Matches 501 - 550 out of 817 < 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 >
Match Document Document Title
6042712 Apparatus for controlling plating over a face of a substrate  
According to one aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a substrate holder, and a temperature control device. The substrate...
6042391 High density electrical connectors  
A self-aligning, flexible high density and impedance adjusted electrical connectors for use in microelectronic systems for overcoming the problem of having electrical connection and alignment at...
6037667 Socket assembly for use with solder ball  
A socket assembly for removably receiving a solder ball of a chip package and methods for forming the same. The socket assembly is a raised construction formed over a substrate and includes a...
6036836 Process to create metallic stand-offs on an electronic circuit  
A process to create metallic stand-offs or studs on a printed circuit board (PCB). The process allows to obtain studs constituted by three successive layers of metal (Cu1, Cu2 and Cu3 or Ni) of...
6033764 Bumped substrate assembly  
A bumped substrate assembly comprising an alumina substrate a layer of copper on the alumina substrate, and a heterogeneous juncture band between the alumina the copper layer. Copper bumps...
6032356 Wafer-level test and burn-in, and semiconductor process  
Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies...
6031292 Semiconductor device, interposer for semiconductor device  
A substrate 1 of a insulating resin material is provided with a semiconductor chip 2 in the center of the substrate 1 and a lot of fine studs are filled in the substrate 1 around the chip 2. A...
6029344 Composite interconnection element for microelectronic components, and method of making same  
Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by shaping an elongate element...
6028357 Semiconductor device with a solder bump over a pillar form  
In a semiconductor device including a semiconductor device chip mounted on a substrate and a solder bump electrode formed on an electrode film of the substrate, a pillar-form conductive paste is...
6022757 Semiconductor device and manufacturing method  
A semiconductor device with advanced functions and an improved factor of effective mounting area comprises a semiconductor chip on which an IC or the like is formed; a plurality of external...
6020561 Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof  
A printed circuit substrate having solder bumps formed on pad-on-via contacts and pad-off-via contacts. The printed circuit substrate has at least one pad-on-via contact and at least one...
6019274 Semiconductor device and mounting method therefor  
A reflow mounting method and a semiconductor device for efficient manufacture of TCPs superior in reliability by preventing the deformation of leads and ensuring a dependable contact between the...
6012224 Method of forming compliant microelectronic mounting device  
The present invention provides an interconnection scheme having compliant contacts arranged in an array to connect conductive surfaces on a microelectronic device and a supporting substrate, such...
6007349 Flexible contact post and post socket and associated methods therefor  
Flexible connectors having substantially vertical conductive legs allowing the connectors to accommodate deflection in the lateral directions (x-y directions in the plane of the connectors) induced...
6005289 Package for semiconductor device laminated printed circuit boards  
The minimum spacing between wires disposed on a printed circuit board of a printed circuit board ball grid array package is reduced. Wiring layers are narrower than in the prior art because they...
6001723 Application of wire bond loop as integrated circuit package component interconnect  
A method of forming an interconnection contact for integrated circuit package components includes providing an integrated circuit package component having a contact pad on which the interconnecting...
5998864 Stacking semiconductor devices, particularly memory chips  
High density packaging of semiconductor devices on an interconnection substrate is achieved by stacking bare semiconductor devices atop one another so that an edge portion of a semiconductor device...
5998861 Semiconductor device having ball grid array  
An LSI chip has first electrodes. A chip carrier has a board, second electrodes arranged on a first surface of the board, third electrodes arranged on a second surface of the board, and wires...
5998228 Method of testing semiconductor  
Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies...
5994781 Semiconductor chip package with dual layer terminal and lead structure  
An assembly for packaging a microchip has a dielectric element including a top dielectric layer having a bottom surface. Traces extend at the bottom surface to connect terminals of the dielectric...
5989936 Microelectronic assembly fabrication with terminal formation from a conductive layer  
A structure including a conductive, preferably metallic conductive layer is provided with leads on a bottom surface. The leads have fixed ends permanently attached to the structure and free ends...
5984692 Board stacking connector chip and tape cartridge containing the chip  
A board stacking connector chip, which is interposed between opposed first and second printed boards, for stacking both the printed boards, comprises an upper joint portion joined to a connection...
5983493 Method of temporarily, then permanently, connecting to a semiconductor device  
Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies...
5983492 Low profile socket for microelectronic components and method for making the same  
A connector for microelectronic elements includes electrically conductive, elongated leads having contact portions underlying a compliant layer. The contact portion of each lead overlies a pedestal...
5977642 Dendrite interconnect for planarization and method for producing same  
A method is provided for connecting two conductive surfaces in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive surface, applying a...
5976912 Fabrication process of semiconductor package and semiconductor package  
A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern....
5974662 Method of planarizing tips of probe elements of a probe card assembly  
A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or...
