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7632720 |
Method of manufacturing a semiconductor device
In connection with a memory card of a block molding type there is provided a method able to prevent the occurrence of a chip crack in transfer molding. The method includes a first step wherein a...
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7628948 |
Alternate vent hole sealing method
A method of assembling and sealing a circuit board within a housing includes the steps of placing the circuit board within the housing, filling the space above the circuit board or around the...
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7624501 |
Method of manufacturing multilayer wiring board
First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer...
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7622067 |
Apparatus and method for manufacturing a semiconductor device
An apparatus for manufacturing a semiconductor device includes an upper mold ( 21 ), a lower mold ( 22 ), and a plate ( 30, 130, 230 ) that includes at least one cavity ( 31 ) that receives resin...
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7618573 |
Resin sealing method for electronic part and mold used for the method
An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched between the lower mold and the middle...
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7604765 |
Electronic circuit device and manufacturing method of the same
A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and...
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7595017 |
Method for using a pre-formed film in a transfer molding process for an integrated circuit
A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding...
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7591969 |
Method for making a supporting body for the lock of a motor vehicle, and a supporting body thus obtained
A method for making a supporting body ( 1 ) for the lock of a motor vehicle, including the steps of: forming an intermediate element ( 8 ) made of electrically insulating material provided with...
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7585546 |
Surface passivation and sealing of micro-optics devices for improved performance in harsh environments
Methods and structures for reducing and/or eliminating moisture penetration in an optical package. The optical package may include (1) a layer of inorganic material placed over the points of the...
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7552532 |
Method for hermetically encapsulating a component
A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises...
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7525180 |
Semiconductor mount substrate, semiconductor device and method of manufacturing semiconductor package
Segments formed on a wiring substrate are arranged in a staggered array, and tie bars are provided between the segments.
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7501086 |
Encapsulation method for leadless semiconductor packages
An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice ( 411 ) to die pads in cavities ( 41 - 45, 51 - 55 ) of a leadframe, the cavities arranged...
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7482700 |
Semiconductor device having projection on surface thereof, and method of identifying semiconductor package
A technique of accurately recognizing a semiconductor device and of specifying a package type thereof. By forming, on the package surface, projections having a geometric pattern such as a circle...
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7465368 |
Die molding for flip chip molded matrix array package using UV curable tape
An embodiment of the present invention is a technique to package flip chip molded matrix array package. An ultraviolet (UV) curable tape is laminated on die backside of a strip of array of flip...
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7419629 |
Metal mold for forming, method for the preparation of the metal mold for forming and molded article obtained on forming by the metal mold for forming
A molded article manufactured by a fixed mold used with a forming metal mold for molding synthetic resin includes a base mold, a first forming mold secured to the base mold and having a molding...
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7407608 |
Resin molding equipment and resin molding method
The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section...
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7402270 |
Method and system for integrated circuit packaging
According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die...
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7393489 |
Mold die for molding chip array, molding equipment including the same, and method for molding chip array
Provided are a mold die for molding a chip array, molding equipment including such a mold die and a molding method utilizing such molding equipment. The mold die provides for the selective...
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7381359 |
Method for making filled epoxy resin compositions
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and...
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7364684 |
Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels
A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that...
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7357886 |
Singular molded and co-molded electronic's packaging pre-forms
Molded pre-forms that are used to protect electronic components and assemblies from damage due to vibration, shock and/or thermal exposure. The pre-forms can be singularly molded or co-molded....
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7358599 |
Optical semiconductor device having a lead frame and electronic equipment using same
An optical semiconductor device 1 a includes a lead frame 4 having an aperture 7 , a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7 , a semiconductor...
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7355278 |
Mold die for a semiconductor device
A technology is provided that can seal the opening in a wiring board using a transfer mold insulating resin from the opening. A mold die is used which includes a first die having a recess in a...
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7267791 |
Method for the production of light-guiding LED bodies in two chronologically separate stages
Disclosed is a method for producing light-guiding LED bodies in a mold, using a material that is flowable before becoming definitively solid. Each LED body comprises at least one light-emitting...
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7265453 |
Semiconductor component having dummy segments with trapped corner air
A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped...
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7255610 |
Molded part and electronic device using the same
An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances...
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7250687 |
Systems for degating packaged semiconductor devices with tape substrates
A system for degating a packaged semiconductor device that includes a tape substrate includes a first element and a second element. The first element of the system is positionable adjacent to a...
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7247267 |
Mold and method of molding semiconductor devices
A mold for molding semiconductor devices mounted on a package substrate is provided. The mold comprises a top mold and a bottom mold. The top mold has a top runner, at least a first dummy runner...
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7241414 |
Method and apparatus for molding a semiconductor device
A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to...
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7239933 |
Substrate supports for use with programmable material consolidation apparatus and systems
A programmed material consolidation apparatus includes at least one fabrication site and a material consolidation system associated with the at least one fabrication site. The at least one...
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7205170 |
Method for the production of LED bodies
The invention relates to a method for producing light-conducting LED bodies by injection molding into a mold of a material that is fusible prior to final solidification. Each LED body comprises at...
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7195955 |
Technique for protecting photonic devices in optoelectronic packages with clear overmolding
This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental...
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7178235 |
Method of manufacturing an optoelectronic package
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic...
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7169345 |
Method for integrated circuit packaging
According to one embodiment of the invention, a system for packaging integrated circuits includes a mold tool for packaging integrated circuits. The mold tool includes a first mold plate that...
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7170158 |
Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture
A multi-chip package comprises a double-sided circuit board having first and second surfaces. Each surface has a package area and a peripheral area. Each package area has a chip mounting area on...
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7153462 |
Injection casting system for encapsulating semiconductor devices and method of use
An injection casting system for encapsulating semiconductor products and method of use includes a mold unit having a cavity, a substrate material placed against the cavity, the cavity being filled...
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7144538 |
Method for making a direct chip attach device and structure
A method for forming a direct chip attach device ( 1 ) includes attaching an electronic chip ( 3 ) to a lead frame structure ( 2 ), which includes a flag ( 18 ). Next, conductive studs ( 22 ) are...
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7070659 |
System for filling openings in semiconductor products
Explosive forces are used to fill interconnect material into trenches, via holes and other openings in semiconductor products. The interconnect material may be formed of metal. The metal may be...
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7060216 |
Tire pressure sensors and methods of making the same
The elements of a tire pressure monitoring and transmitting system are encapsulated into a single package. A pressure sensitive device is covered with a flexible gel coat and then inserted into a...
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7005101 |
Virtual gate design for thin packages
The mold for a thin package uses a gate which has a high aspect ratio, about 30 degrees or greater throughout the length of the gate. Additionally, the depth of the gate goes to zero at a point...
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6989121 |
Method for encasing plastic array packages
The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array...
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6989122 |
Techniques for manufacturing flash-free contacts on a semiconductor package
Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has...
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6977055 |
Securing electrical conductors
An elongated electrical cable or flexible circuit board includes an electrically conductive path and an insulating body encompassing and electrically isolating the conductive path, the insulating...
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6971863 |
Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent
A molding apparatus for molding semiconductor devices using a molding compound in which a mold is automatically treated with a mold releasing agent is provided. A lead frame strip in-magazine part...
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6969918 |
System for fabricating semiconductor components using mold cavities having runners configured to minimize venting
A system for fabricating semiconductor components includes mating mold cavity plates having mold cavities configured to mold body segments of the semiconductor components on either side of a...
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6956098 |
High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto
The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has...
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6949296 |
Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto
The substrates of the present invention comprise a polyimide base polymer derived at least in part from non-rigid rod monomers together with optionally rigid rod monomers where the substrates are...
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6939501 |
Methods for labeling semiconductor device components
A stereolithographically fabricated marking for a semiconductor device component, such as a packaged or unpackaged semiconductor device or another substrate. When formed on a semiconductor device...
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6933176 |
Ball grid array package and process for manufacturing same
A ball grid array integrated circuit package is manufactured by mounting a semiconductor die, to a surface of a substrate such that bumps on the semiconductor die are electrically connected to...
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6913950 |
Semiconductor device with chamfered substrate and method of making the same
A semiconductor device includes an insulating substrate, a cutout formed in side surfaces of the substrate, a conductive pad formed on the obverse surface of the substrate, an electrode formed on...
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