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6898844 |
Method for reducing multiline effects on a printed circuit board
A method is provided for designing a printed circuit board. This may include analyzing at least one characteristic of a first plurality of relatively parallel conductive paths on the printed...
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6898850 |
Method of manufacturing circuit board and communication appliance
A method of manufacturing a circuit board by forming a circuit pattern in a short process and capable of performing pattern transfer with stability. The manufacturing method includes a step of...
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6898847 |
Method for producing an electrical connection between a plug element and a printed circuit board
A method is described for producing an electrical connection between a plug element and a printed circuit board. A plug end of the at least one plug element is inserted in an opening extending...
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6895665 |
Method of manufacturing a housing for electronic parts
A method of manufacturing a housing for electronic parts, such as isolators, or the like, with as small non-plated portions as possible, which housing is obtained by separating a housing part from...
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6892438 |
Method of making a bio-probe
A method of producing a bio-probe that begins with the step of providing a tapering core of substantially rigid material. The core is then coated with dielectric material and this dielectric...
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6892451 |
Method of making an interposer sub-assembly in a printed wiring board
The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a...
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6894682 |
Connection structure for connecting between touch panel and external conductor
Improves the connection between a touch panel and an external harness. A first electrode cable ( 11 ) and a third electrode cable ( 13 ) are disposed on a first ITO film ( 20 ) on a glass...
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6894590 |
Apparatus and method to introduce signals into a shielded RF circuit
An interface to a microcircuit formed on a substrate supporting a ground plane. The substrate supports a dielectric structure having gold coated sloped sidewalls electrically connected to the...
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6892453 |
Method for forming an encapsulation device
An improved die edge contacting socket incorporates particles of a thermally conducting material into an elastomeric compression pad disposed in the sealing cap of the socket. The elastomeric...
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6892450 |
Method of mounting light emitting device and method of fabricating image display unit
Light emitting devices formed in an array on a first substrate are transferred to an insulating material, to form a sheet-shaped device substrate. The sheet-shaped device substrate is cut along an...
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6889426 |
Method for manufacturing wired circuit board
A method for manufacturing wired circuit board that enables a wired circuit board of high quality to be manufactured without changing in dimension of the wired circuit board substantially. In this...
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6889433 |
Method of manufacturing printed-circuit board
By filling a predetermined amount of conductive paste into an opening for forming a through hole or a VH formed in a resin insulating layer of a circuit board, and pressurizing the filled...
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6889428 |
Method of manufacturing sheet material and method of manufacturing circuit device using the same
The invention is to form plated films on a conductive foil a thigh precision, and simplify a procedure of forming the plated film. A resin film composed of a thermosetting resin is formed on the...
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6889427 |
Process for disengaging semiconductor die from an adhesive film
An apparatus and method for separating a semiconductor die ( 303 ) from an adhesive tape ( 32 ) are disclosed. The apparatus includes a blade ( 34 ) mechanically coupled to a blade holder ( 36 ),...
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6889432 |
Method of manufacturing double-sided circuit board
A method for manufacturing a double-sided circuit board from a board material having a first electric conductor layer and a first electrically insulating layer, including the steps of: making...
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6883227 |
Method of manufacturing a side stem monopole antenna
Methods of manufacturing an antenna are presented. The antenna is capable of being mounted on a printed circuit board. In accordance with the method, the design dimension of a unitary piece of...
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6882284 |
Electrical apparatuses, methods of forming electrical apparatuses, and termite sensing methods
The invention encompasses an electrical apparatus. Such apparatus includes RFID circuitry on a first substrate, and sensor circuitry on a second substrate. A receiving structure is associated with...
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6880242 |
Method for circuit protection during radiation sterilization
A circuit protection device for protection of sensitive components during high energy radiation sterilization that includes a support substrate and a protective housing. The substrate supports the...
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6880226 |
Method for limiting movement in electrical contactors
A method for restricting travel of a moving contact in a lighting contactor is provided. The lighting contactor includes the moving contact and a contact carrier. The method includes the steps of...
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6880244 |
Circuit board having simultaneously and unitarily formed wiring patterns and protrusions
Method of manufacturing a circuit board and semiconductor device wherein the circuit board has a plurality of wiring patterns and protrusions located on the wiring patterns, the method including...
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6874222 |
Method of manufacturing a central stem monopole antenna
Methods of manufacturing an antenna are presented. The antenna is capable of being mounted on a printed circuit board. In accordance with the method, the design dimension of a unitary piece of...
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6874226 |
Circuit board pallet with improved securement pin
A circuit board pallet with an improved securement pin and component positioning arms is disclosed. The improved pin of the present invention is cylindrical pin with an enlarged head. A countersunk...
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6874227 |
Method for packaging an image sensor
A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form...
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6873145 |
Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card
The invention concerns a method for making a card with tips for testing semiconductor chips with microsphere bond pads. A first adhesive coat is vacuum deposited on a flexible polyimide film,...
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6869813 |
Chip-type LED and process of manufacturing the same
A chip-type LED including a LED element and a tubular vessel accommodating the LED element therein, wherein the vessel has an upper opening and a lower opening, the LED element is positioned...
