Matches 1 - 50 out of 791 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7394028 Flexible circuit substrate for flip-chip-on-flex applications  
A circuit substrate for attachment to an integrated circuit chip comprises an electrical trace, a mounting pad and a dielectric layer. The mounting pad has a first surface, one or more sidewalls...
7385298 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same  
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a...
7385297 Under-bond pad structures for integrated circuit devices  
An under bond pad structure is described for integrated circuit dice are that have active circuits located below at least some of the bond pads. The metallization layers interconnection structures...
7368810 Invertible microfeature device packages  
Invertible microfeature device packages and associated methods for manufacture and use are disclosed. A package in accordance with one embodiment includes a microfeature device having a plurality...
7368375 Electronic component with compliant elevations having electrical contact areas and method for producing it  
An electronic component includes compliant elevations having electrical contact areas for contact-connecting the component to an electronic circuit. The compliant elevations are arranged on a...
7336491 Heat sink  
A heat dissipation device for electrical components includes an outer surface and an inner surface. The outer surface is configured for mounting the electrical components thereon, wherein the...
7307293 Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths  
A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors...
7298042 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument  
A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the...
7291896 Voltage droop suppressing active interposer  
The invention proposes an interposer assembly architecture for noise suppression circuits on the package of a CPU or high power, high frequency VLSI device. In this architecture, charge is stored...
7288729 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same  
A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided...
7285734 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same  
A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided...
7276400 Methods of making microelectronic packages with conductive elastomeric posts  
A method of making a microelectronic assembly includes providing a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; providing a second...
7274098 Chip packaging structure without leadframe  
A chip packaging structure without leadframe includes a bare chip having one surface provided with a plurality of contacts, and an adhesive and a fixing layer sequentially attached to the surface...
7271084 Reinforced solder bump structure and method for forming a reinforced solder bump  
A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at...
7268438 Semiconductor element including a wet prevention film  
A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package...
7268430 Semiconductor device and process for manufacturing the same  
The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic...
7268417 Card-type circuit device  
A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode...
7268304 Microelectronic connection components having bondable wires  
A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate...
7268013 Method of fabricating a semiconductor die package having improved inductance characteristics  
A ball grid array (BGA) package that includes a central cavity for receiving a semiconductor die therein is disclosed. The die rests on a base laminate, the die side of which includes traces...
7262975 Multilayer printed wiring board  
A multilayer printed wiring board 10 includes: a build-up layer 30 that is formed on a core substrate 20 and has a conductor pattern 32 disposed on an upper surface; a low elastic modulus...
7262510 Chip package structure  
A process for fabricating a chip package structure with the following steps is provided. First, a chip having an active surface is provided. A plurality of solder bumps is disposed on the active...
7262498 Assembly with a ring and bonding pads formed of a same material on a substrate  
An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are...
7255571 Temperature dependent semiconductor module connectors  
A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon...
7254889 Interconnection devices  
A spring system arrangement and a related connector are disclosed. The purpose is to allow the use of contact springs, such as coil contact springs, with relatively large size body, to be located...
7247516 Method for fabricating a leadless chip carrier  
Structure and method for fabrication of a leadless chip carrier have been disclosed. A disclosed embodiment comprises a substrate having a top surface for receiving a semiconductor die. The...
7247508 Semiconductor device with intermediate connector  
A semiconductor element and a circuit substrate each having electrodes disposed at narrow pitch are electrically connected with high reliability by conductive paste. A semiconductor device with a...
7242084 Apparatuses and associated methods for improved solder joint reliability  
Apparatuses and associated methods to improve integrated circuit packaging are generally described. More specifically, apparatuses and associated methods to improve solder joint reliability are...
7241641 Attachment of integrated circuit structures and other substrates to substrates with vias  
Vias ( 210, 210 B) are formed in a surface of a substrate. At least portions of contact pads ( 139, 350 ) are located in the vias. Contact pads ( 150, 340 ) of an integrated circuit structure are...
7233061 Interposer for impedance matching  
A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass...
7232707 Method of making a semiconductor chip assembly with an interlocked contact terminal  
A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a pillar etch mask that extends into a trench, mechanically attaching a semiconductor chip to...
7230332 Chip package with embedded component  
A chip package is provided. The chip package includes at least one chip, an interconnection structure, a plurality of second pads and at least one panel-shaped component, wherein the chip includes...
7227249 Three-dimensional stacked semiconductor package with chips on opposite sides of lead  
A three-dimensional stacked semiconductor package includes first and second chips, first and second adhesives, first and second wire bonds, a lead and an encapsulant. The chips are disposed on...
7225538 Resilient contact structures formed and then attached to a substrate  
Contact structures exhibiting resilience or compliance are formed. The contact structures may be formed on a sacrificial substrate. The contact structures are attached to an array of electrical...
7224076 Electronic component package  
An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each...
7221048 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier  
A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a...
7217999 Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board  
In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the...
7215030 Lead-free semiconductor package  
A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1...
7215026 Semiconductor module and method of forming a semiconductor module  
In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the...
7214561 Packaging assembly and method of assembling the same  
A packaging assembly includes a substrate; chip-site lands disposed on the first surface; first solder balls connected to the chip-site lands; second solder balls connected to the first solder...
7211888 Encapsulation of pin solder for maintaining accuracy in pin position  
Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.
7211883 Semiconductor chip package  
A semiconductor chip package is formed by a first semiconductor chip and a second semiconductor chip, which have electrodes for wiring at surfaces thereof, being integrated and mounted in a state...
7208835 Integrated circuit package and assembly thereof  
An integrated circuit (IC) package and IC assembly. The IC assembly comprises the IC package, an insulating substrate and an adhesive film. The IC package comprises a chip body and a plurality of...
7208824 Land grid array module  
Disclosed is a land grid array module comprising: a substrate; a plurality of active and passive components mounted on both sides of the substrate; and a molding compound for encapsulating the both...
7205645 Wiring board, semiconductor device, and method of manufacturing wiring board  
A wiring substrate ( 1 ) comprises an insulating base ( 10 ) with connection holes ( 11 ), buried conductors ( 12 ) provided in the connection holes ( 11 ) without reaching a rear surface of the...
7202677 Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component  
Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor...
7193305 Memory card ESC substrate insert  
A memory card comprising a leadframe having a die pad, and an insert having a plurality of contacts. Attached to the die pad is a semiconductor die which is electrically connected to the contacts...
7190080 Semiconductor chip assembly with embedded metal pillar  
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a pillar, a connection joint that electrically...
7190073 Circuit film with bump, film package using the same, and related fabrication methods  
A circuit film having film bumps is provided for a film package. An IC chip is mechanically joined and electrically coupled to the circuit film through the film bumps instead of conventional chip...
7190065 Circuit substrate, semiconductor module and method of manufacturing circuit substrate  
To enhance bonding accuracy to a lead electrode, while coping with narrowing pitch of the lead electrodes, a lead electrode, whose bonding surface is sharpened, is provided to a film substrate, and...
7187072 Fabrication process of semiconductor package and semiconductor package  
A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern....
Matches 1 - 50 out of 791 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >