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Match Document Document Title
7372122 Image sensor chip package and method of fabricating the same  
The present invention relates to an image sensor chip package and a method for fabricating the same. In one embodiment of an image sensor chip package, chip pads on a first surface of an image...
7358599 Optical semiconductor device having a lead frame and electronic equipment using same  
An optical semiconductor device 1 a includes a lead frame 4 having an aperture 7 , a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7 , a semiconductor...
7352070 Polymer encapsulated electrical devices  
Improved encapsulated, overmolded and/or underfilled electrical components having a complete encapsulation, overmolding and/or underfilling with a coefficient of thermal expansion that is uniform...
7327005 Optical semiconductor package with incorporated lens and shielding  
An optical semiconductor module including an optical semiconductor component that has a front face including an optical sensor. Encapsulation, defining a cavity in which the optical component is...
7317235 Wafer level package structure of optical-electronic device and method for making the same  
A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a...
7285439 Method for manufacturing semiconductor device having shielding case, electronic equipment using the semiconductor device, and shielding case attaching method  
A shielding case bank has shielding cases that arranged at a pitch twice as large as a pitch of molded articles in a molded article bank. Two shielding case banks are stacked one on the other with...
7276738 Miniature optical element for wireless bonding in an electronic instrument  
A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the...
7274101 Semiconductor package and method for manufacturing the same  
A semiconductor package includes: a first substrate including: a semiconductor base material having a first side and a second side; a functional element that is provided at the first side of the...
7274094 Leadless packaging for image sensor devices  
A leadless image sensor package and methods for its assembly. In a first embodiment, an image sensor chip is mounted within a bottom-side cavity of a package shell in a flip-chip manner such that...
7273767 Method of manufacturing a cavity package  
A method of making a package for an integrated circuit die. In one embodiment the method comprises providing a semiconductor wafer having a plurality of integrated circuit die formed thereon, each...
7271460 Solid-state image sensing device, manufacturing method and attachment method thereof, imaging apparatus and image read unit for imaging apparatus  
A solid-state image sensing device is provided which saves the effort of removing adhesives from a cover glass and is capable of reading an image without being affected by adhesive residuals. In a...
7271029 Method of forming a package-ready light-sensitive integrated circuit  
A package-ready light-sensitive integrated circuit and process for preparing a light-sensitive semiconductor substrate for packaging that provide for a reduced exposure of a light-sensitive...
7268957 Optical module and optical system  
An optical module has a lens holder into which a lens array with three lenses and a diaphragm, for example, is inserted. The lenses and the diaphragm are oriented by way of the geometrical shape...
7265916 Module for optical devices, and manufacturing method of module for optical devices  
A DSP, which has a through electrode and is stacked to a wiring substrate through an adhesive part, a solid-state image pickup element, which is stacked to the DSP through an adhesive part and has...
7262405 Prefabricated housings for microelectronic imagers  
Microelectronic imagers with prefabricated housings and methods of packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imager can include a microelectronic...
7255496 Package for housing an optoelectronic assembly  
A package for housing an optoelectronic device and an integrated circuit is disclosed. The package includes an insulating base having an upper surface. The optoelectronic device and the integrated...
7255494 Low-profile package for housing an optoelectronic assembly  
A low-profile package for housing an optoelectric device is disclosed. The low-profile package includes an insulating base having an upper surface. The optoelectric device is mounted to the upper...
7253397 Packaged microelectronic imagers and methods of packaging microelectronic imagers  
Microelectronic imagers and methods of packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imager can include a microelectronic die, an image sensor, an...
7253390 Methods for packaging microelectronic imagers  
Microelectronic imagers with prefabricated housings and methods of packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imager can include a microelectronic...
7245834 Optical device for optical semiconductor package and fabrication method  
An optical device includes a stack having a transparent block with a rear face fixed on a front face of an integrated chip support. A front face of the transparent block that is parallel to its...
7244922 Semiconductor device and electronic apparatus  
The semiconductor device has a lead frame, a photo-detection chip and a control IC chip mounted on the lead frame, a first sealing portion that seals the photo-detection chip and the control IC...
7242433 Small-sized image pickup device having a solid-state image pickup element and a lens holder mounted on opposite sides of a transparent substrate  
In a process of producing an image pickup device, a solid-state image pickup element is joined to a transparent substrate, with its light-receiving surface opposed to the transparent substrate, and...
7221051 Semiconductor device, module for optical devices, and manufacturing method of semiconductor device  
An image pickup element and a micro-lens part are formed on the front surface of a semiconductor substrate; through electrodes passing through the semiconductor substrate are formed; protruding...
