Matches 451 - 500 out of 791 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >
Match Document Document Title
6130476 Semiconductor chip package having chip-to-carrier mechanical/electrical connection formed via solid state diffusion  
A method for joining a semiconductor integrated circuit chip in a flip chip configuration, via solder balls, to solderable metal contact pads, leads or circuit lines on the circuitized surface of...
6126428 Vacuum dispense apparatus for dispensing an encapsulant  
A microelectronic assembly such as an assembly of a semiconductor chip and mounting substrate is encapsulated by applying an encapsulant to the assembly while maintaining the assembly under a...
6114769 Solder paste brick  
A solder paste brick, for attaching a ball grid array device to a circuit board. The solder paste brick is configured as an irregularly shaped structure so as to reduce distances in which volatized...
6111309 Semiconductor device  
A semiconductor device has a semiconductor chip including an external pad, a first substrate supporting the semiconductor chip on the first side, recesses arranged in matrix form on the second...
6110823 Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method  
Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring thw wire into a wire stem having...
6107121 Method of making interconnections between a multi-layer chip stack to a printed circuit board in a ceramic package  
A semiconductor device package and method includes a thick, integrated circuit chip stack having a substantially planar bottom surface with a plurality of terminals. A carrier substrate is...
6105243 Method of fabricating multilayer printed circuit board  
A method for fabricating a multilayer printed circuit board, as well as the resulting multilayer printed circuit board, is disclosed. The multilayer printed circuit board includes a substrate, a...
6104087 Microelectronic assemblies with multiple leads  
A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable...
6104081 Semiconductor device with semiconductor elements formed in a layer of semiconductor material glued on a support wafer  
A method of manufacturing a semiconductor device which starts with a semiconductor wafer (1) which is provided with a layer of semiconductor material (4) lying on an insulating layer (3) at a first...
6100112 Method of manufacturing a tape carrier with bump  
A bump-attached tape carrier for mounting a semiconductor chip on a circuit substrate, the bump-attached tape carrier comprising, an insulating film, a conductor pattern formed on the insulating...
6090261 Method and apparatus for controlling plating over a face of a substrate  
According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the...
6087597 Connecting member and a connecting method with ball and tapered via  
An electronic device assembly (and method for forming the same) including a first substrate having a first surface, a second surface, and a first pad on the first surface thereof; a second...
6080603 Fixtures and methods for lead bonding and deformation  
In a method for mounting a sheet-like microelectronic element, the sheet-like element comprises a dielectric layer having a top surface and a bottom surface and is first bonded to an expansion...
6078103 Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same  
An improved electrical connection between a metal surface and a semiconductor surface is provided by the deposition of a conductive dimple on the metal surface, whereby the conductive dimple is...
6077380 Method of forming an adhesive connection  
Solid spheres of substantially uniform size and shape and coated with a lower temperature melting material are formed for use in interconnect arrays, solder pastes, Z-axis conduction adhesives,...
6072235 Terminal arrangement for an SMD-capable hybrid circuit  
Terminal pins with two lateral portions and a bridge-shaped elevated middle portion are provided. The terminal pin and perpendicularly rising hybrid circuit typically together have an inverted T...
6071801 Method and apparatus for the attachment of particles to a substrate  
A method for populating an substrate (14) with particles (12, 16), comprising the steps of applying an adhesive coating (22) to both surfaces of a substrate (14) and loading the particles (12, 16)...
6060341 Method of making an electronic package  
An electronic package is made by electrically bonding groups of conductive leads to two circuitized members after aligning the leads with electrical conductors on the circuitized members. Retention...
6054652 Thin-film multi-layer substrate and electronic device  
The thin-film multi-layer substrate includes an insulating substrate base plate, and a thin-film structure including a plurality of conducting layers and a plurality of insulating layers formed on...
6049976 Method of mounting free-standing resilient electrical contact structures to electronic components  
A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the...
6049975 Method of forming a thin multichip module  
An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in...
6046410 Interface structures for electronic devices  
An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and...
6046076 Vacuum dispense method for dispensing an encapsulant and machine therefor  
A microelectronic assembly such as an assembly of a semiconductor chip and mounting substrate is encapsulated by applying an encapsulant to the assembly while maintaining the assembly under a...
6043563 Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals  
Spring contact elements are fabricated at areas on an electronic component remote from terminals to which they are electrically connected. For example, the spring contact elements may be mounted to...
6042712 Apparatus for controlling plating over a face of a substrate  
According to one aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a substrate holder, and a temperature control device. The substrate...
