|
Match
|
Document |
Document Title |
|
|
6515233 |
Method of producing flex circuit with selectively plated gold
Disclosed is a method of producing a flexible circuit board having gold selectively plated on only desired elements of the conductive circuits. These desired elements typically are attachment...
|
|
|
6513234 |
Method of making fiber reinforced utility cable
A method and apparatus for producing a reinforce a conductor of a utility transmission line is provided by selecting an electrical or communication conductor fo a desired utility, selecting a...
|
|
|
6516232 |
Ring electrode with porous member
A lead assembly having a ring electrode is adapted for implant and for connection to a system for monitoring or stimulating cardiac activity. The lead assembly includes a first porous member...
|
|
|
6507995 |
Apparatus for manufacturing a wiring substrate
The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter...
|
|
|
6505401 |
Method of making an implantable medical electrical lead
An implantable medical electrical lead is made by forming a generally radially directed bore extending between each lumen of an elongated lead body having a plurality of internal longitudinally...
|
|
|
6505398 |
Very high pressure miniature sensing and mounting technique
A deign method to eliminate any micro-openings in a very high pressure sensor assembly is provided. The method involves sealing an elongated silicon pressure sensor into a fitting using an alloy...
|
|
|
6505399 |
Method for preparation of shielded cables
An improved cable preparation tool and an accompanying method which, when utilized concurrently, prepare fully shielded cables for termination into connecting devices. A preferred embodiment of the...
|
|
|
6493933 |
Method of making flexible electronic circuitry
Stitchable electrical components have flexible, conductive leads and are encased, at least partially, in sealed packages. Conductive threads, yarns, or fiber bundles are patterned onto a flexible...
|
|
|
6493935 |
Interleaving a bondwire between two bondwires coupled to a same terminal
An integrated circuit device package. A substrate includes a first terminal coupled to the substrate. First and second conductive traces are formed on the substrate and are electrically coupled to...
|
|
|
6490786 |
Circuit assembly and a method for making the same
A method 10 for producing a circuit assembly 30 having a polymeric member 14 upon which conductors, such as conductors 64 , may be easily and selectively interconnected to another circuit...
|
|
|
6490788 |
Method for installing a vehicle window assembly
A method for installing a vehicle window assembly in a vehicle includes selecting a vehicle interior accessory member from the group including a storage system, a lighting system, an instrument...
|
|
|
6485621 |
Cathode
An improvement to a cathode used in an electrorefining or electrowinning of copper. The cathode has a solid copper head bar with a horizontal groove on its undersurface. The upper edge of a...
|
|
|
6481100 |
Wiring board manufacture method, wiring board, and electrical connection box
A method of manufacturing a wiring board comprising the steps of winding an electrical wire around a insulating plate having a number of electrical wire grooves for placing an electrical wire...
|
|
|
6477769 |
Method for assembling a controlled impedance connector
A method for assembling an impedance controlled connector using conventional connector shells and inserts and corresponding connector pins and sockets. Controlled impedance cables are prepared and...
|
|
|
6475722 |
Surface treatments for DNA processing devices
The present invention discloses methodologies for the treatment of the surface(s) of DNA processing devices so as to greatly reduce DNA adsorption to the surface(s) exposed to the DNA-containing...
|
|
|
6470567 |
Method for covering a wire connection part
The present invention relates to a method of covering a wire using a transport carrier and a heating system. The present invention makes the workability of a transport carrier compatible with the...
|
|
|
6467162 |
Method for mounting devices on a printed circuit board despite misalignment of resist
A printed circuit board includes a first mark 2 formed by a thin conductor, a second mark 3 formed by a resist 8, a land 6 which is partially coated by the resist 8 and a land 7 which...
|
|
|
6463656 |
Laminate and gasket manfold for ink jet delivery systems and similar devices
A system and method for the fabrication of a fluid, gas and/or vacuum flow system ( 10 ) having a laminate gasket manifold ( 14 ) containing a plurality of bi-directional fluid-flow channels ( 22 )...
|
|
|
6463654 |
Scoring tool for removing sheath from electrical cable conductor and method
A scoring tool and method are described which are useful in removing a portion of an outer lead sheath of an electrical cable conductor. The tool includes a substantially C-shaped tool for...
|
|
|
6457234 |
Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond
A self-aligned (i.e., spatially selective) process for fabricating a corrosion-resistant conductive pad on a substrate, and an associated structure that includes an interconnect to allow a terminal...
|
|
|
6457228 |
Method for sealing liquid coolant into module
A module is placed inside a chamber that can be sealed hermetically. The module includes a substrate incorporating a plurality of electronic circuit parts, a frame connected to the substrate so as...
|
|
|
6449840 |
Column grid array for flip-chip devices
A method for providing C4-type bumps which are higher than conventional C4 bumps. A dielectric substrate is copper cladded on both sides. At each prospective bump location, a via is laser ablated...
|
|
|
6449834 |
Electrical conductor coils and methods of making same
Methods of making electrical conductors by twisting a plurality of strands to form a bundle, winding the bundle to form a coil, fusing some of the strands together, optionally drawing the bundle...
|
|
|
6442832 |
Method for coupling a circuit board to a transmission line that includes a heat sensitive dielectric
A preferred method for coupling a transmission line to a circuit board includes the steps of: providing a circuit board with a first side and an opposing second side; dispensing solder upon the...
|
|
|
6438831 |
Method of manufacturing an interconnector
A method of manufacturing an interconnector that is interposed between a pair of terminal plates each having electrodes arranged in a predetermined pattern, for electrically connecting the...
|
|
|
6434816 |
Method of attaching a plug cap to a spark plug
A plug cap and a method for attaching the plug cap which prevents the occurrence of depressions on a spark plug screw thread and in a cylindrical section of the plug cap. The plug cap includes a...
|
|
|
6430810 |
Mechanical scribing methods of forming a patterned metal layer in an electronic device
This invention pertains to methods of forming a patterned metal layer in an electronic device, wherein the metal layer is in contact with an underlying organic polymeric layer (e.g., a conductive...
|
|
|
6418980 |
Method for filling gas-insulated electric current transmission lines with gas and process for manufacturing lines which incorporates such a filling method
A method for filling a gas-insulated electric current transmission line with gas using an insulating gas mixture, which line comprises an outer tubular sheath, at least one conductor internal to...
|
|
|
6415505 |
Micromachine package fabrication method
Micromachine chips are tested for validity while the micromachine chips are still in wafer form. Any defective micromachine chips are marked or otherwise identified. Coupons are attached to the...
|
|
|
6408506 |
Electrical enclosure having improved sealing and shielding component and method of manufacture thereof
An electrical enclosure having an improved sealing and shielding component and a method of manufacturing such an enclosure is provided. In accordance with an embodiment of the invention, a wire...
|
|
|
6408511 |
Method of creating an enhanced BGA attachment in a low-temperature co-fired ceramic (LTCC) substrate
A method for providing an enhanced ball grid array attachment in low-temperature co-fired ceramic (LTCC) substrate is provided. A termination cup is formed in a substrate. The termination cup has a...
|
|
|
6410360 |
Laminate-based apparatus and method of fabrication
The present invention discloses a laminate-based electromechanical device and a method of fabricating laminate-based electromechanical devices. The device includes two or more layers of laminate...
|
|
|
6405429 |
Microbeam assembly and associated method for integrated circuit interconnection to substrates
A microbeam interconnection method is provided to connect integrated circuit bond pads to substrate contacts. Conductive leads (microbeams) are releasably formed, by a process such as...
|
|
|
6397460 |
Electrical connector
In a socket used to house semiconductor die during testing, a recessed socket contact is provided that avoids pinching the die's contacts. Also provided are socket contacts that allow for smaller...
|
|
|
6397458 |
Method of making an electret article by transferring fluorine to the article from a gaseous phase
An electret is described that includes a surface modified polymeric article having surface fluorination produced by fluorinating the polymeric article.
|
|
|
6389685 |
Method for current sharing in a superconducting current lead
A current lead including a high-temperature superconductor and a normal conductive component is coupled to a superconducting device. Electric current is delivered through the current lead at a...
|
|
|
6389690 |
Method of coating printed circuit board
A conformal coating and method for applying same to a printed electrical circuit board, components and leads for providing corrosion resistance. In a preferred embodiment, the conformal coating...
|
|
|
6389687 |
Method of fabricating image sensor packages in an array
Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding...
|
|
|
6389686 |
Process for fabricating a thin multi-layer circuit board
A process for fabricating thin multi-layer circuit boards. A substrate is disposed over a heat-accumulating block adjacent thereto so that it is uniformly heated from the back side thereof during...
|
|
|
6392155 |
Flat cable and process for producing the same
A flat cable having a linear portion in at least a part thereof. The linear portion has a plurality of insulated conductors juxtaposed to one another with adjacent insulated conductors being...
|
|
|
6381835 |
Endocardial defibrillation lead with multi-lumen body and axially mounted distal electrode
An implantable endocardial, multi-lumen lead wherein the distal end of the lead body is cored to provide a stopped bore co-axial with the axis of the lead body. A distal electrode is inserted into...
|
|
|
6378198 |
Circuit-substrate-related-operation performing system
A system for performing an operation for a circuit substrate, including a plurality of main conveyors each of which conveys, positions, and supports a circuit substrate, the plurality of main...
|
|
|
6374488 |
Method of laser stripping coated cables for endocardial defibrillation leads
An apparatus and method for laser stripping coated cables for endocardial defibrillation leads comprising a jig for holding at least one insulated wire, the jig having a base plate, a linear...
|
|
|
6366820 |
Interconnection technique between a cable conductor and an electrode of an implantable medical device
A method of joining an electrically-conductive elongate member, which may be a multi-strand cable, to an electrically-conductive electrode, possibly for an implantable medical device, requires that...
|
|
|
6360437 |
Electrical contact having surface coating layer with irregular surface due to hard particles dispersed in the surface coating layer
In an electrical contact having a contacting portion to be brought into contact with and electrically connected with a terminal member, the contact comprises a metallic body having a body surface...
|
|
|
6360430 |
Stripping machine
The invention relates to a process and a device for measuring the length of a cable end, in particular in a cable stripping machine or the like, having clamping jaws and axially displaceable knife...
|
|
|
6357110 |
Stud electrical connection method
A stud electrical connection method is provided that employs a stud having a patterned external surface and a nut operably secured to the stud in a radially compressive manner, wherein the...
|
|
|
6357111 |
Inter-electrode connection structure, inter-electrode connection method, semiconductor device, semiconductor mounting method, liquid crystal device, and electronic apparatus
Conductive connection can be effected between electrodes arranged at a minute pitch. When joining an IC chip ( 36 ), which is a semiconductor device, to an external substrate ( 32 a ), conductive...
|
|
|
6349466 |
Ready to wire terminal assembly with vibration resistant clamping screws
A method of preventing vibration loosening of a clamping screw 26 of a circuit protection apparatus 10 is provided. The circuit protection apparatus 10 has a conductor receiving member 28 ...
|
|
|
6351367 |
Electrostatic holding apparatus having insulating layer with enables easy attachment and detachment of semiconductor object
There is disclosed an electrostatic holding apparatus in which a voltage is applied to an conductive electrode covered with an insulating dielectric layer in order to cause the insulating...
|