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7409761 |
Electronic component mounting apparatus and method of mounting electronic components
In an electronic component mounting process for mounting electronic components ( 6 ) to a substrate, each of the electronic components having an adhesive layer on a surface to be bonded to the...
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7402442 |
Physically highly secure multi-chip assembly
A physically secure processing assembly is provided that includes dies mounted on a substrate so as to sandwich the electrical contacts of the dies between the dies and the substrate. The substrate...
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7395129 |
Method for optimization of an order of component mounting, apparatus using the same, and mounter
An optimizing apparatus for optimizing a mounter equipped with a line gang pickup head which picks up a plurality of components and mounts them on a board. The apparatus includes a nozzle set...
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7392582 |
Socket and/or adapter device, and an apparatus and process for loading a socket and/or adapter device with a corresponding semi-conductor component
The invention refers to a process for loading a socket and/or adapter device with a corresponding semi-conductor component, a socket and/or adapter device, a precision alignment device, as well as...
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7377028 |
Electrical connector insertion and removal tool
A connector insertion and removal tool for an electrical system including a circuit board and at least one electrical connector therefor includes a first portion configured for coupling to a first...
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7373718 |
Test device for a heat dissipating fan
A test device for a heat dissipating fan, which is suitable for testing if the fan wheel is secured to the housing firmly, includes a support post, a transverse slide unit, which is disposed at the...
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7368032 |
RFID label technique
An RFID webstock containing a relatively high pitch-density array of semiconductive chips is provided and joined to a web bearing relatively widely spaced antennas in a continuous process. The RFID...
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7367115 |
Component mounting apparatus
A component mounting apparatus having a work conveyor-positioner unit is arranged on a supporting base to convey and position a substrate in an X direction. Supporting frames extend vertically from...
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7363702 |
Working system for circuit substrate
A working system for a circuit substrate enabling a control of stopping the substrate without inconvenience. A PWB detector 308 held by a Y-axis slide 252 of an XY robot 266 moving a...
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7357288 |
Component connecting apparatus
When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection...
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7356919 |
Component mounting method
A component mounting apparatus has a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a...
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7356918 |
Component mounting method
An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no...
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7353594 |
Component mounting method
When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is...
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7353589 |
Component mounting apparatus
A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units...
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7350289 |
Component feeding head apparatus, for holding a component arrayed
In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an...
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7340827 |
Component mounting apparatus
A component mounting apparatus is proposed, which has a plurality of vacuum pick-up nozzles attached to a mount head so as to revolve about a main shaft, causing one of the vacuum pick-up nozzles...
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7340826 |
Method for producing an electronic device connected to a printed circuit board
A configuration and also a method for the configuration in which, the configuration has at least one electronic device with associated contact connections and at least one printed circuit board...
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7337534 |
SMD chip handling apparatus
The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart...
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7337533 |
Device for mounting component
An object of the present invention is to provide a component mounting apparatus and a component mounting method in which a movement time of a nozzle can be shortened so that production efficiency...
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7337522 |
Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of...
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7331105 |
Method for placing components by means of at least one component placement unit
Provided is a method and system for placing components by means of at least one component placement unit wherein the component placement unit is moved over a distance between a component pickup...
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7331103 |
Magazine, tray component feeding device, and component mounting device
A magazine is provided with two opening portions that enable insertion and extraction of a tray and are approximately orthogonal to each other, and a regulation portion for regulating insertion and...
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7325298 |
Pressure apparatus and chip mounter
A contact member is supported on the support shaft. A force sensor is coupled to the support shaft. A movable member is coupled to the force sensor. The pressure apparatus allows the movable member...
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7316060 |
System for populating a circuit board with semiconductor chips
A system for populating a three dimensional array of semiconductor chips is disclosed. The system facilitates the surface mounting of semiconductor chips with chip carriers to achieve the three...
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7315766 |
Component mounting apparatus and component mounting method
In component mounting for executing a component feed operation and component holding and pickup operation, a recipe for the component holding and pickup operation that is an operational program for...
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7314777 |
Chip packaging systems and methods
An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly...
