors
A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from...
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7103398 |
Electrical sensing and/or signal application device
The electrical signal sensing and/or signal application device for sensing electrical signals on a surface and/or for applying electrical signals to a surface, particularly of human or animal skin...
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7102524 |
Die frame apparatus and method of transferring dies therewith
A method, system, and apparatus for a die frame, and for transferring integrated circuit dies therewith, is described. A ring shaped groove is formed in a first surface of a wafer around a...
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7100270 |
Method of fabricating a thin film integrated circuit with thick film resistors
A method of fabricating printed circuit boards integrating thick film resistor components and thin film circuit portions thereon is disclosed. This is a two-phase process, where the first phase is...
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7096579 |
Method of manufacturing an optical device
The invention provides an optical device having an optical element, a substrate, and a flexible member. A first portion of the flexible member is disposed so as to be spaced from the substrate, a...
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7096580 |
I/C package/thermal-solution retention mechanism with spring effect
A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a...
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7096555 |
Closed loop backdrilling system
A multilayer circuit board is provided with at least one signal layer, at least one feedback layer, and at least one dielectric layer positioned between the signal layer and the feedback layer. The...
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7093355 |
Method and device for producing flat metal ribbon cables
A round wire is cold formed in a first pair of forming rolls to produce a flat metal ribbon cable having a specified width, followed by cold forming the flat metal ribbon cable in a second pair of...
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7093351 |
System, for matching harnesses of conductors with apertures in connectors
A system for assembling wire harnesses with their connectors utilizes a compact computer-based system that is linked to an engineering data base. The data base contains component information, such...
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7089647 |
Increasing the copper to superconductor ratio of a superconductor wire by cladding with copper-based strip
A method for increasing the copper to superconductor ratio of a superconductor core wire by forming a copper-based strip about the core wire which at least partially encloses the core wire in...
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7089659 |
Method of producing ceramic laminates
A method of producing ceramic laminates includes forming a ceramic green sheet by applying a ceramic slurry on a carrier film; forming, maintaining a predetermined gap, a plurality of electrically...
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7089660 |
Method of fabricating a circuit board
A circuit board with an asymmetrical structure and a method for fabricating the same are proposed. A core circuit board is provided, with a build-up structure being formed on a side of the core...
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7086146 |
Method of manufacturing a shielding base member
The method of forming a radiation shielding structure includes a first adhesive layer, a resin layer, and a metal foil laminated sequentially on a release layer of a plastic film. A metal layer...
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7082683 |
Method for attaching rod-shaped nano structure to probe holder
The present invention relates to a method for manufacturing a probe for detecting surface signals or chemical signals through a long and slender rod-shaped nano structure such as tungsten nanowire,...
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7082679 |
Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof
Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the...
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7080445 |
Method for connecting printed circuit boards and connected printed circuit boards
A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating...
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7080446 |
Wiring board sheet and its manufacturing method, multilayer board and its manufacturing method
A wiring board sheet which enables the miniaturization of a wiring board by mounting electric components ( 10 ) in an insulation layer ( 4 ) to increase the quantity of mounting electric...
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7076868 |
Wiring circuit board having bumps and method of producing same
A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps...
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7077662 |
Contact woven connectors
A contact connector is provided that has at least one loading fiber and a plurality of conductors. Each conductor may have at least one contact point. Each conductor may contact a single loading...
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7076871 |
Method of manufacturing a carbon nanotube device
A method of manufacturing a carbon nanotube device including an inner electrode, having connecting step, connecting a carbon nanotube to the inner electrode, wherein the connecting step comprises:...
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7074498 |
Influence of surface geometry on metal properties
The influence of surface geometry on metal properties is studied within the limit of the quantum theory of free electrons. It is shown that a metal surface can be modified with patterned indents to...
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7075772 |
Electrostatic gripping device
An electrostatic gripper for moving wafers includes bipolar electrodes with an insulating layer of zirconium oxide, which are positioned on a circuit board. The gripper is produced by a pressing...
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7073255 |
Method for producing ribbon cable using flash curing
A method of manufacturing a ribbon cable, comprising providing a set of insulated wires and aligning said insulated wires in a predetermined arrangement. The insulated wires are warmed sufficiently...
