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8173056 |
Method of fabricating an entity and corresponding device
A method of fabricating an electronic entity includes the steps of: forming at least part of the entity by hardening a material (28) in a mold, and (26); personalizing the entity while in the mould...
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8163220 |
Method of packaging integrated circuits
The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on...
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8158046 |
Mold apparatus and method
An apparatus and method for producing an article by molding is disclosed. In one embodiment, the apparatus includes a mold with an upper part, a lower part and at least one mold cavity, and has a...
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8119050 |
Method of manufacturing a semiconductor device
Improvement in the yield of a semiconductor device is aimed at. When extruding a molded body with the ejector pin which performs advance-or-retreat movement at the projecting portion which projects...
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8105883 |
Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method
Provided is a method for manufacturing a semiconductor device in which movement of an island in resin sealing is prevented. A molding die includes an upper die and a lower die. The upper and lower...
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8105524 |
Compression molding method for electronic component and compression molding apparatus employed therefor
First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port...
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8092735 |
Method of making a light emitting device having a molded encapsulant
Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a)...
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8062571 |
Resin sealing method in stacked wiring substrate
A resin sealing device includes a lower die, an upper die which is arranged over the lower die, on a lower surface side of which a concave portion is provided, and to a bottom surface peripheral...
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8048358 |
Pop semiconductor device manufacturing method
The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substrate 400 that includes...
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8043545 |
Methods and apparatus to evenly clamp semiconductor substrates
Methods and apparatus to evenly clamp semiconductor substrates in a transfer mold process are disclosed. A disclosed split mold base includes a first plate having a first surface, a second plate...
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8003036 |
Mold for forming a molding member and method of fabricating a molding member using the same
There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral...
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7943072 |
Method for producing a resin molded article
A resin molded article (1) is formed such that a primary molded article (10), collars (40) and a metal flat plate (50) are molded integrally as inserts in a secondary molded portion (30). A rib...
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7883655 |
Molding apparatus for manufacturing a semiconductor device and method using the same
A molding apparatus including an upper half having a substrate mounting plate; and a lower half coupled with the upper half to form a cavity there between, wherein the substrate mounting plate...
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7846780 |
Flip-chip package covered with tape
A manufacturing method of a semiconductor device includes arranging a melted resin on a substrate, arranging a semiconductor chip on the melted resin, pressing the semiconductor chip and flip-chip...
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7842219 |
Mold for forming a molding member and method of fabricating a molding member using the same
There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral...
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7833456 |
Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece are disclosed. A method in accordance with one aspect includes placing a semiconductor workpiece and an...
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7824585 |
Apparatus and method for fabricating semiconductor packages
An apparatus for fabricating semiconductor packages may include a thickness measurer configured to measure the thickness of a printed circuit board (PCB); mold dies, clamped to the top and the...
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7815836 |
Packaging apparatus for optical-electronic semiconductors
A packaging apparatus for optical-semiconductors includes a mold base having a longitudinal receiving space, an encapsulating module attached to the mold base, and a fixing member attached to the...
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7807009 |
Hermetic sealing apparatus and hermetic sealing method using frit
An hermetic sealing apparatus is discussed. The apparatus may include one or more of the following a glass mask disposed on an upper surface of a first substrate, a support member disposed on an...
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7754130 |
Method for manufacturing physical quantity sensor
A method for manufacturing a physical quantity sensor includes the steps of: preparing a lead frame comprising a rectangular frame portion, a plurality of leads protruding out from this rectangular...
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7752747 |
Manufacturing method of electronic component
A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step...
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7748117 |
Method for producing movable contact parts with flat pins and contact parts made using this method
A method for producing electric contact parts includes the following stages: a) stamping a strip of electric conducting parts connected together in the longitudinal direction (X-X) by a continuous...
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7732242 |
Composite board with semiconductor chips and plastic housing composition and method
One aspect is a composite board including semiconductor chips in semiconductor device positions and a plastic housing composition partly embedding the semiconductor chips. A mould is provided for...
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7704801 |
Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device
A resin sealed semiconductor device includes a semiconductor chip having a main surface, a plurality of surface electrodes formed on the main surface of the chip, a plurality of projection...