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7313860 |
Mounting device
A mounting apparatus includes an X-Y table for holding a board onto which components are to be mounted, and drive units for moving a mounting section by which the components are to be mounted, and...
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7308756 |
Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method
An apparatus for manufacturing semiconductor devices having a roughly rectangular parallelepiped box-shape includes an internal insertion space for semiconductor packages, first guide grooves and...
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7305757 |
Die ejector system using linear motor
A die ejector system and method for removing a die from an adhesive surface. The system includes an ejector tool that is operative to move relative to the die whereby to push the die. The ejector...
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7302755 |
Head assembly for a component mounter
Provided is a component mounter having a plurality of revolving nozzle spindles, which can simultaneously pick up and mount two or more electronic components. A head assembly for the component...
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7299540 |
Electronic-component feeding device
Disclosed is an electronic-component mounting apparatus 1 for mounting a plurality of electronic components onto a printed-wiring board 10 , which comprises a component mounting head 4 adapted...
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7299539 |
Apparatus for mounting components on substrate
An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an...
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7296344 |
Apparatus for mounting component
Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or...
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7296343 |
Electronic component mounting apparatus
An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When...
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7293352 |
Origin detection method for component placement head
An origin detection method for a component placement head includes setting an axial origin for each elevation nut section, of the component placement head, by detecting a rotational angle of a...
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7290327 |
Component mounting apparatus employing temperature maintenance of positioning accuracy
A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic...
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7287317 |
Apparatus for mounting semiconductor chips
An apparatus for mounting semiconductor chips with a transport device that transports the substrates in cycles to a bonding station where a semiconductor chip is deposited comprises a receiving...
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7284318 |
Apparatus for mounting semiconductor chips
An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a...
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7281323 |
Method for mounting electronic components
A method for mounting electronic components is provided. The method comprises: rotating at least one rotation housing, and thereby correcting positions of a plurality of nozzle spindles depending...
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7281320 |
Waterproof-seal inserting apparatus
A seal-feeding station includes a seal receiver ( 21 ) for receiving a waterproof seal ( 20 ) fed through a seal feeding tube ( 16 ) and a seal keeper ( 23 ) for keeping the waterproof seal ( 20 )...
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7278209 |
Method for manufacturing heat sink for use in heat sink fan
A method for manufacturing a heat sink for use in a heat sink fan is provided. A heat-sink base portion defining a central axis and a circumferential surface is formed. A plurality of...
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7278204 |
Electric-component holding apparatus
An electric-component holding apparatus including a component holder which holds an electric component and includes an engaging portion, a holder-holding member to which the component holder is...
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7278203 |
Random-period chip transfer apparatus
A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more...
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7278193 |
Device for coupling PCB sheet
A device is provided for coupling (i) a PCB sheet, which includes a first PCB and a space formed after removing a defective PCB from the PCB sheet, with (ii) a replacement second PCB received in...
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7275314 |
Electronic component mounting apparatus and electronic component mounting method
In an electronic component mounting apparatus for taking out a chip 6 from a component supply portion 4 to mount to a board 16 held by a board holding portion 10 , an image of a supply...
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7275312 |
Apparatus for precise alignment of packaging caps on a substrate
The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its...
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7272887 |
Component placement device and method
A component placement device includes at least two component pick and place units, which are connected to a movable frame, and at least two component feeding devices. The component placement device...
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7266887 |
Substrate transportation apparatus, component mounting apparatus and substrate transportation method in component mounting operation
A component-mounted substrate moved to a specified substrate position by a substrate holding-and-moving device is delivered from a top of the substrate holding-and-moving device to a substrate...
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7263890 |
Vacuum clamping detection method and vacuum clamping detector
When suction/release-passage-internal pressure Pin is equal to or less than a suction detection pressure Pj, a suction of a workpiece is detected and a transfer operation is started. As long as the...
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7257887 |
Die holding apparatus for bonding systems
A die holding apparatus to form electrical contacts on individual dies is described. In one embodiment, a semiconductor device holder is used to hold individual dies for processing and...
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