7221048 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier  
A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a...
7214996 Optical semiconductor housing with transparent chip and method for making same  
Optical semiconductor package and its method of fabrication, which package comprises a semiconductor component ( 6 ), a rear face of which is attached to a front face of a mounting and electrical...
7207729 TO-can having a leadframe  
The present invention relates to a TO-can type encapsulating element for enclosing, either hermetically or non-hermetically, optical-electrical chips with integrated optical element interfaces,...
7205545 Electromagnetic radiation detection device with integrated housing comprising two superposed detectors  
The invention concerns an electromagnetic radiation sensing device with integrated housing including two superimposed sensors. A first sensor detects one first wavelength range, and a second sensor...
7202460 Camera module for compact electronic equipments  
In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding...
7199439 Microelectronic imagers and methods of packaging microelectronic imagers  
Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor,...
7199438 Overmolded optical package  
An optical semiconductor package includes a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical...
7199359 Camera module fabrication method including singulating a substrate  
An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension...
7193331 Semiconductor device and manufacturing process thereof  
One of the aspects of the present invention is to provide a semiconductor device, which includes a circuit board, a first semiconductor chip mounted on the circuit board, a built-in semiconductor...
7192796 Methods and apparatus for packaging integrated circuit devices  
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and...
7183589 Semiconductor device with a resin-sealed optical semiconductor element  
To provide a semiconductor device 10 , which is thin, compact, and excellent in mechanical strength and humidity resistance. Semiconductor device 10 A has a configuration such that in...
7180197 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof  
The present invention provides a semiconductor device having a structure that can be mounted on a wiring substrate, as for the semiconductor device formed over a thin film-thickness substrate, a...
7176473 Shielding leadframe for semiconductors for optical coupling and electronic apparatus including same  
An optical semiconductor element includes a light-emitting element, a light-receiving element that is placed opposite to the light-emitting element, and two lead frames on which the light-emitting...
7173231 Chip scale package structure for an image sensor  
A chip scale package (CSP) structure for an image sensor includes a semi-conductor image sense chip and multiple bonding pads formed on a top face of the semi-conductor image sense chip. A...
7172958 High-frequency wiring structure and method for producing the same  
A high-frequency wiring structure includes a microstrip line having a ground conductor, a dielectric disposed on the ground conductor, and a transmission conductor that is at least partially...
7169645 Methods of fabrication of package assemblies for optically interactive electronic devices  
Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a...
7168161 Manufacturing method of solid-state image sensing device  
In a method of manufacturing a camera module having a CMOS image sensor, a semiconductor chip to serve as a light sensor is mounted on a optical-component-mounting face of a wiring substrate mother...
7166908 Optical device  
An optical device according to the present invention includes a device substrate, a translucent member, an optical element chip and a conductive portion. On a surface of the device substrate, an...
7165897 Optical module  
This optical module includes solder which solders an anode electrode of a PD element for detecting back light emitted from an LD element and wiring patterns, and solder which solders a cathode...
7153042 Optic device  
An optic device includes a base, an optical chip mounted on the base, and a transparent plate. A cylinder mirror in which an imaging optical system is incorporated is fitted on the base of the...
7141884 Module with a built-in semiconductor and method for producing the same  
In a module with a built-in semiconductor, higher densification is achieved by disposing inner vias close to a semiconductor device. A module which has a space ( 107 ) between a first wiring layer...
7141869 Electronic package for image sensor, and the packaging method thereof  
A semiconductor device package and method for its fabrication are provided. The semiconductor device package generally includes at least one semiconductor die and a substrate coupled to the...
7135665 Solid-state image sensing apparatus including a noise suppressing circuit  
A solid-state image sensing apparatus of an aspect of this invention can appropriately correct the black level of a video signal even when a high-luminance state or spotlight exists. The apparatus...
7117587 Method for fabricating a substrate, including a plurality of chip package substrates  
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on...
7115962 Housing for a photoactive semiconductor chip and a method for the production thereof  
In a process for producing a ceramic housing ( 1 ), first of all a ceramic base body ( 4 ) comprising a ceramic base ( 2 ) and side parts ( 3 ) is produced. Then, a metal frame ( 7 ) is placed onto...
7115961 Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices  
Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, a microelectronic imaging device includes a microelectronic die...
7112862 Light emitting and/or detecting device and method of manufacturing the same  
A light emitting and detecting device and a method of manufacturing the same are provided. The method includes forming an insulating layer on a substrate doped with an n-type dopant or a p-type...
Matches 1 - 50 out of 394 1 2 3 4 5 6 7 8 >