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7069653 |
Method for electrically connecting a semiconductor component to an electrical subassembly
A method of establishing an electric connection between electric terminals of a semiconductor component as part of an electric module and additional parts of the electric module by using a punched...
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7069646 |
Techniques for reducing the number of layers in a multilayer signal routing device
Techniques for reducing the number of layers in a multilayer signal routing device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method wherein the...
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7069647 |
Method for populating a substrate with electronic components
A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer...
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7069638 |
Air socket for testing integrated circuits
An electrical component testing device comprising a housing having at least one recess covered by a flexible membrane so as to form a chamber. A fluid passage extends through a portion of the...
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7065870 |
Segmented contactor
A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted...
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7062849 |
Method for producing circuitry using molten metal droplets
A method for producing a circuitry includes steps of providing first coordinate data of at least one of positions, shapes and intervals of patterns of a first circuit, and jetting droplets of...
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7062848 |
Printable compositions having anisometric nanostructures for use in printed electronics
Compositions and methods for production of conductive paths can include a printable composition including a liquid carrier and a plurality of nanostructures. The plurality of nanostructures can...
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7059046 |
Method for producing a captive wired test fixture and fixture therefor
A method for wiring a test fixture comprised of two parallel fixture plates wherein the wires are wired randomly from locations on one plate to locations on a second plate using a system of...
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7059038 |
Brush assembly
A brush assembly has a base with a member to secure the base to a motor end cap assembly. A brush housing is associated with the base. The brush housing includes first and second open ends. A...
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7059041 |
Methods for producing passive components on a semiconductor substrate
Methods are specified for producing passive components on a substrate, which methods permit, with a low outlay and a good yield, the production of different components, in particular...
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7055241 |
Method of fabricating an integrated circuit package
A method of forming a semiconductor package is provided. The method includes forming a leadframe wherein the conductors or leads of the leadframe extend from a first end to a second end such that a...
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7051419 |
Neurostimulating lead
A neurostimulating lead is provided for use in stimulating the spinal chord, spinal nerves, or peripheral nerves or for use in deep brain stimulation that comprises an elongated, flexible lead...
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7051429 |
Method for forming a medium having data storage and communication capabilities
A method for forming a medium having a substrate is formed have a patterned surface with a channel pattern and a transponder having a memory is provided in the channel pattern. A conductive...
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7051434 |
Designing a ball assignment for a ball grid array package
A method for designing a routing pattern for electrical contacts on a printed circuit board by arranging contacts in an array of rows and columns on the printed circuit board, connecting groups of...
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7051433 |
Multilayer circuit board
A technique for eliminating electrically conductive vias is disclosed. In one embodiment, the technique is realized as an improved multilayer circuit board for eliminating electrically conductive...
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7051431 |
Component mounting control method
In a mounting system where a chip component is mounted by a small component mounting apparatus on paste solder applied onto a board and the mounting state is inspected by a mounting inspection...
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7047630 |
Method of making circuitized substrate assembly
A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only...
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7047632 |
Method of mounting electronic components
An electronic component mounting apparatus removes an electronic component supplied to a part feeder in face-up status and mounts it to a board. A flip-chip supplied from a first holding table is...
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7047633 |
Method of using pre-applied underfill encapsulant
The invention relates to a method for utilizing one or more B-stageable or pre-formed underfill encapsulant compositions in the application of electronic components, most commonly chip scale...
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7047635 |
Connecting material and connecting method
A connecting material can form a detachable connecting structure. According to the connecting material, a connecting portion between a certain object and another object can be more readily formed,...
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7047627 |
Method for fabricating an implantable apparatus for delivering electrical stimulation from a pulse generator
In one embodiment, a method, for fabricating an implantable apparatus for delivering electrical stimulation from a pulse generator, comprises: providing a plurality of conductors, wherein at least...
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7047634 |
Method of making a multilayer wiring board
A built-in component type multilayer wiring board includes at least one resin layer and at least one frame resin layer. The resin layer includes electronic components buried therein. The frame...
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7043828 |
Tile-based routing method of a multi-layer circuit board
A routing method for routing a plurality of signal traces out of a plurality of corresponding bumper pads in a multi-layer circuit board. The multi-layer circuit board includes at least a first...
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7046870 |
Method of fabricating multi-layered printed circuit board for optical waveguides
Disclosed is a method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal...
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