|
Match
|
Document |
Document Title |
|
|
7624497 |
Component recognition apparatus for chip mounter
A component recognition apparatus for a chip mounter includes a head portion having a frame and at least one nozzle portion installed on the frame, the nozzle portion picking up an electronic...
|
|
|
7621039 |
Component mounting apparatus with pivotable transfer mechanism
Provided is a component mounter. The component mounter comprises: a bed; a component supply unit; a conveyor transferring at least one PCB to a specified mounting position; a plurality of head...
|
|
|
7617597 |
Component placing method
A component placing method uses a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the...
|
|
|
7617587 |
Apparatus for supports a printer circuit board substrate
An apparatus is provided for supporting a PCB substrate during printing. The apparatus includes first and second fixing units that cooperate to edge-clamp the substrate. The first fixing unit...
|
|
|
7614144 |
Component mounting apparatus
The present invention is intended to realize a hold posture inspection of a plurality of components sucked by a plurality of nozzle rows provided on a head with a single scanning operation, thereby...
|
|
|
7603767 |
Workpiece picking and placing method
A workpiece holding method and holding system able to shorten the workpiece attachment/detachment time, wherein pressurized air is circulated through a nozzle of an ejector unit of a chuck at all...
|
|
|
7603765 |
Device for inspecting and rotating electronic components
The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which...
|
|
|
7600314 |
Methods for installing a plurality of circuit devices
A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is...
|
|
|
7599757 |
System and methods for automatic generation of component data
A method of manufacturing an electronic circuit including employing a pick & place machine-specific component placement sequence, pick & place machine-specific component data for governing the...
|
|
|
7598593 |
N-type ohmic electrode for n-type group III nitride semiconductor, semiconductor light-emitting device with the electrode, and method for forming n-type ohmic electrode
The present invention provides a constitution of n-type ohmic electrode suitable for n-type group III nitride semiconductor, and a forming method thereof for providing low contact resistivity. The...
|
|
|
7591068 |
Board positioning method
A mounter including at least two mounting stages 109 and 110 where components are mounted onto boards transported from the upstream side in transportation direction of the board 120 and then...
|
|
|
7591066 |
Clamping device for flexible substrate
A clamping device for a flexible substrate is provided. The clamping device includes a carrier board. The carrier board has a fixed positioning assembly and a plurality of movable positioning...
|
|
|
7587814 |
Printed-board supporting apparatus
A printed-board supporting apparatus includes a support pin that is attached to a pin-supporting table. An image of the support surface of the support pin is taken by a mark-image taking device, at...
|
|
|
7581310 |
Electronic component mounting apparatus
The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from...
|
|
|
7578054 |
Linear driving mechanism for electronic component mounting apparatus
In a linear driving mechanism for electronic component mounting apparatus that performs mounting operation for mounting an electronic component on a substrate and linearly drives a transfer beam 8...
|
|
|
7578053 |
Interposer bonding device
An interposer bonding device 3 is intended for bonding an interposer 10 having an interposer-side terminal to a base circuit sheet 20 provided with a base-side terminal. The interposer...
|
|
|
7568281 |
Substrate accommodating tray pallet and substrate transfer system
A substrate accommodating tray pallet has a substrate in a horizontal state, includes openings for inserting substrate removal tools for raising the substrate, and is used for transferring...
|
|
|
7568280 |
Package removal device
A package removal device is for removing a package ( 5 ) from a component band ( 1 ) to expose a carrier band ( 2 ). The package removal device includes a stand ( 10 ), a first scrolling unit...
|
|
|
7562440 |
Component holding tape connecting apparatus
A component-holding-tape connecting apparatus for connecting two component holding tapes through a connecting member, by caulking end portions of the respective two component holding tapes and the...
|
|
|
7559134 |
Pick and place machine with improved component placement inspection
Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include using a position sensitive device that measures the...
|
|
|
7555832 |
Semiconductor chip attachment
A chip carrier member comprises a rotatable chip-receiving element. The rotatable chip-receiving element is rotatable essentially about a point.
|
|
|
7555831 |
Method of validating component feeder exchanges
A method and apparatus for facilitating validation of component feeder exchanges in pick and place machines are provided. A pre-exchange image of a component from a feeder is acquired and compared...
|
|
|
7552529 |
Method for assembling electronic circuits
A device for assembling electronic circuits comprises a placing station ( 7 ) for placing circuit components on a circuit carrier ( 1 ) held at a placing location ( 17 ), a fixing station ( 19 )...
|
|
|
7552527 |
Non-contact interface for pick-and-place machines
In an for controlling a feeder or feeder cart used in a pick-and-place electronics assembly machine, non-physical contact transmitters and receivers transfer data, such as feeder trigger signals,...