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7682544 |
Method of fabricating photovoltaic panel
A method of fabricating a photovoltaic panel is disclosed which is formed by arranging a number of granular photovoltaic devices in an array and forming the array into the shape of a panel from a...
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7632720 |
Method of manufacturing a semiconductor device
In connection with a memory card of a block molding type there is provided a method able to prevent the occurrence of a chip crack in transfer molding. The method includes a first step wherein a...
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7628948 |
Alternate vent hole sealing method
A method of assembling and sealing a circuit board within a housing includes the steps of placing the circuit board within the housing, filling the space above the circuit board or around the...
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7624501 |
Method of manufacturing multilayer wiring board
First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer...
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7622067 |
Apparatus and method for manufacturing a semiconductor device
An apparatus for manufacturing a semiconductor device includes an upper mold (21), a lower mold (22), and a plate (30, 130, 230) that includes at least one cavity (31) that receives resin and...
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7618573 |
Resin sealing method for electronic part and mold used for the method
An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched between the lower mold and the middle...
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7604765 |
Electronic circuit device and manufacturing method of the same
A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and...
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7595017 |
Method for using a pre-formed film in a transfer molding process for an integrated circuit
A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding...
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7591969 |
Method for making a supporting body for the lock of a motor vehicle, and a supporting body thus obtained
A method for making a supporting body (1) for the lock of a motor vehicle, including the steps of: forming an intermediate element (8) made of electrically insulating material provided with...
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7585546 |
Surface passivation and sealing of micro-optics devices for improved performance in harsh environments
Methods and structures for reducing and/or eliminating moisture penetration in an optical package. The optical package may include (1) a layer of inorganic material placed over the points of the...
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7552532 |
Method for hermetically encapsulating a component
A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises...
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7525180 |
Semiconductor mount substrate, semiconductor device and method of manufacturing semiconductor package
Segments formed on a wiring substrate are arranged in a staggered array, and tie bars are provided between the segments.
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7501086 |
Encapsulation method for leadless semiconductor packages
An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a...
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7482700 |
Semiconductor device having projection on surface thereof, and method of identifying semiconductor package
A technique of accurately recognizing a semiconductor device and of specifying a package type thereof. By forming, on the package surface, projections having a geometric pattern such as a circle...
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7465368 |
Die molding for flip chip molded matrix array package using UV curable tape
An embodiment of the present invention is a technique to package flip chip molded matrix array package. An ultraviolet (UV) curable tape is laminated on die backside of a strip of array of flip...
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7419629 |
Metal mold for forming, method for the preparation of the metal mold for forming and molded article obtained on forming by the metal mold for forming
A molded article manufactured by a fixed mold used with a forming metal mold for molding synthetic resin includes a base mold, a first forming mold secured to the base mold and having a molding...
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7407608 |
Resin molding equipment and resin molding method
The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section...
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7402270 |
Method and system for integrated circuit packaging
According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die...
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7393489 |
Mold die for molding chip array, molding equipment including the same, and method for molding chip array
Provided are a mold die for molding a chip array, molding equipment including such a mold die and a molding method utilizing such molding equipment. The mold die provides for the selective...
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7381359 |
Method for making filled epoxy resin compositions
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and f...
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7364684 |
Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels
A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that...
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7358599 |
Optical semiconductor device having a lead frame and electronic equipment using same
An optical semiconductor device 1a includes a lead frame 4 having an aperture 7, a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7, a semiconductor optical element 3...
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7357886 |
Singular molded and co-molded electronic's packaging pre-forms
Molded pre-forms that are used to protect electronic components and assemblies from damage due to vibration, shock and/or thermal exposure. The pre-forms can be singularly molded or co-molded....
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7355278 |
Mold die for a semiconductor device
A technology is provided that can seal the opening in a wiring board using a transfer mold insulating resin from the opening. A mold die is used which includes a first die having a recess in a...
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7267791 |
Method for the production of light-guiding LED bodies in two chronologically separate stages
Disclosed is a method for producing light-guiding LED bodies in a mold, using a material that is flowable before becoming definitively solid. Each LED body comprises at least one light-emitting...
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7265453 |
Semiconductor component having dummy segments with trapped corner air
A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped...
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