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6865804 |
Method for integrated EMI shielding
The present embodiments and associated methods provide for an integrated EMI shield for effective shielding not only from emissions perpendicular to the integrated circuit (IC) chip carrier but...
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6863799 |
Combination galvanic anode and wear plate for storage tanks
A method for manufacturing improved cast anodes for corrosion protection in storage tanks calls for integrating a plurality of spaced steel core rods into a sacrificial galvanic anode material...
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6862805 |
Method of making a cochlear electrode array having current-focusing and tissue-treating features
A method of making an implantable electrode array, adapted for insertion into a cochlea, includes the steps of: (a) forming electrode contact pieces made from a precious, biocompatible material...
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6860003 |
I-channel surface-mount connector
In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by...
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6859994 |
Method for manufacturing an inductor
A method for manufacturing an inductor is performed in such a manner that the surface of a metal wire provided with an insulating film thereon is coated with a thermal melting resin. The thickness...
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6860007 |
Method of producing an LED rope light
A method of producing a light-emitting-diode (LED) rope light includes the steps of preparing a plurality of light seats defining a recess therein and a plurality of metal wires having two...
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6859053 |
Probe apparatus manufacturing method thereof and substrate inspecting method using the same
In a probe apparatus comprising an inspecting device, an intermediate substrate and a probe substrate, in which the inspecting device is electrically connected to a proximal end of the intermediate...
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6854177 |
Apparatus for processing wire
An apparatus for processing wire to cut the wire into sections and to expose section wire ends, the wire having an inner core and sheathing about the core, the apparatus including structure for...
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6851185 |
Electrical junction box for a vehicle
An electrical junction box for a vehicle has a casing, and an electrical circuit comprising a fuse connection circuit, a relay connection circuit and a connector connection circuit. The casing has,...
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6849846 |
Precision multiple electrode ion mirror
A method of constructing an ion mirror having an axial axis which includes arranging electrode plate elements in parallel alignment along the axial axis and attaching a rigid structure to all of...
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6848153 |
Method of manufacturing a surface acoustic wave device
A method of manufacture of a surface acoustic wave device which includes a step of applying a photosensitive film resist on a substrate and forming a photosensitive film resist layer over at least...
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6844496 |
WIRE HARNESS MOUNTING METHOD, WIRE HARNESS MOUNTING PORTION STRUCTURE, WIRE HARNESS MOUNTING TYPE VEHICLE COMPONENT, WIRE HARNESS MOUNTING TYPE VEHICLE COMPONENT MODULE, AND METHOD OF ASSEMBLING AND INSPECTING WIRE HARNESS
Disclosed is a wire harness mounting method for mounting a wire harness to a wire harness holding portion provided on a vehicle-mounted component, such as an air conditioning duct, wherein the wire...
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6842975 |
Method and equipment for equipping plug housings with fitted-out cable ends of a cable
An equipping installation introduces fitted-out cable ends into plug housings and is arranged downstream from a fitting-out installation. A contact for the first plug housing is arranged at the...
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6838647 |
Flexible heating element
A surface-heating element for a curved surface and method of producing a heating element is provided. The heating element includes a continuous, planar conductor arranged along a longitudinal axis...
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6836953 |
Method of producing a biometric sensor
In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip...
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6832420 |
Method of manufacturing a thin film capacitor array
An electronic device has a plurality of capacitors in an ultra-small integrated package. The device has a plurality of terminal structures on one terminal side of the package to permit inverted...
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6829498 |
Device for creating a neural interface and method for making same
An implant device for creating a neural interface with the central nervous system having a polyimide-based electrode array is presented along with a method for making the device. The device may be...
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6826420 |
Method of mapping a plug in a mapping catheter
A method of constructing a mapping catheter is described where the catheter has numerous electrodes each associated with a single connection in a plug. The method consists of first arranging a...
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6823584 |
Process for manufacturing a membrane electrode assembly
A process for manufacturing a membrane electrode assembly for an electrochemical cell comprises: feeding a sheet of ion exchange membrane material through a double belt press; feeding at least one...
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6823585 |
Method of selective plating on a substrate
A method and structure to form surface plating metallization on a substrate. Two layers of tape are applied to the surface of the substrate. A first path is cut through both layers of tape exposing...
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6820329 |
Method of manufacturing multi-chip stacking package
The present invention discloses a method of manufacturing a multi-chip stacking package. The characteristic of the invention is that after the alignment of the bumps of at least two chips, welded...
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6820328 |
Method of removing heat from an electronic assemblage
A method removes heat from a densely packed electronic assemblage. Densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for...
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6817091 |
Electronic assembly having solder thermal interface between a die substrate and a heat spreader
An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die...
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6816052 |
Track litz rungs and shorting bar design for urban maglev inductrack and method for making the same
Improved Litz track rungs for urban Maglev Inductrack use are provided using an anneal, stainless steel square tube cut to length. A square packed Litz cable is installed within the square tube and...
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6810584 |
Heat-shrinkable tube, heat-shrinkable sheet, and method of shrinking the same
In a heat-shrinkable tube ( 1 ) having a tubular member which is shrinkable in response to heat and has a cylindrical surface, a thin film is formed on at least a part of the cylindrical surface....
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