|
|
|
7547968 |
Semiconductor device
The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and...
|
|
|
7546678 |
Electronic component mounting apparatus
This invention provides an electronic component mounting apparatus which can detects an electronic component held by a suction nozzle without fail after a mounting operation of electronic...
|
|
|
7542151 |
Method of placing at least one component on at least one substrate as well as such a system
By means of a method, at least one component is placed on at least one substrate. The component is picked-up by at least one placement machine and is placed at a desired position on the substrate....
|
|
|
7536781 |
Method of assembling an application specific integrated circuit (ASIC) assembly with attach hardware
A method of assembling an Application Specific Integrated Circuit (ASIC) assembly with attach hardware includes selecting a thickness of a load washer based on a target load to be applied by said...
|
|
|
7533459 |
Electronic component mounting method and electronic component mounting apparatus
The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional...
|
|
|
7526858 |
Apparatus for making electronic devices
The invention provides a manufacturing apparatus in which inter-substrate transfer of a thin film circuit or a thin film element can automatically be performed. An apparatus for manufacturing...
|
|
|
7516539 |
Apparatus for transplanting multi-board
An apparatus for transplanting a multi-board is provided. This apparatus includes an orientation device, a calibration device, and an image-adjusting device. The orientation device has a first...
|
|
|
7513389 |
Electronic component feeding device and electronic component mounting apparatus with electronic component feeding device
The invention provides an electronic component feeding device which can stably feed electronic components, and an electronic component mounting apparatus having the electronic component feeding...
|
|
|
7513032 |
Method of mounting an electronic part to a substrate
A method of mounting an electronic part to a substrate, comprising: a substrate feed transporting step transporting the substrate 10 supplied to a substrate transport start position to a mounting...
|
|
|
7506434 |
Electronic parts mounting method
An electronic parts mounting apparatus and an electronic parts mounting method for picking up a plurality of electronic parts simultaneously by a transfer head having a plurality of suction nozzles...
|
|
|
7500305 |
Placement system for populating a substrate with electronic components
A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer...
|
|
|
7490652 |
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
A heating and pressurizing apparatus ( 101 ), to which a circuit board ( 70 ) with electronic components ( 8 ) pre-bonded thereto via bonding elements ( 9 ) is carried in, is provided. The heating...
|
|
|
7490399 |
Electronic component mounting apparatus
All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an...
|
|
|
7488619 |
Method and apparatus for manufacturing IC chip packaged device
A film substrate that has antenna circuits formed at a fixed spacing on one surface thereof is transported at a constant speed, and IC chips are moved along the film substrate, and are mounted at...
|
|
|
7487581 |
Method of manufacturing an inverter device
By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of...
|
|
|
7480986 |
Apparatus for feeding components from packaged component band
An apparatus for feeding components from a packaged component band includes a stand defining a platform allowing the packaged component band passing therealong, a first guiding unit installable to...
|
|
|
7480985 |
CPU pickup device
A CPU pickup device for mounting a CPU ( 50 ) to a socket ( 61 ) includes a main body ( 10 ), a suction piece ( 20 ) and a positioning mechanism ( 30 ). The suction piece is attached to the main...
|
|
|
7475472 |
System for assembling a customized printed circuit board
A system and a method are provided for assembling a customized printed circuit board having at least one electrical component. The system includes an input device for allowing a user to input...
|
|
|
7472472 |
Electronic part mounting apparatus
In an electronic part mounting apparatus provided with first, second and third beam members 31, 32 and 33 , all supported by a common Y-axis frame at both ends thereof, holding a chip 6 by...
|
|
|
7463493 |
Module for transferring PCB, apparatus for attaching PCB and liquid crystal display device including PCB
A module for transferring a PCB including a first transfer body that is translatable along a first moving path to transfer a first PCB and a second transfer body that is translatable along a second...
|
|
|
7448129 |
Peel-off plate for an electronic-part delivery system
A peel-off device for an electronic-part delivery system has a front end portion and a recess that is indented inwardly from the front end portion, that is formed through upper and lower surfaces...
|
|
|
7437818 |
Component mounting method
A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position,...
|
|
|
7434307 |
System for information handling system motherboard assembly
An assembly support platform apparatus, system and method assembles a motherboard into an information handling system by coupling simulated electronic connectors of the platform to electronic...
|
|
|
7430798 |
Electronic component attaching tool
An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the...
|
|
|
7426781 |
Placement unit for mounting electric components onto substrates
A placement unit for mounting electric components onto substrates has means for moving perpendicularly to the substrate, a housing, a built-in, rotatable holder for the components, and a rotary...
|
|
|
7415759 |
Method and apparatus for mounting semiconductor chips
A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table,...
|