5973397 Semiconductor device and fabrication method which advantageously combine wire bonding and tab techniques to increase integrated circuit I/O pad density  
A semiconductor device and fabrication method are presented which advantageously combine TAB and wire bonding techniques to increase integrated circuit I/O pad density. The semiconductor device...
5969417 Chip package device mountable on a mother board in whichever of facedown and wire bonding manners  
A chip package device comprises on its outside surface a plurality of wire bonding electrodes adjacent a plurality of facedown electrodes. The chip package device comprises an IC chip having a...
5965944 Printed circuit boards for mounting a semiconductor integrated circuit die  
The present invention provides printed circuit boards for mounting to a semiconductor integrated circuit die. In one embodiment the printed circuit boards comprise a rigid dielectric substrate...
5959355 Semiconductor package having mechanically and electrically bonded supportive elements  
A semiconductor package having an array of solder pads and supportive elements that are mechanically and electrically bonded to the solder pads and that do not collapse during the bonding process,...
5952716 Pin attach structure for an electronic package  
A pinning process including the steps of gold-plating through-holes in a laminate carrier and crimping a gold or gold-plated pin located in the through-holes to form a pin head on the top and a pin...
5950069 Quencher clamping operation using an electromagnet  
A method of embedding a magnetically attractable member (25) in a ceramic material (1) and a system therefor wherein there are provided a magnetically attractable member and a ceramic member...
5946195 Semiconductor device, method of making the same and mounting the same, circuit board and flexible substrate  
A semiconductor device includes a semiconductor element, an insulating film and a wiring pattern. The insulating film has a first opening and a plurality of second openings. At least part of the...
5944537 Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices  
A photolithographically patterned spring contact is formed on a substrate and electrically connects contact pads on two devices. The spring contact also compensates for thermal and mechanical...
5939786 Uniform plating of dendrites  
The present invention provides uniform dendrites, on circuit features instead of large, elongated dendrites along the edges of the circuit features. The dendrites are formed by a method comprising...
5938452 Flexible interface structures for electronic devices  
A flexible film interface includes a flexible film; flexible material attached to a portion of the flexible film; surface metallization on the flexible material, the flexible film having at least...
5936845 IC package and IC probe card with organic substrate  
An IC package includes an IC chip substrate having a first surface on which a plurality of electrodes are formed, and an organic substrate having a first surface on which a plurality of bump...
5929521 Projected contact structure for bumped semiconductor device and resulting articles and assemblies  
A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder...
5926951 Method of stacking electronic components  
A method of stacking electronic components is disclosed. A first electronic component having a first interconnection substrate with a first set of contact pads on at least one surface thereof is...
5926731 Method for controlling solder bump shape and stand-off height  
A conductor (112) and method for attaching a surface mount device to the conductor (112), in which solder bumps (16) formed by the method are characterized as being accurately located on the...
5923540 Semiconductor unit having semiconductor device and multilayer substrate, in which grounding conductors surround conductors used for signal and power  
A semiconductor device has an electrical circuit and a grounding terminal. A multilayer substrate has a plurality of insulator layers and conductor layers in a stacked arrangement and a surface...
5923080 Semiconductor apparatus having a leadframe with coated leads  
A semiconductor apparatus having an insulation coating section at an outer section of an outer lead so as to reduce the number of inferior products at the time of bonding a fine pitch outer lead,...
5917707 Flexible contact structure with an electrically conductive shell  
An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The...
5915170 Multiple part compliant interface for packaging of a semiconductor chip and method therefor  
A method of making a multiple part compliant interface for a microelectronic package including the steps of providing a first microelectronic element having electrically conductive parts, providing...
5913109 Fixtures and methods for lead bonding and deformation  
In a method for mounting a sheet-like multi-layer element for producing a microelectronic component, the sheet-like element is first bonded to an expansion ring. The expansion ring is then heated...
5912507 Solderable pad with integral series termination resistor  
A microelectronic assembly, such as a surface-mount device or a ball-grid array (BGA) package, has one or more integral resistors. The integral resistors are incorporated into one or more of the...
5912046 Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component  
A flowable coating material, such as a liquid having solids in suspension, such as spin-on glass, is applied to a surface of an electronic component by placing the component in a centrifuge and...
5909633 Method of manufacturing an electronic component  
Nickel films 22, 25 are formed on copper pads 21, 24 on a substrate 11, and gold layers 23, 26 are further formed on the nickel films 22, 25. To suppress formation of compound of gold and tin which...
5909055 Chip package device mountable on a mother board in whichever of facedown and wire bonding manners  
A chip package device comprises on its outside surface a plurality of wire bonding electrodes adjacent a plurality of facedown electrodes. The chip package device comprises an IC chip having a...
Matches 501 - 550 out of 817 < 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 >