6042391 High density electrical connectors  
A self-aligning, flexible high density and impedance adjusted electrical connectors for use in microelectronic systems for overcoming the problem of having electrical connection and alignment at...
6037667 Socket assembly for use with solder ball  
A socket assembly for removably receiving a solder ball of a chip package and methods for forming the same. The socket assembly is a raised construction formed over a substrate and includes a...
6036836 Process to create metallic stand-offs on an electronic circuit  
A process to create metallic stand-offs or studs on a printed circuit board (PCB). The process allows to obtain studs constituted by three successive layers of metal (Cu1, Cu2 and Cu3 or Ni) of...
6033764 Bumped substrate assembly  
A bumped substrate assembly comprising an alumina substrate a layer of copper on the alumina substrate, and a heterogeneous juncture band between the alumina the copper layer. Copper bumps...
6032356 Wafer-level test and burn-in, and semiconductor process  
Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies...
6031292 Semiconductor device, interposer for semiconductor device  
A substrate 1 of a insulating resin material is provided with a semiconductor chip 2 in the center of the substrate 1 and a lot of fine studs are filled in the substrate 1 around the chip 2. A...
6029344 Composite interconnection element for microelectronic components, and method of making same  
Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by shaping an elongate element...
6028357 Semiconductor device with a solder bump over a pillar form  
In a semiconductor device including a semiconductor device chip mounted on a substrate and a solder bump electrode formed on an electrode film of the substrate, a pillar-form conductive paste is...
6022757 Semiconductor device and manufacturing method  
A semiconductor device with advanced functions and an improved factor of effective mounting area comprises a semiconductor chip on which an IC or the like is formed; a plurality of external...
6020561 Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof  
A printed circuit substrate having solder bumps formed on pad-on-via contacts and pad-off-via contacts. The printed circuit substrate has at least one pad-on-via contact and at least one...
6019274 Semiconductor device and mounting method therefor  
A reflow mounting method and a semiconductor device for efficient manufacture of TCPs superior in reliability by preventing the deformation of leads and ensuring a dependable contact between the...
6012224 Method of forming compliant microelectronic mounting device  
The present invention provides an interconnection scheme having compliant contacts arranged in an array to connect conductive surfaces on a microelectronic device and a supporting substrate, such...
6007349 Flexible contact post and post socket and associated methods therefor  
Flexible connectors having substantially vertical conductive legs allowing the connectors to accommodate deflection in the lateral directions (x-y directions in the plane of the connectors) induced...
6005289 Package for semiconductor device laminated printed circuit boards  
The minimum spacing between wires disposed on a printed circuit board of a printed circuit board ball grid array package is reduced. Wiring layers are narrower than in the prior art because they...
6001723 Application of wire bond loop as integrated circuit package component interconnect  
A method of forming an interconnection contact for integrated circuit package components includes providing an integrated circuit package component having a contact pad on which the interconnecting...
5998864 Stacking semiconductor devices, particularly memory chips  
High density packaging of semiconductor devices on an interconnection substrate is achieved by stacking bare semiconductor devices atop one another so that an edge portion of a semiconductor device...
5998861 Semiconductor device having ball grid array  
An LSI chip has first electrodes. A chip carrier has a board, second electrodes arranged on a first surface of the board, third electrodes arranged on a second surface of the board, and wires...
5998228 Method of testing semiconductor  
Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies...
5994781 Semiconductor chip package with dual layer terminal and lead structure  
An assembly for packaging a microchip has a dielectric element including a top dielectric layer having a bottom surface. Traces extend at the bottom surface to connect terminals of the dielectric...
5989936 Microelectronic assembly fabrication with terminal formation from a conductive layer  
A structure including a conductive, preferably metallic conductive layer is provided with leads on a bottom surface. The leads have fixed ends permanently attached to the structure and free ends...
5984692 Board stacking connector chip and tape cartridge containing the chip  
A board stacking connector chip, which is interposed between opposed first and second printed boards, for stacking both the printed boards, comprises an upper joint portion joined to a connection...
5983493 Method of temporarily, then permanently, connecting to a semiconductor device  
Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies...
5983492 Low profile socket for microelectronic components and method for making the same  
A connector for microelectronic elements includes electrically conductive, elongated leads having contact portions underlying a compliant layer. The contact portion of each lead overlies a pedestal...
5977642 Dendrite interconnect for planarization and method for producing same  
A method is provided for connecting two conductive surfaces in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive surface, applying a...
5976912 Fabrication process of semiconductor package and semiconductor package  
A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern....
Matches 451 - 500 out of 791 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >